The demand for micrometric through-holes in glass and silicon carbide (SiC) is growing, particularly in advanced packaging and power electronics. While selective laser etching (SLE) remains the dominant method for through-glass vias (TGVs), environmental concerns and process complexity highlight the need for alternatives. One option is percussion drilling, but it faces challenges such as drilling saturation due to the conical shape of the hole, microcracks, and stress. Recently, GHz burst processing has attempted to address these issues, but some fundamental limitations remained. In this study, we showcase the unexplored potential of repetitive single-pulse femtosecond laser drilling. Using optimized focusing conditions and a femtosecond fiber laser with >200 μJ pulse energy and 250 fs duration, we achieved full penetration of up to 1 mm - thick glass and fast SiC drilling. We also demonstrate a method of multiple-hole drilling speed improvement enabled by an advanced pulse-on-demand laser feature.