Modern ultrashort lasers operating in GHz burst modes have recently emerged as flexible tools for material processing. By adjusting the burst envelope duration, it is possible to precisely control thermal effects, which is critical for glass processing. In this study, we investigated glass removal mechanisms using GHz bursts in two configurations: bottom-up milling (BUM) and top-down milling (TDM). In both cases, a higher number of pulses within each GHz burst led to thermally induced material fracturing, significantly boosting material removal efficiency compared to the single-pulse regime. However, the increased efficiency came at the cost of reduced ablation quality due to the fracturing nature of the process. To overcome this, we leveraged the flexibility of burst envelope duration control, combining high-throughput and high-quality processing modes. As a demonstration, we fabricated a gas injection nozzle using 3D subtractive processing, showcasing the unique capabilities of this GHz burst laser milling approach.

High-quality and efficient cavity milling of tens of microns depth is challenging and highly relevant in industrial applications. In this work, we use an innovative compact femtosecond GHz burst laser (1030nm, 800fs, burst energy >1mJ) for cavity milling of different metals. We perform engravings at different depths (30-100µm), systematically varying the burst parameters (number of pulses and burst frequency) and analyzing the ablation efficiency and quality as the engraving depth increases. We also characterized the morphology of the engraving (e.g. edge recast and bottom cavity roughness) across different laser settings, to ensure an optimal balance between efficiency, quality and depth. Finally, we optimize the post-milling processes, such as polishing and whitening. We demonstrate that by optimizing burst parameters, it is possible to achieve efficient and high-quality milling at various depths. Furthermore, an optimized initial engraving strategy is essential for obtaining high-quality surface finishing, even at the highest depths achieved.

High precision micro-drills with solid Polycrystalline Diamond (PCD) sintered onto Tungsten Carbide (WC) shanks are crucial for machining electronics components. These drills consist of multiple complex geometrical features that are difficult to machine into small shank diameters bits using traditional manufacturing methods. A multi-laser approach, employing two laser systems, a nanosecond water jet guided (WJG) system and a nanosecond galvo scanner-based system, was used to produce the PCD twist micro-drills. This main study focuses on finding the optimised laser and kinematic parameters for WJG laser turning of WC shanks and the nanosecond machining (roughing and finishing) PCD flutes and cutting edges. The study also includes investigating laser-material interaction phenomena to ensure ideal microstructure, geometric, and surface quality of the PCD micro-drills. This multi-laser approach produced micro-drills with improved geometries and sharper cutting edges, which is expected to extend the service life and enhance the machining quality of the PCD micro-drills

The CEA (Commissariat à l'énergie atomique) is a French government-funded research organization that conducts a wide range of research. One of the facilities operated by the CEA is the Laser Mégajoule (LMJ), which is used for high power laser experiments. These experiments are used to study various physics phenomena, including fusion reactions, which require small plastic capsules filled with high-pressure deuterium. The CEA is responsible for designing, studying, and manufacturing these targets for the experiments.

This talk explores the development of a drilling process using a Ti:Sa femtosecond laser. Various procedures and optical configurations have been tested to create accurate and reproducible conical hole shapes. A robust and versatile process has been established, resulting in outer diameters ranging from 8 µm to 38 µm and inner diameters from 6 µm to 18 µm, through capsule walls as thin as 100 µm.

This study investigates the use of femtosecond laser processing to optimize cutting tools, specifically a V-shaped point tools made from ultra-fine (UF) grain carbide with an 8 mm diameter. The process involves optimizing edge geometry and creating surface textures that enhance lubricant retention. Femtosecond lasers offer high precision, enabling chamfering of cutting edges to improve tool performance, durability, and material removal. Surface texturing reduces friction, improves chip evacuation, and promotes better lubrication. Key applications include drills, end mills for hard materials, and specialized tools used in medical and aerospace fields, benefiting from customized textures and geometries.

In this work, cutting edges are modified with 14 µm and 20 µm chamfers to enhance durability. The cutting edge margin is textured with dimples 1.6 µm-deep and 16.5 µm-diameter to ensure superior lubricant retention and reduce friction during machining. These findings demonstrate the potential of femtosecond laser processing for effective industrial tool optimization.