Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Joint Session with CLEO/Europe: Welding and Cutting
3:30pm - 4:45pm
Session Chair: Prof. Uwe Reisgen, RWTH Aachen University, Germany
Location:Room 2 ICM
3:30pm - 3:45pm
3-dimensional beam shaping for dynamic adjustment of focus position and intensity distribution for laser welding and cutting
Axel Jahn1, Dirk Dittrich1, Stephan Boerner1, Jens Standfuss1, Patrick Herwig1, Claudia Reinlein2
1Fraunhofer Institute for Material and Beam Technology IWS, Germany; 2Robust AO GmbH, Germany
Beam shaping, using highly dynamic beam oscillation, offers a high potential for the process control and thus the adaptation to specific process requirements. The realization of beam oscillation in 3 spatial directions opens up new possibilities for specific adjustment of the energy distribution in the melting zone and also creates prerequisites for high dynamic 3D welding and cutting.
A novel 3D optical system will be presented containing galvo-x/y-scanners combined with a new piezo-driven focus modulation (z-modul). This concept enables a synchronous high-frequency axis-control of the 3 spatial directions in a compact optics design.
In the lecture, construction concept and mode of operation of the 3D-system as well as achievable complex 3D energy distributions will be presented. Further, results of process investigations for welding Al alloys and 3D contours are shown and advantages in process stability and joint quality are derived.
3:45pm - 4:00pm
On-the-fly laser beam shaping with acousto-optofluidics
1Department of Applied Physics, Universitat de Barcelona, Spain; 2CHT, Istituto Italiano di Tecnologia, Italy; 3Department of Physics, University of Genoa, Italy
4:00pm - 4:15pm
Ultra-high quality through-transmission micro-welding and cutting of glass with ultrashort pulse lasers
Terence Hollister, Jim Bovatsek
MKS Spectra-Physics, United States of America
In recent years, glass has seen a renaissance of sorts, expanding into a wide variety of thicknesses, shapes, compositions and uses. Novel forms of glass are now widely used in microelectronics packaging, mobile device, automotive and bio-medical applications. Technologies to process glass have evolved as well, with ultrashort pulse (USP) laser technology becoming an important capability. Ultrashort pulse widths offer precision processing with controlled heat input that can minimize or even eliminate chipping and cracking. Combined with Bessel beam optics, high quality cutting of ultrathin glass (UTG) down to 100 µm thick can be realized. Operating at high pulse repetition frequencies, controlled thermal phenomena allows micro-welding of glass-to-glass and other materials. In this work, we demonstrate UTG cutting with roughness in the 10s of nm and ~1 m/s throughput as well as glass-glass and glass-aluminum micro-welding, with throughput approaching 500 mm/s and line widths of 10s of µm.