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Session Chair: Antoni Artinov, BAM Federal Institute for Materials Research and Testing, Germany
Location:Room 2 ICM
1:30pm - 1:45pm
Cavitation phenomena in BA-LIFT
Juan José Moreno Labella1,2, Miguel Morales Furió1,2, David Muñoz Martín1,3, Carlos Molpeceres Álvarez1,2
1Centro Láser, Universidad Politécnica de Madrid, Spain; 2Escuela Técnica Superior de Ingenieros Industriales, Universidad Politécnica de Madrid, Spain; 3Escuela Técnica Superior de Ingeniería y Diseño Industrial, Universidad Politécnica de Madrid, Spain
Blister-Actuated Laser-Induced Forward Transfer (BA-LIFT) allows transferring high-resolution voxels or droplets of fluids with a wide range of viscosities. When compared to similar techniques, BA-LIFT stands out in its flexibility in design and the absence of a nozzle that may get clogged. The physics involved in the process is not easy to understand, so image acquisition systems and simulation are the main methods to gain insight into the dynamics of the process. The simulation of the transference process using a Phase-Field Finite-Element Model aids the task of understanding how the transferred material behaves. BA-LIFT long-time secondary effects, such as bulgy shapes and secondary jets, have been simulated including the effects that a mechanically-induced cavitation bubble would induce. An evaluation of its appearance causes has been carried out. Finally, the bubble has been photographed by modifying the setup to avoid optical distortion.
1:45pm - 2:00pm
Laser technologies for the production of microLEDs
Markus Müller, Uwe Wagner, Mandy Gebhardt
3D-Micromac AG, Germany
MicroLEDs have a tremendous potential for future displays. However, there are several technical challenges to overcome prior to widespread deployment of MicroLEDs. One key hurdle is developing a process to release the dies from the sapphire growth wafer. Another is a process to transfer these to the display substrate with micron level precision and reliability. Laser processing offers several opportunities for MicroLED display production, such as Laser Lift-Off (LLO) to separate the finished MicroLEDs from the sapphire growth wafer and Laser Induced Forward Transfer (LIFT) to move the devices from a donor to the substrate. In this presentation, laser-based system solutions for the different manufacturing steps for MicroLEDs, will be presented. Integrated process control and monitoring is used to assure stable and reliable operation to ensure high throughput and low yield losses.
2:00pm - 2:30pm
Invited Talk: Additive Manufacturing of Electronics by LIFT
U.S. Naval Research Laboratory, United States of America
Laser-induced forward transfer (LIFT) techniques have generated significant interest for applications in Additive Manufacturing of Electronics (AME). LIFT enables printing of functional materials ranging from silver nano-inks to working devices such as bare-die semiconductor components over a wide range of surfaces in an additive fashion achieving high transfer throughputs. This technique is a non-mechanical, non-contact direct-write process capable of operating in additive and subtractive modes ideally suited for applications in 3D microscale fabrication and in printed electronics. LIFT techniques are well suited for IoT applications as exemplified by their use in prototyping of hybrid electronics and embedded components. This presentation will provide an overview of the current state-of-the-art through examples of structures and circuits made by LIFT and discuss their role in the development of next generation laser-based techniques for AME.
This work was funded by the Office of Naval Research (ONR) through the Naval Research Laboratory Basic Research Program.