Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
Please note that all times are shown in the time zone of the conference. The current conference time is: 27th Jan 2022, 10:08:22pm CET
Session Chair: Prof. Michael Schmidt, Institute of Photonic Technologies (LPT), Germany
Location:Room 3 ICM
11:15am - 11:45am
Invited Talk: Ultrashort pulsed laser micro processing: Multi-pulse and beam forming strategies for high throughput at high average powers
Beat Neuenschwander, Stefan M. Remund, Markus Gafner, Michalina W. Chaja
Bern University of Applied Sciences, Switzerland
The development of ultrashort pulsed laser systems actually goes far beyond the kW level. But e.g. for metals and single pulses todays standard methods like galvo scanners are not suited for higher average powers and alternative approaches have to be developed. We will get an insight into actual developments using multi-pulse strategies in temporal representation as pulse bursts and in spatial representation as multi-beams or with direct beam forming. A combination of these methods with synchronized scanning or real pulse on demand option could pave the way for using high average powers.
11:45am - 12:00pm
Excimer laser sintering of ceramic thin films for solid state batteries
The geopolitical dependence on limited fossil resources and the increasing number of environmental disasters are enormous challenges for today’s society. An important element to overcome these essential problems is to increase the performance of energy storage systems and the efficiency of energy conversion devices. Promising solutions are solid state batteries and solid oxide fuel cells. Both cell systems demanding high standards on new production technologies. Temperature-sensitive thin film systems make conventional sintering processes impossible. In the underlying investigation, a new highly scalable excimer laser-based sintering process of ceramic thin films is presented. The nanosecond pulses selectively melt surface the powder grains. Due to the 248 nm wavelength of the excimer laser, sintering depths of 3 - 8 µm can be achieved. In the process, the crystalline phase and thus also the electrochemical properties of the material are retained.
12:00pm - 12:15pm
Laser-based 3D-magnetic field sensor formation
Markus Müller, Mandy Gebhardt
3D-Micromac AG, Germany
A world with intelligent electronic devices in every machine and every pocket needs a wide range of sensor technologies. One rapidly growing technology is the sensing of magnetic fields, which can be used in numerous industrial applications. Very sensitive magnetic sensor chips can be realized by using GMR or TMR (Giant or Tunneling magnetoresistance) sensors in a Wheatstone bridge circuit built in a monolithic design.
This presentation gives an overview to selective laser annealing for 3D-magnetic field sensor formation, which provides several advantages over thermal annealing for magnetic sensor manufacturing. Its higher precision enables processing of smaller magnetic device structures, which in turn leads to more devices per wafer. In addition, its ability to set different reference magnetization directions on sensors across a single wafer reduces process steps and simplifies the manufacturing flow, enabling more cost-effective production of integrated monolithic sensor packages.
12:15pm - 12:30pm
Top-hat profile beam to weld polymeric microfluidics chips with ultra-short pulsed laser
Marc Décultot1, Jérôme Patars1, Anne Henrottin1, José Antonio Ramos-de-Campos1, Ivan Gusachenko2, Clément Jacquard2, Guillaume Labroille2, Gwenn Pallier2
1Lasea, Belgium; 2Cailabs, France
The microfluidics field, due to its various possibilities in the study of chemical and biological reactions with only few consumables, is expanding significantly. To follow this growing, we have developed a flexible solution, based on ultra-short pulsed laser technology, to engrave different microfluidic channels on a chip, and to seal them with a complete, hermetical, and resistant welding.
In order to improve the competitiveness of our solution for industrial production purpose, we have focused in particular our work on the improvement of the welding’s speed. Using the Canunda-Pulse solutions from Cailabs for manipulating high-power femtosecond lasers, we have made a complete study on laser welding parameters with a top-hat profile beam. Canunda-Pulse is a fully reflective passive optical module based on the Multi-Plane Light Conversion (MPLC) technology. Thanks to this beam shaper, we have deduced advantages of a top-hat profile beam, compared to a gaussian profile beam.