Conference Agenda
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Agenda Overview |
| 9:00am - 12:00pm |
PDC 1 Location: Hazel »Current and Future Challenges and Solutions in AI & HPC System and Thermal Management« Course Instructor: Dr. Gamal Refai-Ahmed, AMD, USA |
PDC 2 Location: Pine »Advanced Packaging for Chiplets and Heterogeneous Integration« Course Instructor: John H Lau, Unimicron Technology Corporation, USA |
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| 12:00pm - 2:00pm |
Lunch Room: ZAZEN Club & Lounge |
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| 2:00pm - 5:00pm |
PDC 3 Location: Hazel »Warpage Modelling and Validation in Fan-out Wafer/Panel Level Packaging and Assembly Processes« Course Instructors: Olaf Wittler & Saskia Huber, Fraunhofer IZM, Germany |
PDC 4 Location: Pine »Advanced Packaging for MEMS and Sensors« Course Instructor: Horst Theuss, Infineon Technologies AG, Germany |
PDC 5 Location: Alder+Poplar »Practical Model Order Reduction and Linear Superelements in Ansys Mechanical for Multiphysics Applications« Course Instructors: Mike Feuchter & Max Keller, CADFEM, Germany |
| 8:45am - 9:00am |
Opening Location: Cedar-Magnolia-Sycamore Chair: Willem van Driel, TU Delft »Welcome Address« Anna Szerling |
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| 9:00am - 10:00am |
Industrial Keynotes Location: Cedar-Magnolia-Sycamore Chair: Michiel van Soestbergen, NXP Semiconductors Chair: Przemyslaw Gromala, Robert Bosch GmbH »From Reliability Testing to Reliability Thinking« »Glass Packaging and Its Reliability« |
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| 10:00am - 10:15am |
Honorary Award Ceremony Location: Cedar-Magnolia-Sycamore Chair: Sven Rzepka, Fraunhofer ENAS |
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| 10:15am - 10:40am |
Coffee Break |
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| 10:40am - 12:10pm |
S1: Technical Keynotes Location: Cedar-Magnolia-Sycamore Chair: Bart Vandevelde, imec Chair: Véronique Rochus, imec »Reaching Extremes with Additive Manufacturing of Electronics – From Wearable Medical to High-power and High-temperature Devices« |
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| 12:10pm - 1:10pm |
Lunch |
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| 1:10pm - 2:30pm |
S2: Interconnect Degradation Location: Cedar-Magnolia-Sycamore Chair: Jeffrey C. Suhling, Auburn University Chair: Iulia-Eliza Tinca, Infineon Technologies AG Material Property Prediction of Bi-doped SnAgCu Solders under High Strain Rates of Mechanical Shock and Vibration Auburn University, United States of America 1:30pm - 1:50pm Thermomechanical and Microstructural Mechanisms Governing Copper Degradation under High Strain Rate Thermo-mechanical Fatigue 1: Montanuniversität Leoben, Austria; 2: Kompetenzzentrum Automobil- und Industrieelektronik GmbH, Austria 1:50pm - 2:10pm Thermal Shock Simulations of a PCB with Embedded Components and Microvia Based Interconnection: Meso-scale Modeling of the Woven Composite 1: Université de Lorraine, France.; 2: IRT Saint Exupéry, France.; 3: Icam School of Engineering, France.; 4: ELVIA Electronics, France.; 5: Alter Technology France,France. 2:10pm - 2:30pm Secondary Effects Causing Early Solder Fatigue Failure of QFN Components Subjected to Test- and Field Cycling 1: Fraunhofer ENAS, Chemnitz, Germany; 2: Siemens AG, Technology, Berlin, Germany; 3: CWM GmbH, Chemnitz, Germany |
S3: Ultrasound Devices Location: Alder+Poplar Chair: Gabriele Schrag, Technical University of Munich Chair: Marcus Schulz, Berliner Nanotest und Design GmbH High-performance and Scalable DG-SEM Modeling of Large PMUT Arrays for Biomedical Imaging 1: MOX, Dipartimento di Matematica, Politecnico di Milano, Italy.; 2: Department of Civil and Environmental Engineering, Politecnico di Milano, Italy.; 3: STMicroelectronics Agrate, Italy.; 4: Università degli Studi Roma Tre, Italy. 1:30pm - 1:50pm Finite Element Modeling and Experimental Validation of Dual-mode Ultrasonic Haptics on OLED Screens 1: CEA LETI, France; 2: CEA LIST, France 1:50pm - 2:10pm Analytical System-level Model for Optimization of pMUT Based Acoustic Power Delivery for Implants 1: Imec, Leuven, Belgium; 2: KU Leuven, Belgium 2:10pm - 2:30pm Simulating pMUT Array Characteristics for Sonomyographic Hand Gesture Recognition 1: KU Leuven, Belgium; 2: University of Patras, Greece; 3: imec, Belgium |
| 2:30pm - 2:40pm |
Transfer Break |
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| 2:40pm - 3:40pm |
S4: Chiplets & Warpage Location: Cedar-Magnolia-Sycamore Chair: Muyuan Li, ams-OSRAM International GmbH Chair: Vincenzo Vinciguerra, STMicroelectronics Holistic Warpage Evaluation Methodology Across Assembly Flow with Focus on Final Package Integrity in advanced packages like 2.3D-R & 2.3D-BT 1: Intel Corporation, Germany; 2: Intel Corporation,Taiwan 3:00pm - 3:20pm Thermal-mechanical Coupling Simulation of Chiplet 2.5D Packaging Based on Chiplet Distribution and Full Copper Interconnection 1: Southern University of Science and Technology. China; 2: Delft University of Technology, The Netherlands 3:20pm - 3:40pm Thermo-Mechanical Warpage Prediction and Validation of Large Chiplet Packages Imec, Belgium |
S5: Advanced Simulation Methods Location: Alder+Poplar Chair: Alexander Huber, Montanuniversität Leoben Chair: Rene Poelma, Nexperia B.V. Numerical Simulation of a Neuron-Electrode Interface in Python and Ansys 1: Jade University of Applied Sciences, Germany; 2: University of Rostock, Germany 3:00pm - 3:20pm 3D Parametric Simulations of Mass Transport and Mechanical Properties of a Microfluidic Barrier-on-Chip Device Delft University of Technology, The Netherlands 3:20pm - 3:40pm Multiphysics Topology Optimization for MEMS Institute of Microstructure Technology (IMT), Karlsruhe Institute of Technology (KIT), Germany |
| 3:40pm - 4:05pm |
Coffee Break |
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| 4:05pm - 5:25pm |
S6: MEMS Sensors Location: Cedar-Magnolia-Sycamore Chair: Christine Schwarz, Noesis Solutions NV Chair: Stoyan Stoyanov, University of Greenwich Layout-oriented Design of MEMS Acceleration Sensor and Evaluation of Packaging Effects 1: FhI ENAS, Germany; 2: TU Chemnitz, Germany 4:25pm - 4:45pm Design Optimization of a Multi-resonant Folded Beam Piezoelectric Energy Harvester Using an Efficient Two-phase Topology Optimization 1: University of Rostock, Germany; 2: Jade University of Applied Sciences, Germany 4:45pm - 5:05pm Physics-based State-space Model for Self-sensing in Piezoelectric MEMS Microphones 1: Technical University of Munich, Germany; 2: Infineon Technologies AG, Germany 5:05pm - 5:25pm Lab-on-Chip Acoustic Detection Platform: Design, Fabrication and Performance Evaluation 1: Univ. Polytechnique Hauts-de-France, France; 2: NANOMISENE Laboratory, Tunisia; 3: University of Sousse, Tunisia |
S7: Thermal Behavioral Modeling Location: Alder+Poplar Chair: Cadmus Yuan, Feng Chia University Chair: Julia Zündel, AT&S Austria Technologie & Systemtechnik Aktiengesellschaft An ANN-based Digital Twin for PCB Temperature Monitoring: Development and Validation Aptiv Services Poland 4:25pm - 4:45pm A Neural Network-Based Performance Assessment Approach for Heat-Dissipating Microchannels in Packages Guangdong University of Technology, China 4:45pm - 5:05pm Physics-inspired AI Models Trained on Abstract Synthetic Systems for Thermal Propagation Silicon Austria Labs, Austria 5:05pm - 5:25pm Electro-thermal Co-simulation of SiC MOSFET Double-pulse Tests Using a Peak-power-threshold (PPT) Method for Junction-temperature Estimation TU Delft, The Netherlands |
| 5:45pm - 6:45pm |
Bus ride to downtown |
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| 6:45pm - 7:15pm |
Time for a walk in the old town |
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| 7:15pm - 10:15pm |
Conference Dinner |
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| 8:30am - 10:30am |
P: Interactive Poster Session Location: Willow-Walnut-Acacia Chair: Sven Rzepka, Fraunhofer ENAS Applying the Global-local Approach with the Equivalent Structure for Reliability Assessment of the Multilevel Area Array Interconnects Feng Chia University, Taiwan Deep Learning-driven Undamaged-to-damaged Response Translation for Proactive Structural Health Monitoring of Semiconductor Probe Cards 1: Politecnico di Milano, Italy; 2: Technoprobe, Italy Development of Piezoelectric Patterns by Direct 3D Writing Applied to Atomic Layer Deposition University of Bari, Italy Comparative Evaluation Methodology for Full Order and Superelement-containing Finite Element Models for Predicting Solder Joint Fatigue Technische Universität Dresden, Germany Effect of Underfill Cracking and Interfacial Delamination on Reliability of Advanced Electronic Packages 1: University of Maryland, United States of America; 2: Arizona State University, United States of America; 3: Deca Technologies, United States of America Detecting Single Event Transients on a 28-nm SRAM-based FPGA under Neutron Radiation Exposure 1: TU Braunschweig, Germany; 2: Leibniz Universität Hannover, Germany; 3: Bundeswehr Research Institute for Protective Technologies and CBRN Protection (WIS), Germany On Moisture Absorption in Non-hermetic Packages, Finite Element Model Validation through Real-time Characterization STMicroelectronics, Italy Criticality Assessment Methodology of Microvias in Printed Circuit Boards 1: AT&S Austria Technologie & Systemtechnik, Austria; 2: Montanuniversität Leoben, Austria; 3: Polymer Competence Center Leoben GmbH, Austria Asymmetric Warpage: Determination of a Curvature Scale for Warpage Predictions STMicroelectronics, Italy Electromagnetic Finite Element Modeling of PCB-Embedded Toroidal Inductors Featuring Iron-powder Magnetic Cores 1: Université Paris-Saclay, France; 2: Centre national de la recherche scientifique (CNRS), France; 3: Satie Lab, France; 4: Universidad de Zaragoza, Spain; 5: Universite Claude Bernard Lyon 1 Ampére, France; 6: Université Gustave Eiffe, France Integrated Multi-physics Optimisation of MOSFET Power Modules for Reduced Parasitic Inductance and Enhanced Thermal Reliability Noesis Solutions NV, Belgium Additive Manufacturing of Copper and Ceramic for Electronics Cooling and Packaging RISE Research Institutes of Sweden, Sweden Experimental and Numerical Investigations of Mechanical Failure for a Direct Bonded Copper in Power Modules under Assembly Processes National Taiwan University, Taiwan Fabrication and FEM Analysis of Flip-chip Bonded Si Chip with Au Stud Bumps on Si Interposer 1: C2N-UPSACLAY, France; 2: 2Karlsruhe Institute of Technology (KIT), Germany Surrogate Model Development for Transient Thermal Response of Power Devices via Enhanced Integration Neural Network Functionality The University of Osaka, Japan Improving Simulation Efficiency of Chiplet Package Solder Bump Reliability Analysis Using Equivalent Beam Model National Tsing Hua University, Taiwan Design Analysis of Wire Bonding Reliability for Low Profile Quad Flat Package Based on Numerical Methods Realtek Semiconductor Corp. Parametric Assessment of Cu Pillar Microbump Interconnects Co-design for Thermomechanical Reliability University of Maryland, United States of America Transformer-enhanced Metamodels for Optimizing Material, Geometric, and Process Temperature Features in Warpage Control of Package-on-package Assemblies 1: ams OSRAM AG, Austria; 2: Montanuniversität Leoben, Austria; 3: Polymer Competence Centre Leoben (PCCL) GmbH, Austria Optimized Design of a Liquid Precursor Flow-control Sensor System for Semiconductor Deposition Equipment via Heat-transfer Simulation 1: Korea Electronics Technology Institute (KETI), Korea, Republic of (South Korea); 2: YHENS, Korea, Republic of (South Korea) The Metal-Insulator Transition of VO2: A Fresh Look at a Prototypical System Materials Design SARL, France Efficient Space Charge Current Injection in Silicon Implanted Fe-doped Beta-Ga2O3 Crystals Resulting in Extremely Low Thermal Breakdown Field 1: Institute of Microelectronics of Barcelona (IMB-CNM-CSIC), Spain; 2: Materials Center Leoben (MCL), Austria Physics-of-Failure Based Reliability Investigations of Copper Sintered Die Attaches for Wide Band Gap Power Electronics 1: Technische Universität Chemnitz, Germany; 2: Nano-Join GmbH, Berlin, Germany; 3: budatec GmbH,12487 Berlin, Germany; 4: berliner Nanotest und Design GmbH, Germany; 5: Fraunhofer ENAS, Chemnitz, Germany Transformer based SHM of Semiconductor Probe Cards: Unifying Optimal Sensor Placement and Missing Data Imputation for Reliable Online Monitoring 1: Politecnico di Milano, Italy; 2: Technoprobe, Italy Comparison between Linear and Nonlinear Modelling of Viscoelastic Material Behaviour on the Example of Polymer Encapsulation for Advanced Electronic Virtual Design Fraunhofer IKTS, Germany Design and Optimization of MEMS Variable-Area Capacitive Pressure Sensors for Improved Sensitivity and Linearity in Fingertip Tactile Sensing University of the Philippines, Philippines Extending the Advanced Mixed-Mode Bending Method toward Subcritical Interfacial Fracture Characterization under Cyclic Loading 1: Berliner Nanotest und Design GmbH, Germany; 2: TU Chemnitz, Germany Noise-preserving Circuit Synthesis from Vector-fitted Macromodels 1: Infineon Technologies AG, Germany; 2: Technical University of Munich, Germany Rapid and Accurate Estimation of Acoustic Coupling in MUT Devices Using finite Element Modeling imec, Belgium FEM-based Design Guidelines for the Thermal Management of PCBs with Paralleled GaN HEMT Devices 1: University of Naples Federico II, Italy; 2: Gdynia Maritime University, Poland Thermal Analysis of Chiplet Packaging Using an Equivalent Material Modeling Approach National Tsing Hua University, Taiwan Liquid-assisted Contactless Adhesive Bonding: Experimental validation and 2D Multiphysics Simulation 1: Delft University of Technology (TU Delft), Netherlands, ECTM; 2: Delft University of Technology (TU Delft), Netherlands, PME; 3: ITEC Equipment CNN-based Prediction of Thermo-mechanical Properties of PCB and Interposer Conductive Layers with WGAN-augmented Data National Tsing Hua University, Taiwan Raman Spectroscopy for Rapid Assessment of Topography-dependent Oxidation in Copper Foils 1: Materials Center Leoben Forschung GmbH, Austria; 2: AT&S Austrian Technologie & Systemtechnik Aktiengesellschaft Modelling Framework to Capture Differences in Anisotropy Between Primary and Secondary Creep Deformation in Solder Interconnects During Rapid Temperature Excursions 1: University of Maryland, USA; 2: NXP Semiconductors, USA Modeling Electrode and Microchannel Geometry for Detection of Cadmium (Cd), Lead (Pb), and Copper (Cu) in Drinking Water through a Capillary-driven Microfluidic Electrochemical Sensor University of the Philippines Diliman, Philippines Reverse Engineering of QFN Epoxy Mold Compound Properties using Digital Image Correlation 1: Fraunhofer IZM, Germany; 2: Technische Universität Berlin, Germany Thermal Cycling Lifetime of BGA Microcontroller Package and Influence of Assembly on Aluminum Baseplates Infineon Technologies AG, Germany A Multi-Agent System for Automated Lifetime Prediction of Power Devices 1: Delft University of Technology, The Netherlands; 2: Fudan University, China Quantitative, Statistically Robust Characterization of Solder Joint Geometry and Voiding in Commercial BGA Assemblies 1: Department of Materials, Textiles and Chemical Engineering (MaTCh), Ghent University; 2: Centre for X-ray Tomography, Ghent University; 3: European Synchrotron Radiation Facility, 71 Avenue des Martyrs, 38000, Grenoble, France; 4: Siemens Industry Software NV; 5: FlandersMake@UGent-MIRO A SAW-based Platform of AlN Layer on Si for Accelerated Stress Testing of Micro and Nano Structures 1: University of Chemnitz, Germany; 2: Fraunhofer Institute for Electronic Nano Systems ENAS, Germany; 3: National Institute for Research and Development in Microtechnologies (IMT), Romania Design, Structural Characterization, and Superconducting Behavior of Niobium Thin-Film Microstructures for Ion-Trap Quantum Computers: Toward J–B–T Critical Surface Mapping for Cryogenic 3D SiP Integration 1: Chemnitz University of Technology, Germany; 2: TU Chemnitz, Germany; 3: Fraunhofer Institute for Electronic Nano Systems – ENAS, Germany; 4: Centre for Microtechnologies (ZfM) Chemnitz, Germany Failure Analysis of Electronic Packaging using Eddy Current Thermography 1: Berliner Nanotest and Design GmbH, Germany; 2: Chemnitz University of Technology, Germany; 3: Fraunhofer ENAS, Germany |
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| 10:30am - 10:55am |
Coffee Break |
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| 10:55am - 12:25pm |
S8: Mold & interface Materials Location: Cedar-Magnolia-Sycamore Chair: Peter Filipp Fuchs, Polymer Competence Center Leoben GmbH Chair: Karsten Meier, Technische Universität Dresden Development of a Method for Parylene-Based Interface Toughness Characterization under Fatigue Loads for Electronic Packaging Applications 1: TU Chemnitz, Germany; 2: Fraunhofer ENAS, Germany 11:25am - 11:45am Verification of the Mold Material Model Through Simulation Studies At The Product Level 1: Robert Bosch GmbH, Germany; 2: Robert Bosch Kft., Hungary; 3: Fraunhofer ENAS, Germany 11:45am - 12:05pm Impact of Thermal Gap Filler vs. Thermal Gap Pad Materials on the Solder Joint Lifetime of eWLB Packages in Topside Cooling Setups Infineon Technologies AG, Germany 12:05pm - 12:25pm Effect of PFAS Removal on the Underfill and TIM Interface Properties and Performance Auburn University, United States of America |
S9: Machine Learning-based Methods Location: Alder+Poplar Chair: Nikita Ovsiannikov, Technical University of Munich Chair: Steffen Wiese, Universität des Saarlandes A Simple and Thermo-mechanically Robust Multiaxial Force Sensing Scheme Based on Polymer-MEMS and AI-based Signal Post-processing for Smart Skin Technologies 1: TU Chemnitz, Germany; 2: Fraunhofer ENAS, Germany; 3: Centre for micro- and nanotechnologies (ZfM) at TU Chemnitz, Germany; 4: Centre for Materials, Architectures and Integration of Nanomembranes (MAIN), Germany 11:25am - 11:45am Modeling of nonlinear ferroelectric microactuator with Fourier Neural Operator imec, Belgium 11:45am - 12:05pm AVA-Based Surrogate Modeling of Localized Strain in Microvia 1: Austria Technologie & Systemtechnik AG; 2: Montanuniversitaet Leoben; 3: Polymer Competence Center Leoben GmbH; 4: Fraunhofer Institute for Electronic Nano Systems (ENAS) 12:05pm - 12:25pm A Multi-agent Digital Twin Framework for Health Monitoring of SiC MOSFETs in Power Converters Delft University of Technology, Netherlands, The |
| 12:25pm - 1:25pm |
Lunch |
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| 1:25pm - 2:55pm |
S10: Solder Fatigue: Models & Mechanisms Location: Cedar-Magnolia-Sycamore Chair: Rainer Dudek, Fraunhofer ENAS Chair: Pradeep Lall, Auburn University AI Surrogate Model for PBGA Solder Fatigue Assessment Using Progressive Transfer Learning with Multi-fidelity Data Feng Chia University, Taiwan 1:55pm - 2:15pm The Prediction of Solder Joint Geometries through the Characterization of the Micro-wetting Behavior on Component Metallizations – Experiments and Simulations Universität des Saarlandes, Germany 2:15pm - 2:35pm Thermo-elastic-viscoplastic Damage Model for Sn-Ag-Cu Solder 1: TU Berlin, Germany; 2: Auburn University, USA 2:35pm - 2:55pm Numerical analysis of solder-joint stress during the process of encapsulating an entire PCBA 1: Elastic-Simulations GmbH, Germany; 2: Ottronic Regeltechnik Gesellschaft m.b.H., Germany; 3: Polymer Competence Center Leoben GmbH, Germany |
S11: Thermal Experimental Characterization Location: Alder+Poplar Chair: Mike Feuchter, CADFEM Germany GmbH Chair: Miquel Vellvehi, Instituto de Microelectrònica de Barcelona (IMB-CNM) Modified Infrared Thermal Characterization Methodology coupled with Modelling for GaN RF Power Amplifier Transistors in Compact SMD Packages Ampleon B.V. 1:55pm - 2:15pm Evaluation of the Young’s Modulus of Silicon Carbide from Specific Heat Measurements STMicroelectronics, Italy 2:15pm - 2:35pm A New Packaging and Flow Boiling Cooling Concept for HPC Applications Enabling High Thermal and Thermo-mechanical Performance on Organic Substrates 1: BTU Cottbus, Germany; 2: Fraunhofer IZM , Germany; 3: Berliner Nanotest and Design GmbH, Germany; 4: TU Chemnitz, Germany 2:35pm - 2:55pm Measurement of SiC Chip CTE using Digital Image Correlation Dong-Eui University, South Korea |
| 2:55pm - 3:05pm |
Transfer Break |
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| 3:05pm - 4:35pm |
S12: Mission Profiles & RUL Location: Cedar-Magnolia-Sycamore Chair: Leo Svenningsson, RISE Chair: Olaf Wittler, Fraunhofer IZM An Advanced Mission Profile-based Lifetime Assessment in Power Electronics Assembly Using Physics-informed Surrogate Modeling Fraunhofer IISB, Germany 3:35pm - 3:55pm Compact Thermal RC Model of a Multi Die Power Stage with In-Package Sensing for Remaining Useful Life Prediction 1: Delft University of Technology, The Netherlands; 2: Nexperia BV, The Netherlands 3:55pm - 4:15pm Using Fragility Surfaces for Remaining Useful Lifetime Estimations 1: Ansys Germany GmbH, Germany; 2: Robert Bosch GmbH, Germany; 3: Bosch Hungary Kft, Hungary 4:15pm - 4:35pm Efficient Reliability Assessment of Solder Joints in Automotive Applications Using HYPER-SUB 1: CADFEM Germany GmbH, Germany; 2: Fraunhofer Institute for Electronic Nano Systems ENAS; 3: Technische Universität Chemnitz |
S13: Materials Modelling Location: Alder+Poplar Chair: Thomas Krivec, AT&S AG Chair: Bernhard Wunderle, TU Chemnitz The Oxidation Effects of Copper Layer on AMB Substrate in Power Modules: A Multiscale Simulation Study 1: Delft University of Technology, The Netherlands; 2: Boschman Technologies B.V.,The Netherlands 3:35pm - 3:55pm Study on Finite Element Analysis Modeling of Crack Propagation in Hybrid Bonding Structures Based on the Cohesive Zone Method 1: Chinese Academy of Sciences, China; 2: Peking University. China; 3: Beijing Institute of Remote Sensing Equipment, China; 4: National Key Lab of Micro/Nano Fabrication Technology, China; 5: Beijing Advanced Innovation Center for Integrated Circuits, China 3:55pm - 4:15pm Constitutive Model Identification for Aluminium Wires and Potting Resin used in IGBT Power Modules 1: Université Paris-Saclay, France; 2: Mitsubishi Electric R&D Centre Europe, France; 3: Lehigh University, USA 4:15pm - 4:35pm A Defect-Informed Phase-Field Model for Gate Oxide Breakdown in SiC MOS Structures TU Delft, The Netherlands |
| 4:35pm - 5:00pm |
Coffee Break |
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| 5:00pm - 6:10pm |
S14: Advanced Packaging Reliability Location: Cedar-Magnolia-Sycamore Chair: Mike Röllig, Fraunhofer-Institut für Keramische Technologien und Systeme - Institutsteil Materialdiagnostik Chair: Marco Sperti, imec Predicting Redistribution Layer (RDL) Interfacial Strength and Delamination in Fan-out Wafer Level Packaging 1: Arizona State University - Tempe, USA; 2: University of Maryland, USA 5:30pm - 5:50pm Application of Bayesian Optimization to Wire Reliability Prediction in LED Packaging ams-OSRAM International GmbH, Germany 5:50pm - 6:10pm Reliability Assessment of Advanced Fan-Out Packages Under Drop Impact Conditions 1: National Sun Yat-sen University, Taiwan; 2: National Formosa University, Taiwan |
S15: Advanced MEMS Location: Alder+Poplar Chair: Tamara Bechtold, Jade University Chair: Huaiyu Ye, Southern University of Science and Technology Numerical Characterization of Acoustic Fields within Cylindrical Air-coupled Sono-photonic Waveguides 1: Technische Universität Darmstadt, Germany; 2: Deutsches Elektronen-Synchrotron DESY, Germany; 3: Helmholtz Institute Jena, Germany; 4: GSI Helmholtzzentrum für Schwerionenforschung GmbH, Germany 5:30pm - 5:50pm Piezoelectric Contour Mode Resonators for Fast & Power-efficient On-chip Acousto-optic Modulation 1: Infineon Technologies AG, Germany; 2: Technical University of Munich, Germany; 3: Infineon Technologies Austria AG, Austria; 4: ETH Zurich, Switzerland 5:50pm - 6:10pm In Situ Evaluation of an Antifouling Vibrating System for Marine Sensors 1: CEA-Leti, France; 2: MAPIEM, University of Toulon, France; 3: IFREMER, France |
| 6:10pm - 6:40pm |
Sponsor Session Location: Cedar-Magnolia-Sycamore Chair: Martin Niessner, Infineon Technologies AG |
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| 6:40pm - 8:30pm |
Reception at the Venue |
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| 8:30am - 9:50am |
S16: Mirelai Session Location: Cedar-Magnolia-Sycamore Chair: Bart Vandevelde, imec Influence of Low Temperature Swings on Solder Joint Reliability 1: Delft University of Technology (TU Delft), Netherlands, The; 2: NXP Semiconductors 8:45am - 9:00am Machine Learning for Microstructure Characterisation of Intermetallic Layers in BGA Solder Joints 1: University of Greenwich, United Kingdom; 2: Materials Consultancy Services Limited, Midlothian Innovation Centre, Scotland 9:00am - 9:15am Efficient Augmented Kalman Filter Parameter Tuning for Thermal Virtual Sensing in Electronic Systems 1: imec; 2: Siemens Digital Industries Software; 3: KU Leuven; 4: Flanders Make 9:15am - 9:30am Effect of Electroplating-induced Copper Thickness Variations on the Thermomechanical Reliability of Plated Through Holes 1: Siemens Industry Software nv, Belgium; 2: imec, Belgium; 3: KU Leuven, Belgium; 4: Flanders Make@KU Leuven, Belgium 9:30am - 9:45am Physics-informed Neural Network for Multi-scale Thermal Transport in AlGaN/GaN HEMT Heterostructures 1: Technoprobe, Cernusco Lombardone, Italy; 2: Materials Center Leoben Forschung GmbH (MCL), Austria; 3: Department of Civil and Environmental Engineering, Politecnico di Milano, Italy |
S17: Thermal Design Modeling and Experimental Characterization Location: Alder+Poplar Chair: Jiajie Fan, Fudan University Chair: Amir Mirza Gheytaghi, Ampleon Hybrid Zener–NTC Dynamic Circuit for Active Hot-spot Mitigation in Photovoltaic Modules University of Napoli Federico II, Italy 8:50am - 9:10am Influence of Heat Source Size and Location on the Comparative Performance of Vapor Chambers and Copper Heat Spreaders University of Limerick, Ireland 9:10am - 9:30am Advanced 3D Modeling of Reactive Multilayer Systems for Chip- and Wafer-Level Bonding Applications Fraunhofer Institute for Electronic Nano Systems, Germany 9:30am - 9:50am Research on Design Optimization of Temperature and Current Sharing Uniformity of SiC HybridPACK Drive Power Modules Under MultiPhysics Coupling 1: Southern University of Science and Technology, People's Republic of China; 2: Southern University of Science and Technology, China; 3: AccoPower, China; 4: Delft University of Technology, The Netherlands |
| 9:50am - 10:15am |
Coffee Break |
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| 10:15am - 11:15am |
S18: Digital Twins & Model Exchange Location: Cedar-Magnolia-Sycamore Chair: Roseanne Duca, STMicroelectronics Chair: Sjoerd Douwe Medard de Jong, TU Delft Surrogate-Integrated, Simulation-Driven Digital Twin for Thermoset Molding Processes 1: Polymer Competence Center Leoben GmbH (PCCL), Germany; 2: Silicon Austria Labs GmbH (SAL), Austria; 3: GIPRO GmbH, Austria 10:35am - 10:55am Software-agnostic Thermal-mechanical Model Exchange via FMUs for Microelectronics Reliability Simulation NXP Semiconductors, Netherlands, The 10:55am - 11:15am A Minimal-Interface Reduced-Order Modeling Approach for Including Convection Effects in Thermomechanical Field Simulation 1: CADFEM Germany GmbH, Germany; 2: Jade University, Germany |
S19: Material Modeling for Packaging Location: Alder+Poplar Chair: Torsten Hauck, Berlin Institute of Technology / Technische Universität Berlin Chair: Mickaël LEICHT, Université de Lorraine - IRT Saint Exupéry Subcritical Crack Propagation in Solder Resist Materials During Fatigue Bulge Testing in Experiment and Simulation 1: Infineon Technologies AG Munich, Germany; 2: TU Chemnitz, Germany 10:35am - 10:55am Elastic-plastic Temperature and Porosity dependent Material Model for Sinter Silver with Minimal Measurement Effort by using RVE 1: Fraunhofer ENAS, Micro Materials Center; 2: Technical University of Chemnitz, Center for Micro and Nanotechnologies 10:55am - 11:15am Moisture Transport under Power Cycling in Silicone-gel Encapsulated Power Modules SATIE, Gustave Eiffel University, France |
| 11:15am - 11:25am |
Transfer Break |
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| 11:25am - 12:45pm |
S20: PCB Reliability Location: Cedar-Magnolia-Sycamore Chair: Harald Laux, ams OSRAM International GmbH Chair: Harald Ziegelwanger, Elastic-Simulations GmbH Modelling Approach to Assess Localized Strain Effects in Copper Plated Through Holes for Highly Reliable PCBs 1: Fraunhofer IZM, Germany; 2: TU Berlin, Germany 11:45am - 12:05pm Optimizing Multilevel Microvia Structures for Thermo-mechanical Reliability in High-speed HDI PCBs 1: imec, Belgium; 2: ACB, Belgium; 3: ESA-ESTEC, The Netherlands 12:05pm - 12:25pm PCB embedding: A Case Study on MOSFETs and more 1: Nexperia B.V., The Netherlands; 2: Delft Universtiy of Technology, The Netherlands; 3: Schweizer Electronic AG, Germany 12:25pm - 12:45pm A Viscoelastic Effective Model and Characterization Method for Woven Composites and a Homogenization Approach for Applications in Complex PCB Simulations 1: Technische Universität Berlin, Germany; 2: Fraunhofer Institute for Reliability and Microintegration (IZM), Germany |
S21: Multiphysics Simulation for Packaging Location: Alder+Poplar Chair: Georg Michael Reuther, Infineon Technologies AG Chair: Robert Schwerz, Fraunhofer IKTS Investigating the Switching Loss-Reliability Trade-Off in TFP-MOSFET Voltage Regulators through Calibrated SPICE Simulations 1: University of Naples "Federico II", Italy; 2: onsemi, Analog and Mixed-Signal Group, Milan, Italy; 3: onsemi, Central Engineering, Oudenaarde, Belgium; Roznov pod Radhostem, Czech Republic; Sunnyvale, CA, USA; 4: onsemi, Power Solution Group, Hopewell Junction, NY 11:45am - 12:05pm Thermal and electrical simulations of Rad-hard Si VDMOS Transistors 1: CNM CSIC Spain; 2: Power electronics Llíria, Spain 12:05pm - 12:25pm A Fast Multidomain System-level Simulation Model for GaN Transistor Package Optimization Silicon Austria Labs GmbH, Austria 12:25pm - 12:45pm Electromigration Simulation of C4 Solder Bumps with Cu and Ni Under-bump Metallization 1: STATS ChipPAC, Singapore; 2: STATS ChipPAC, USA; 3: STATS ChipPAC, Korea |
| 12:45pm - 1:45pm |
Lunch |
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| 1:45pm - 2:45pm |
S22: IEEE EPS Distinguished Lectures Location: Cedar-Magnolia-Sycamore Chair: Willem van Driel, TU Delft Chair: Michiel van Soestbergen, NXP Semiconductors Artificial Intelligence (AI)-Enabled Reliability Prediction and Prognostics for Electronic Packages: A Perspective on Data, Models, and Applications 1: Lamar University, United States of America; 2: Feng Chia University, Taichung, Taiwan From Chip to AI Factory: A Five-Year Roadmap for Silicon Suppliers and Hyperscalers 1: AMD, USA; 2: Humain, Saudia Arabia; 3: Supermicor, Taiwan |
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| 2:45pm - 3:00pm |
Closing and Awards Location: Cedar-Magnolia-Sycamore Chair: Willem van Driel, TU Delft Chair: Michiel van Soestbergen, NXP Semiconductors |
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