Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Session Overview |
| Date: Sunday, 19/Apr/2026 | ||
| 9:00am - 12:00pm |
Professional Development Course 1 |
Professional Development Course 2 |
| 9:00am - 5:00pm |
Professional Development Course 3 |
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| 2:00pm - 5:00pm |
Professional Development Course 4 |
Professional Development Course 5 |
| Date: Monday, 20/Apr/2026 | ||
| 8:45am - 9:00am |
Opening |
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| 9:00am - 10:30am |
Industrial Keynotes Chair: Michiel van Soestbergen Chair: Willem van Driel |
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| 10:30am - 10:55am |
Coffee Break |
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| 10:55am - 12:25pm |
S1: Technical Keynotes Chair: Bart Vandevelde Chair: Véronique Rochus |
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| 12:25pm - 1:25pm |
Lunch |
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| 1:25pm - 2:45pm |
S2: Interconnect Degradation Subcritical Crack Propagation in Solder Resist Materials During Fatigue Bulge Testing in Experiment and Simulation 1: Infineon Technologies AG Munich, Germany; 2: Technical University of Chemnitz, Germany 1:45pm - 2:05pm Thermomechanical and Microstructural Mechanisms Governing Copper Degradation under High Strain Rate Thermo-mechanical Fatigue 1: Montanuniversität Leoben, Austria; 2: Kompetenzzentrum für Automobil- und Industrieelektronik 2:05pm - 2:25pm Secondary Effects Causing Early Solder Fatigue Failure of QFN Components Subjected to Test- and Field Cycling 1: Fraunhofer ENAS, Chemnitz, Germany; 2: Siemens AG, Technology, Berlin, Germany; 3: CWM GmbH, Chemnitz, Germany 2:25pm - 2:45pm Simulation of Thermal Shock Testing for PCB with embedded components and microvia based interconnection: influence of the residual stresses on the lifetime estimation 1: Université de Lorraine – CNRS – Arts et Métiers ParisTech, Laboratoire d’Etude des Microstructures et de Mécaniques des Matériaux, 7 rue Félix Savart, Metz, 57070, France.; 2: IRT Saint Exupéry, 3 rue Tarfaya, Toulouse, 31400, France.; 3: Icam School of Engineering, Toulouse Campus, 31330 Toulouse, France.; 4: ELVIA Electronics – Avenue d’Ochsenfurt, Coutances, 50211, France.; 5: Alter Technology France, 2 Rue des Satellites, 31520 Ramonville-Saint-Agne, France. |
S3: Ultrasound Devices High-performance and Scalable DG-SEM Modeling of Large PMUT Arrays for Biomedical Imaging 1: MOX, Dipartimento di Matematica, Politecnico di Milano, Piazza Leonardo da Vinci, 20133 Milano, Italy.; 2: Department of Civil and Environmental Engineering, Politecnico di Milano, 20133 Milan, Italy.; 3: STMicroelectronics Agrate, Via Camillo Olivetti 2, Agrate Brianza, 20864, Italy.; 4: Dipartimento di Ingegneria Industriale, Elettronica e Meccanica, Università degli Studi Roma Tre, 00146 Roma, Italy. 1:45pm - 2:05pm A SAW-based Platform of AlN Layer on Si for Accelerated Stress Testing of Micro and Nano Structures 1: Chair of Materials and Reliability of Microsystems, Chemnitz University of Technology, Germany; 2: Fraunhofer Institute for Electronic Nano Systems ENAS; 3: National Institute for Research and Development in Microtechnologies (IMT), Bucharest, Romania 2:05pm - 2:25pm Finite Element Modeling and Experimental Validation of Dual-mode Ultrasonic Haptics on OLED Screens 1: CEA LETI, France; 2: CEA LIST, France 2:25pm - 2:45pm Analytical System-level Model for Optimization of pMUT Based Acoustic Power Delivery for Implants 1: Imec, Leuven, Belgium; 2: KU Leuven, Department of Electrical Engineering (ESAT), Leuven, Belgium |
| 2:45pm - 2:55pm |
Transfer Break |
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| 2:55pm - 3:55pm |
S4: Chiplets & Warpage Holistic Warpage Evaluation Methodology Across Assembly Flow with Focus on Final Package Integrity in advanced packages like 2.3D-R & 2.3D-BT 1: Intel Corporation, Germany; 2: Intel Corporation,Taiwan 3:15pm - 3:35pm Thermal-mechanical Coupling Simulation of Chiplet 2.5D Packaging Based on Chiplet Distribution and Full Copper Interconnection 1: Southern University of Science and Technology; 2: Delft University of Technology 3:35pm - 3:55pm Thermo-Mechanical Warpage Prediction and Validation of Large Chiplet Packages Imec, Leuven, Belgium |
S5: Advanced Simulation Methods Efficient Numerical Simulation of an Electrically Stimulated Neuron with Distributed Hodgkin Huxley Model 1: Department of Engineering, Jade University of Applied Sciences, Wilhelmshaven, Germany; 2: Institute for Electronic Appliances and Circuits, University of Rostock, Rostock, Germany 3:15pm - 3:35pm 3D Parametric Simulations of Mass Transport and Mechanical Properties of a Microfluidic Barrier-on-Chip Device Delft University of Technology 3:35pm - 3:55pm Multiphysics Topology Optimization for MEMS Institute of Microstructure Technology (IMT), Karlsruhe Institute of Technology (KIT), Germany |
| 3:55pm - 4:20pm |
Coffee Break |
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| 4:20pm - 5:40pm |
S6: Thermal Behavioral Modeling An ANN-based Digital Twin for PCB Temperature Monitoring: Development and Validation Aptiv Services Poland 4:40pm - 5:00pm A Neural Network-Based Performance Assessment Approach for Heat-Dissipating Microchannels in Packages School of Integrated Circuits, Guangdong University of Technology, China 5:00pm - 5:20pm Physics-inspired AI Models Trained on Abstract Synthetic Systems for Thermal Propagation Silicon Austria Labs, Austria 5:20pm - 5:40pm Electro-thermal Co-simulation of SiC MOSFET Double-pulse Tests Using a Peak-power-threshold (PPT) Method for Junction-temperature Estimation TU Delft, The Netherlands |
S7: MEMS Sensors Layout-oriented Design of MEMS Acceleration Sensor and Evaluation of Packaging Effects 1: FhI ENAS, Germany; 2: TU Chemnitz, Germany 4:40pm - 5:00pm Design Optimization of a Multi-resonant Folded Beam Piezoelectric Energy Harvester Using an Efficient Two-phase Topology Optimization 1: University of Rostock, Germany; 2: Jade University of Applied Sciences, Wilhelmshaven, Germany 5:00pm - 5:20pm Time-domain Modeling of Distortion Reduction in In-ear MEMS Loudspeakers via Feedback Linearization CEA, France 5:20pm - 5:40pm Physics-based State-space Model for Self-sensing in Piezoelectric MEMS Microphones 1: Technical University of Munich, Munich, Germany; 2: Infineon Technologies AG, Neubiberg, Germany |
| 6:15pm - 7:00pm |
Bus ride to downtown |
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| 7:00pm - 10:00pm |
Dinner |
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| Date: Tuesday, 21/Apr/2026 | ||
| 8:30am - 10:30am |
Interactive Poster Session Applying the Global-local Approach with the Equivalent Structure for Reliability Assessment of the Multilevel Area Array Interconnects Feng Chia University, Taiwan Kinetic Monte Carlo Simulation Study on the Step-Flow Growth Mechanism of 4° Off-Axis 4H-SiC 1: Foshan University, Foshan 528225, China; 2: Guangdong Tianyu Semiconductor Co., Ltd.; 3: Fudan University, Shanghai 200433, China; 4: Delft University of Technology, Delft 2628, the Netherlands Detection and Localization of Subsurface Thermal Hotspots in 3D Microelectronics via Machine Learning 1: University of Michigan, United States of America; 2: American University of Madaba, Jordan; 3: University of Arkansas Deep Learning-driven Undamaged-to-damaged Response Translation for Proactive Structural Health Monitoring of Semiconductor Probe Cards 1: Politecnico di Milano, Italy; 2: Technoprobe, Italy Development of Piezoelectric Patterns by Direct 3D Writing Applied to Atomic Layer Deposition University of Bari, Italy Comparative Evaluation Methodology for Full Order and Superelement-containing Finite Element Models for Predicting Solder Joint Fatigue Technische Universität Dresden, Germany Dynamic and Thermal Performance Evaluation of Three-Phase Full-Bridge Power Factor Correction Converters for On-Board Charger Applications 1: Ph. D Program of Mechanical and Aeronautical Engineering, Feng Chia University; 2: Department of Aerospace and Systems Engineering, Feng Chia University; 3: Electronic and Optoelectronic System Research Laboratories, Industrial Technology Research Institute Lab-on-Chip Acoustic Detection Platform: Design, Fabrication and Performance Evaluation 1: Univ. Polytechnique Hauts-de-France, CNRS, Univ. Lille, ISEN, Centrale Lille, UMR 8520 -IEMN - Institute of Electronics, Microelectronics and Nanotechnology, DOAE - Department of Opto-Acousto-Electronics, F-59313 Valenciennes, France.; 2: NANOMISENE Laboratory, LR16CRMN01, Research Center in Microelectronics and Nanotechnology (CRMN), Sousse Technopole, Tunisia.; 3: University of Sousse, National Engineering School of Sousse (ENISo), Tunisia. Effect of Underfill Cracking and Interfacial Delamination on Reliability of Advanced Electronic Packages 1: University of Maryland, United States of America; 2: Arizona State University, United States of America; 3: Deca Technologies, United States of America Efficient Electro-thermal-structural Co-design Using a TCAD-FEM Integrated Surrogate Model 1: Dong-Eui University, Korea, Republic of Korea; 2: Pusan National University, Republic of Korea Detecting Single Event Transients on a 28-nm SRAM-based FPGA under Neutron Radiation Exposure 1: Chair for Chip Design for Embedded Computing, Technische Universität Braunschweig, Braunschweig, Germany; 2: RESRI Group, Institute of Microelectronic Systems (IMS), Leibniz Universität Hannover, Hannover, Germany; 3: Bundeswehr Research Institute for Protective Technologies and CBRN Protection (WIS), Munster, Germany On Moisture Absorption in Non-hermetic Packages, Finite Element Model Validation through Real-time Characterization STMicroelectronics, Italy Criticality assessment methodology of Microvias in Printed Circuit Boards 1: AT&S Austria Technologie & Systemtechnik, Austria; 2: Montanuniversität Leoben, Institute of Mechanics, Franz-Josef-Strasse 18, 8700 Leoben, Austria; 3: Polymer Competence Center Leoben GmbH, Sauraugasse 1, 8700 Leoben, Austria Design and TCAD analysis of AlN-based Devices for VUV Detection 1: College of Intelligent Robotics and Advanced Manufacturing, Fudan University, Shanghai 200433, China; 2: Shanghai Engineering Technology Research Center for SiC Power Device, Fudan University, Shanghai 200433, China; 3: State Key Laboratory of Luminescence and Applications, Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun, Jilin 130033, China; 4: EEMCS Faculty, Delft University of Technology, Delft 2628CD, the Netherlands Advanced 3D Modeling of Reactive Multilayer Systems for Chip- and Wafer-Level Bonding Applications Fraunhofer Institute for Electronic Nano Systems, Chemnitz, Germany Device level Fingerprint Methodology RISE, Sweden Asymmetric Warpage: Determination of a Curvature Scale for Warpage Predictions STMicroelectronics, Italy Electromagnetic Finite Element Modeling of PCB-Embedded Toroidal Inductors Featuring Iron-powder Magnetic Cores 1: Paris-Saclay University; 2: CNRS; 3: Satie; 4: Universidad de Zaragoza; 5: Siemens Germany; 6: Université Claude Bernard Lyon 1; 7: Ampere; 8: Université Gustave Eiffe Integrated Multi-physics Optimisation of MOSFET Power Modules for Reduced Parasitic Inductance and Enhanced Thermal Reliability Noesis Solutions NV, Belgium Measurement and CAE Analysis of Film degradation as Repeated Deformation of Foldable Displays Korea Electronics Technology Institute, Korea, Republic of (South Korea) Scaling Ion Traps using 3D Heterogeneous Integration 1: Infineon Technologies Austria, Austria; 2: TU Chemnitz, Germany; 3: Fraunhofer ENAS, Germany Additive Manufacturing of Copper and Ceramic for Electronics Cooling and Packaging: Potential and Challenges Rise Research Institutes of Sweden, Sweden Experimental and Numerical Investigations of Mechanical Failure for a Direct Bonded Copper in an Intelligent Power Module under Assembly Processes National Taiwan University, Taiwan Fabrication and FEM Analysis of Flip-chip Bonded Si Chip with Au Stud Bumps on Si Interposer 1: C2N-UPSACLAY, France; 2: 2Karlsruhe Institute of Technology (KIT), Germany Surrogate Model Development for Transient Thermal Response of Power Devices via Enhanced Integration Neural Network Functionality The University of Osaka, Japan Improving Simulation Efficiency of Chiplet Package Solder Bump Reliability Analysis Using Equivalent Beam Model Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu 300, Taiwan, R.O.C. Criticality Assessment of Microvias at the PCBA Level Using Feature Surrogates 1: Austria Technologie & Systemtechnik AG, Fabriksgasse 13, 8700 Leoben; 2: Chair of Materials Science and Testing of Polymers, Montanuniversitaet Leoben, Otto-Glöckel-Straße 2, 8700 Leoben; 3: Polymer Competence Center Leoben GmbH, Sauraugasse 1, 8700 Leoben Design Analysis of Wire Bonding Reliability for Low Profile Quad Flat Package Based on Numerical Methods Realtek Semiconductor Corp. Parametric Assessment of Cu Pillar Microbump Interconnects Co-design for Thermomechanical Reliability University of Maryland, United States of America Material and Microstructural Characterization via Nano and Micro Scratching Aarhus University, Denmark Transformer-enhanced Metamodels for Optimizing Material, Geometric, and Process Temperature Features in Warpage Control of Package-on-package Assemblies 1: ams OSRAM AG, Austria; 2: Institute of Materials Science and Testing of Polymers, Montanuniversität Leoben, Leoben, Austria; 3: Polymer Competence Centre Leoben (PCCL) GmbH, Leoben, Austria Acoustic Noise Improvement with High Efficiency Samsung, Korea, Republic of (South Korea) Numerical Investigation of Double Layer Minichannel in Data Center Thermal Management Combined with Thermal Storage for Cascade Energy Utilization Indian Institute of Information Technology, Design and manufacturing, India Optimized Design of a Liquid Precursor Flow-control Sensor System for Semiconductor Deposition Equipment via Heat-transfer Simulation 1: Korea Electronics Technology Institute (KETI), Korea, Republic of (South Korea); 2: YHENS, Korea, Republic of (South Korea) Physical Estimation for Vertical Interconnect of Glass Substrate 1: Industrial Technology Research Institute Hsinchu, Taiwan; 2: National Tsing Hua University, Taiwan The Metal-Insulator Transition of VO2: A Fresh Look at a Prototypical System Materials Design SARL, France Efficient Space Charge Current Injection in Silicon Implanted Fe-doped Beta-Ga2O3 Crystals Resulting in Extremely Low Thermal Breakdown Field. Institute of Microelectronics of Barcelona (IMB-CNM-CSIC) Reliability Analysis of Sintered Ag Solder Joints for Cu Clip Bonding in Power Semiconductors Considering Geometric and Process Variations 1: Dong-Eui University, Korea, Republic of (South Korea); 2: Heraeus Material Limited Singapore Reliability Assessment of Advanced Fan-Out Packages Under Drop Impact Conditions 1: National Sun Yat-sen University, Taiwan; 2: National Formosa University Simulation of a Novel TSV Interposer for Reduced Thermal Stress While Maintaining Thermal Performance Graduate School of Advanced Technology, National Taiwan University, Taipei, Taiwan Physics-of-Failure Based Reliability Investigations of Copper Sintered Die Attaches for Wide Band Gap Power Electronics 1: Chemnitz University of Technology, Germany; 2: Nano-Join GmbH, Berlin, Germany; 3: budatec GmbH,12487 Berlin, Germany; 4: Fraunhofer ENAS, Chemnitz, Germany Transformer based SHM of Semiconductor Probe Cards: Unifying Optimal Sensor Placement and Missing Data Imputation for Reliable Online Monitoring 1: Politecnico di Milano, Italy; 2: Technoprobe, Italy Comparative Performance Assessment of Model Order Reduction Techniques for a Power Converter Silicon Austria Labs GmbH, Austria Comparison between Linear and Nonlinear Modelling of Viscoelastic Material Behaviour on the Example of Polymer Encapsulation for Advanced Electronic Virtual Design Fraunhofer IKTS, Germany Design and Optimization of MEMS Variable-Area Capacitive Pressure Sensors for Improved Sensitivity and Linearity in Fingertip Tactile Sensing University of the Philippines, Philippines Optimized Surface Treatment Strategies for Improved Cu-Cu Direct Bonding 1: Department of Electrical Engineering, KU Leuven, Belgium; 2: Department of Physics and Astronomy, KU Leuven, Belgium; 3: imec, Leuven, Belgium; 4: Xenics, Leuven, Belgium Assessing the Role of Vibration Excitation Method on Solder Fatigue in Board Level Vibration Tests 1: NXP Semiconductors, Netherlands, The; 2: Delft University of Technology, Netherlands, The Influence of Hotspot Effects on Thermo-mechanical Reliability of Integrated Gradient Microchannel Heat Sink for Data Center Thermal Management Indian Institute of Information Technology, Design and manufacturing, India Exploring Subcritical Interfacial Fracture Characterization Extending the Advanced Mixed-Mode Bending Method 1: Berliner Nanotest und Design GmbH, Germany; 2: University of Technology Chemnitz, Germany Noise-preserving Circuit Synthesis from Vector-fitted Macromodels 1: Infineon Technologies AG, Germany; 2: Technical University of Munich, Germany Rapid and Accurate Estimation of Acoustic Coupling in MUT Devices Using finite Element Modeling imec, Belgium Electromigration Simulation of C4 Solder Bumps with Cu and Ni Under-bump Metallization 1: STATS ChipPAC, Singapore; 2: JCET Group, China; 3: STATS ChipPAC, Korea Study on Sintered Cu Interconnect Interfaces in the Substrate-embedded SiC MOSFET Power Module Institute of Microelectronics of the Chinese Academy of Sciences, China, People's Republic of FEM-based Design Guidelines for the Thermal Management of PCBs with Paralleled GaN HEMT Devices 1: Department of Electrical Engineering and Information Technology, University of Naples Federico II, Italy; 2: Department of Ship and Industry Automation, Gdynia Maritime University, Gdynia, Poland Thermal Analysis of Chiplet Packaging Using an Equivalent Material Modeling Approach 1: College of Semiconductor Research, National Tsing Hua University, Hsinchu 300, Taiwan, R.O.C.; 2: Dept. of Power Mechanical Engineering, National Tsing Hua University, Hsinchu 300, Taiwan, R.O.C. Dynamic Digital Twin as a Virtual Sensor for Temperature Estimation in WBG Power Devices Delft University of Technology, Netherlands, The Liquid-assisted Contactless Adhesive Bonding: Experimental validation and 2D Multiphysics Simulation 1: Delft University of Technology (TU Delft), Netherlands, ECTM; 2: Delft University of Technology (TU Delft), Netherlands, PME CNN-based Prediction of Thermo-mechanical Properties of PCB and Interposer Conductive Layers with WGAN-augmented Data National Tsing Hua University, Taiwan Raman Spectroscopy as a Rapid Screening Method for Microstructure-Dependent Oxidation of Copper Films Materials Center Leoben Forschung GmbH, Austria Artificial Intelligence (AI)-Enabled Reliability Prediction and Prognostics for Electronic Packages: A Perspective on Data, Models, and Applications 1: Lamar University, United States of America; 2: Feng Chia University, Taichung, Taiwan Creep Response Variability in Oligocrystalline SAC Solder Joints due to Primary Creep During Rapid Temperature Excursions 1: University of Maryland, United States of America; 2: NXP Semiconductors, USA Modeling Electrode and Microchannel Geometry for Detection of Cadmium (Cd), Lead (Pb), and Copper (Cu) in Drinking Water through a Capillary-driven Microfluidic Electrochemical Sensor Electrical and Electronics Engineering Institute, University of the Philippines Diliman, Philippines Physics-informed Neural Network for Multi-scale Thermal Transport in AlGaN/GaN HEMT Heterostructures 1: Technoprobe, Cernusco Lombardone, Italy; 2: Materials Center Leoben Forschung GmbH (MCL), Leoben, Austria; 3: Department of Civil and Environmental Engineering, Politecnico di Milano, Milan, Italy Reverse Engineering of QFN Epoxy Mold Compound Properties using Digital Image Correlation 1: Fraunhofer IZM, Germany; 2: Technische Universität Berlin, Germany Thermal Cycling Lifetime of BGA Microcontroller Package and Influence of Assembly on Aluminum Baseplates Infineon Technologies AG, Germany High-power RF-MEMS Metal contact Switch Operating up to 300 GHz for 6G Communication Systems Indian Institute of Technology Delhi, New Delhi, India, India A Multi-Agent System for Automated Lifetime Prediction of Power Devices 1: EEMCS Faculty, Delft University of Technology, Delft, 2628 CD, The Netherlands; 2: Shanghai Engineering Technology Research Center of SiC Power Device, College of Intelligent Robotics and Advanced Manufacturing, Fudan University, 200433, China Flow-boiling Cooling Concept for a Small Form-factor Embedded MOSFET Half-bridge Power Module 1: Brandenburg University of Technology Cottbus-Senftenberg, Germany; 2: Fraunhofer IZM, Germany; 3: Berliner Nanotest and Design GmbH, Germany; 4: Chemnitz University of Technology, Germany Research on Optimizing Current Sharing and Temperature Uniformity Performance for SiC HPD Modules 1: Southern University of Science and Technology, China, People's Republic of; 2: School of Microelectronics, Southern University of Science and Technology, Shenzhen , China; 3: AccoPower, Guangzhou, China; 4: Delft University of Technology, Fac. EEMCS, Mekelweg 4, 2628CD Delft, The Netherlands |
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| 10:30am - 10:55am |
Coffee Break |
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| 10:55am - 12:25pm |
S8: Mold & interface Materials Development of a method for parylene interface toughness characterization under fatigue load for electronic packaging applications 1: Materials and Reliability of Microsystems, TU Chemnitz; 2: Fraunhofer ENAS, Chemnitz, Germany; 3: Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN) 11:25am - 11:45am Verification of the Mold Material Model Through Simulation Studies At The Product Level 1: Robert Bosch GmbH, Germany; 2: Technische Universität Chemnitz; 3: Fraunhofer ENAS 11:45am - 12:05pm Impact of Thermal Gap Filler vs. Thermal Gap Pad Materials on the Solder Joint Lifetime of eWLB Packages in Topside Cooling Setups Infineon Technologies AG, Germany 12:05pm - 12:25pm Effect of PFAS Removal on the Underfill and TIM Interface Properties and Performance Auburn University, United States of America |
S9: Machine Learning-based Methods A Simple and Thermo-mechanically Robust Multiaxial Force Sensing Scheme Based on Polymer-MEMS and AI-based Signal Post-processing for Smart Skin Technologies 1: TU Chemnitz, Germany; 2: Fraunhofer ENAS, Germany; 3: Centre for micro- and nanotechnologies (ZfM) at TU Chemnitz, Germany; 4: Centre for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz, Germany 11:25am - 11:45am Modeling of nonlinear ferroelectric microactuator with Fourier Neural Operator imec, Belgium 11:45am - 12:05pm Neural Network-based Multi-Wavelength PPG Signal Denoising for Wearable Devices STMicroelectronics, Italy 12:05pm - 12:25pm pMUT Array Characteristics for Sonomyographic Hand Gesture Recognition 1: KU Leuven, Belgium; 2: University of Patras, Greece; 3: imec, Belgium |
| 12:25pm - 1:25pm |
Lunch |
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| 1:25pm - 2:55pm |
S10: Solder Fatigue: Models & Mechanisms AI Surrogate Model for PBGA Solder Fatigue Assessment Using Progressive Transfer Learning with Multi-fidelity Data Feng Chia University, Taiwan 1:55pm - 2:15pm The Prediction of Solder Joint Geometries through the Characterization of the Micro-wetting Behavior on Component Metallizations – Experiments and Simulations Universität des Saarlandes, Germany 2:15pm - 2:35pm Thermo-elastic-viscoplastic Damage Model for Sn-Ag-Cu Solder Berlin Institute of Technology / Technische Universität Berlin, Germany 2:35pm - 2:55pm Numerical analysis of solder-joint stress during the process of encapsulating an entire PCBA 1: Elastic-Simulations GmbH; 2: Ottronic Regeltechnik Gesellschaft m.b.H.; 3: Polymer Competence Center Leoben GmbH |
S11: Thermal Experimental Characterization On-Chip Pulsed Microheater for Rapid Nanoparticle Sintering ECTM, Department of Microelectronics, TuDelft, Delft, The Netherlands 1:55pm - 2:15pm Evaluation of the Young’s Modulus of Silicon Carbide from Specific Heat Measurements STMicroelectronics, Italy 2:15pm - 2:35pm A New Packaging and Flow Boiling Cooling Concept for HPC Applications Enabling High Thermal and Thermo-mechanical Performance on Organic Substrates 1: Brandenburg University of Technology Cottbus-Senftenberg, Germany; 2: Fraunhofer IZM , Germany; 3: Berliner Nanotest and Design GmbH, Germany; 4: Chemnitz University of Technology, Germany 2:35pm - 2:55pm In-situ Quantification of CTE in Packaged SiC Chips via Synchronized Thermal Imaging and Digital Image Correlation Dong-Eui University, Korea, Republic of (South Korea) |
| 2:55pm - 3:05pm |
Coffee Break |
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| 3:05pm - 4:35pm |
S12: Mission Profiles & RUL An Advanced Mission Profile-based Lifetime Assessment in Power Electronics Assembly Using Physics-informed Surrogate Modeling Fraunhofer IISB, Germany 3:35pm - 3:55pm Compact Thermal RC Model of a Multi Die Power Stage with In-Package Sensing for Remaining Useful Life Prediction 1: Delft University of Technology, Department of Microelectronics, Delft, The Netherlands; 2: Nexperia BV, 6534 AB Nijmegen, The Netherlands 3:55pm - 4:15pm Using Fragility Surfaces for Remaining Useful Lifetime Estimations 1: Ansys Germany GmbH, Germany; 2: Robert Bosch GmbH, Corporate Research; 3: Robert Bosch GmbH, Power Electronics Engineering 4:15pm - 4:35pm Efficient Reliability Assessment of Solder Joints in Automotive Applications Using HYPER-SUB 1: CADFEM Germany GmbH, Germany; 2: Fraunhofer Institute for Electronic Nano Systems ENAS |
S13: Materials Modelling The Oxidation Effects of Copper Layer on AMB Substrate in Power Modules: A Multiscale Simulation Study 1: Electronic Components, Technology, and Materials (ECTM), Department of Microelectronics, Delft University of Technology, Mekelweg 4, 2628 CD Delft, The Netherlands; 2: Boschman Technologies B.V., 6921 EX Duiven, The Netherlands; 3: Shanghai Engineering Technology Research Center of SiC Power Device, College of Intelligent Robotics and Advanced Manufacturing, Fudan University, Shanghai 200433, China 3:35pm - 3:55pm Study on Finite Element Analysis Modeling of Crack Propagation in Hybrid Bonding Structures Based on the Cohesive Zone Method 1: Institute of Microelectronics of the Chinese Academy of Sciences; 2: School of Integrated Circuits,Peking University; 3: Beijing Institute of Remote Sensing Equipment; 4: National Key Lab of Micro/Nano Fabrication Technology; 5: Beijing Advanced Innovation Centerfor Integrated Circuits 3:55pm - 4:15pm Constitutive Model Identification for Aluminium Wires and Potting Resin used in IGBT Power Modules 1: Université Paris-Saclay, CentraleSupélec, Ecole Normale Supérieure Paris-Saclay, CNRS LMPS–Laboratoire de Mécanique Paris-Saclay, France; 2: Mitsubishi Electric R&D Centre Europe, France 4:15pm - 4:35pm Phase Field Model for Gate Oxide Breakdown in SiC Power Devices 1: Electronics Components, Technology and Materials (ECTM), Department of Microelectronics, TuDelft. The Netherlands; 2: DC systems, energy conversion & storage (DCE&S), Electrical Sustainable energy, TuDelft. The Netherlands |
| 4:35pm - 5:00pm |
Coffee Break |
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| 5:00pm - 6:10pm |
S14: Advanced Packaging Reliability Predicting Redistribution Layer (RDL) Interfacial Strength and Delamination in Fan-out Wafer Level Packaging 1: Arizona State University - Tempe, AZ, United States of America; 2: CALCE, University of Maryland, College Park, MD, USA 5:30pm - 5:50pm Numerical Study of Loop Geometry Effects on Wire Reliability in LED Packages ams-OSRAM International GmbH, Germany 5:50pm - 6:10pm Design, Superconducting Behaviour and Reliability of Niobium Thin-Film Micro-Coil Structures for Ion-Trap-based Quantum Computers: Mapping the J–B–T Critical Surface for Cryogenic Microsystem Integration into 3D Cryo-SiP Architectures 1: Materials and Reliability of Micro Systems, Chemnitz University of Technology, 09126, Chemnitz, Germany; 2: Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), TU Chemnitz, Germany; 3: Fraunhofer Institute for Electronic Nano Systems – ENAS, Chemnitz, Germany |
S15: Advanced MEMS Numerical Characterization of Acoustic Fields within Cylindrical Air-coupled Sono-photonic Waveguides 1: Technische Universität Darmstadt, Germany; 2: Deutsches Elektronen-Synchrotron DESY, Hamburg, Germany; 3: Helmholtz Institute Jena, Jena, Germany 5:30pm - 5:50pm Piezoelectric Contour Mode Resonators for Fast & Power-efficient On-chip Acousto-optic Modulation 1: Infineon Technologies AG, Germany; 2: Technical University of Munich, Germany; 3: Infineon Technologies Austria AG, Austria; 4: ETH Zurich, Switzerland 5:50pm - 6:10pm In Situ Evaluation of an Antifouling Vibrating System for Marine Sensors 1: CEA-Leti, Grenoble, France; 2: MAPIEM, University of Toulon, France; 3: IFREMER, Brest, France |
| 6:10pm - 6:30pm |
Sponsor Session |
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| 6:30pm - 8:30pm |
Cocktail Party at Venue |
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| Date: Wednesday, 22/Apr/2026 | ||
| 8:30am - 9:50am |
S16: Mirelai Session Failure Analysis of Electronic Packaging using Eddy Current Thermography 1: Berliner Nanotest and Design GmbH, Berlin, Germany; 2: Chemnitz University of Technology, Chemnitz, Germany; 3: Fraunhofer ENAS, Chemnitz, Germany 8:50am - 9:05am Influence of Low Temperature Swings on Solder Joint Reliability 1: Delft University of Technology (TU Delft), Netherlands, The; 2: NXP Semiconductors 9:05am - 9:20am Machine Learning for Microstructure Characterisation of Intermetallic Layers in BGA Solder Joints 1: School of Computing and Mathematical Sciences, University of Greenwich, London, United Kingdom; 2: Materials Consultancy Services Limited, Midlothian Innovation Centre, Edinburgh 9:20am - 9:35am Efficient Augmented Kalman Filter Parameter Tuning for Thermal Virtual Sensing in Electronic Systems 1: imec; 2: Siemens Digital Industries Software; 3: KU Leuven; 4: Flanders Make 9:35am - 9:50am Effect of Electroplating-induced Copper Thickness Variations on the Thermomechanical Reliability of Plated Through Holes 1: Siemens Industry Software nv, Strategy & Innovation, Leuven, Belgium; 2: imec, Belgium; 3: Department of Computer Science, KU Leuven, Belgium; 4: Flanders Make@KU Leuven, Belgium |
S17: Thermal Design Modeling and Experimental Characterization Modified Infrared Thermal Characterization Methodology coupled with Modelling for GaN RF Power Amplifier Transistors in Compact SMD Packages Ampleon B.V. 8:50am - 9:10am Integrated Electro-Thermal Framework for Performance Screening and Optimization of Power Modules Nexperia B.V., Italy 9:10am - 9:30am Hybrid Zener–NTC Dynamic Circuit for Active Hot-spot Mitigation in Photovoltaic Modules University of Napoli Federico II, Italy 9:30am - 9:50am A Thermo-fluidic Model for the Analysis of Vapor Chambers with Varying Heat Source Size and Location 1: CONNECT, Stokes Laboratories, Bernal Institute, University of Limerick, Ireland; 2: School of Engineering, University of Limerick, Ireland |
| 9:50am - 10:15am |
Coffee Break |
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| 10:15am - 11:15am |
S18: Digital Twins & Model Exchange Surrogate-based Digital Twin Framework for Thermoset Molding and Process Simulation 1: Polymer Competence Center Leoben GmbH (PCCL), Leoben, 8700, Austria; 2: Silicon Austria Labs GmbH (SAL), Villach, 9524, Austria; 3: GIPRO GmbH, Peggau, 8120, Austria 10:35am - 10:55am Software-agnostic Thermal-mechanical Model Exchange via FMUs for Microelectronics Reliability Simulation NXP Semiconductors, Netherlands, The 10:55am - 11:15am Krylov-based Thermo-mechanical Superelements for Efficient Reliability Assessment in Microelectronics 1: Jade University, Germany; 2: CADFEM Germany GmbH |
S19: Material Modeling for Packaging Material Property Prediction of Bi-doped SnAgCu Solders under High Strain Rates of Mechanical Shock and Vibration Auburn University, United States of America 10:35am - 10:55am Elastic-plastic Temperature and Porosity dependent Material Model for Sinter Silver with Minimal Measurement Effort by using RVE 1: Fraunhofer ENAS, Micro Materials Center; 2: Technical University of Chemnitz, Center for Micro and Nanotechnologies 10:55am - 11:15am Moisture Transport under Power Cycling in Silicone-gel Encapsulated Power Modules - Pumping and Reverse Pumping SATIE, Gustave Eiffel University, France |
| 11:15am - 11:25am |
Coffee Break |
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| 11:25am - 12:45pm |
S20: PCB Reliability Modelling Approach to Assess Localized Strain Effects in Copper Plated Through Holes for Highly Reliable PCBs 1: Fraunhofer IZM, Germany; 2: Technical University Berlin, Germany 11:45am - 12:05pm Optimizing Multilevel Microvia Structures for Thermo-mechanical Reliability in High-speed HDI PCBs 1: imec, Belgium; 2: ACB, Belgium; 3: ESA-ESTEC, The Netherlands 12:05pm - 12:25pm PCB embedding: A Case Study on MOSFETs and more Nexperia B.V., Netherlands, The 12:25pm - 12:45pm A Viscoelastic Effective Model and Characterization Method for Woven Composites and a Homogenization Approach for Applications in Complex PCB Simulations 1: Technische Universität Berlin, Berlin, Germany; 2: Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin, Germany |
S21: Multiphysics Simulation for Packaging Optimization of Co-integrated Clamping Diode Design for Voltage Regulators through Experimentally-calibrated SPICE Simulations 1: University of Naples "Federico II", Italy; 2: onsemi, Analog and Mixed-Signal Group, Milan, Italy; 3: onsemi, Central Engineering Group, Oudenaarde, Belgium; Roznov pod Radhostem, Czech Republic; Sunnyvale, CA, USA; 4: onsemi, Power Solution Group, Hopewell Junction, NY 11:45am - 12:05pm Thermal and electrical simulations of Rad-hard Si VDMOS Transistors 1: Institute of Microelectronics of Barcelona. CNM CSIC, Cerdanyola del Vallés, Spain; 2: Power electronics Llíria, Llíria, Spain 12:05pm - 12:25pm A Fast Multidomain System-level Simulation Model for GaN Transistor Package Optimization Silicon Austria Labs GmbH, Austria Investigation of Temperature Induced Stress Development around Tungsten-TSVs in Silicon Structures in a Cryogenic Environment using Micro-raman Spectroscopy 1: Chemnitz University of Technology, Germany; 2: Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz, Germany; 3: Fraunhofer ENAS, Chemnitz, Germany; 4: Center for Micro-and Nanotechnologies (ZfM), Chemnitz, Germany; 5: Joint Lab Berlin, Berlin-Adlershof, Germany |
| 12:45pm - 1:45pm |
Lunch |
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| 1:45pm - 2:45pm |
S22: Mixed Session |
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| 2:45pm - 3:00pm |
Closing and Awards |
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