Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Session Overview |
| Date: Sunday, 19/Apr/2026 | ||
| 9:00am - 12:00pm |
Professional Development Course 1 |
Professional Development Course 2 |
| 9:00am - 5:00pm |
Professional Development Course 3 |
|
| 2:00pm - 5:00pm |
Professional Development Course 4 |
Professional Development Course 5 |
| Date: Monday, 20/Apr/2026 | ||
| 8:45am - 9:00am |
Opening |
|
| 9:00am - 10:30am |
Industrial Keynotes Chair: Michiel van Soestbergen Chair: Willem van Driel |
|
| 10:30am - 10:55am |
Coffee Break |
|
| 10:55am - 12:25pm |
S1: Technical Keynotes Chair: Bart Vandevelde Chair: Véronique Rochus |
|
| 12:25pm - 1:25pm |
Lunch |
|
| 1:25pm - 2:45pm |
S2: Interconnect Degradation |
S3: Ultrasound Devices |
| 2:45pm - 2:55pm |
Transfer Break |
|
| 2:55pm - 3:55pm |
S4: Chiplets & Warpage |
S5: Advanced Simulation Methods |
| 3:55pm - 4:20pm |
Coffee Break |
|
| 4:20pm - 5:40pm |
S6: Thermal Behavioral Modeling |
S7: MEMS Sensors |
| 6:15pm - 7:00pm |
Bus ride to downtown |
|
| 7:00pm - 10:00pm |
Dinner |
|
| Date: Tuesday, 21/Apr/2026 | ||
| 8:30am - 10:30am |
Interactive Poster Session |
|
| 10:30am - 10:55am |
Coffee Break |
|
| 10:55am - 12:25pm |
S8: Mold & interface Materials |
S9: Machine Learning-based Methods |
| 12:25pm - 1:25pm |
Lunch |
|
| 1:25pm - 2:55pm |
S10: Solder Fatigue: Models & Mechanisms |
S11: Thermal Experimental Characterization |
| 2:55pm - 3:05pm |
Coffee Break |
|
| 3:05pm - 4:35pm |
S12: Mission Profiles & RUL |
S13: Materials Modelling |
| 4:35pm - 5:00pm |
Coffee Break |
|
| 5:00pm - 6:10pm |
S14: Advanced Packaging Reliability |
S15: Advanced MEMS |
| 6:10pm - 6:30pm |
Sponsor Session |
|
| 6:30pm - 8:30pm |
Cocktail Party at Venue |
|
| Date: Wednesday, 22/Apr/2026 | ||
| 8:30am - 9:50am |
S16: Mirelai Session |
S17: Thermal Design Modeling and Experimental Characterization |
| 9:50am - 10:15am |
Coffee Break |
|
| 10:15am - 11:15am |
S18: Digital Twins & Model Exchange |
S19: Material Modeling for Packaging |
| 11:15am - 11:25am |
Coffee Break |
|
| 11:25am - 12:45pm |
S20: PCB Reliability |
S21: Multiphysics Simulation for Packaging |
| 12:45pm - 1:45pm |
Lunch |
|
| 1:45pm - 2:45pm |
S22: Mixed Session |
|
| 2:45pm - 3:00pm |
Closing and Awards |
|