Material Property Prediction of Bi-doped SnAgCu Solders under High Strain Rates of Mechanical Shock and Vibration

Pradeep Lall, Vishal Mehta, Jeff Suhling, David Locker

Auburn University, United States of America

Thermomechanical and Microstructural Mechanisms Governing Copper Degradation under High Strain Rate Thermo-mechanical Fatigue

Alexander Huber^1,2, Manuel Petersmann², Thomas Antretter¹

¹Montanuniversität Leoben, Austria; ²Kompetenzzentrum Automobil- und Industrieelektronik GmbH, Austria

Thermal Shock Simulations of a PCB with Embedded Components and Microvia Based Interconnection: Meso-scale Modeling of the Woven Composite

Mickaël LEICHT^1,2, Baptiste ARATI², Gautier GIRARD¹, Alexandre MARIE³, Aymeric LAGADEC⁴, Gilles SEGOND², Bernardo COUGO², Olivier PERROTIN⁵, Jean-Pierre FRADIN³, Fabio COCCETTI², Sébastien MERCIER¹

¹Université de Lorraine, France.; ²IRT Saint Exupéry, France.; ³Icam School of Engineering, France.; ⁴ELVIA Electronics, France.; ⁵Alter Technology France,France.

Secondary Effects Causing Early Solder Fatigue Failure of QFN Components Subjected to Test- and Field Cycling

Rainer Dudek¹, Peter Fruehauf², Matthias Prinz¹, Lisa Kreher¹, Susana Richter-Trummer¹, Lutz Scheiter³, Jan Albrecht¹, Sven Rzepka¹

¹Fraunhofer ENAS, Chemnitz, Germany; ²Siemens AG, Technology, Berlin, Germany; ³CWM GmbH, Chemnitz, Germany

High-performance and Scalable DG-SEM Modeling of Large PMUT Arrays for Biomedical Imaging

Michelangelo Gabriele Garroni¹, Omer Mohamed Osman Abdalla², Edoardo Moretti², Alberto Corigliano², Attilio Frangi², Domenico Giusti³, Alessandro Stuart Savoia⁴, Paola Antonietti¹, Nicola Parolini¹, Ilario Mazzieri¹

¹MOX, Dipartimento di Matematica, Politecnico di Milano, Italy.; ²Department of Civil and Environmental Engineering, Politecnico di Milano, Italy.; ³STMicroelectronics Agrate, Italy.; ⁴Università degli Studi Roma Tre, Italy.

Finite Element Modeling and Experimental Validation of Dual-mode Ultrasonic Haptics on OLED Screens

Theotime Goubault¹, Fabrice Casset¹, Ayoub Ben Dhiab², Gwenael Le Rhun¹, Munique Kazar Mendes¹, David Alincant¹, Delphine Rolland¹, Daniel Mermin¹, Rémi Franiatte¹, Mikael Colin¹

¹CEA LETI, France; ²CEA LIST, France

Analytical System-level Model for Optimization of pMUT Based Acoustic Power Delivery for Implants

Oguz Kaan Erden^1,2, Bogdan Vysotskyi¹, Chris Van Hoof^1,2, Xavier Rottenberg¹

¹Imec, Leuven, Belgium; ²KU Leuven, Belgium

Simulating pMUT Array Characteristics for Sonomyographic Hand Gesture Recognition

Chinmay Pendse^1,3, Antonios Lykourinas², Milind Pandit³, Chris Van Hoof^1,3, Xavier Rottenberg³, Veronique Rochus³

¹KU Leuven, Belgium; ²University of Patras, Greece; ³imec, Belgium

Holistic Warpage Evaluation Methodology Across Assembly Flow with Focus on Final Package Integrity in advanced packages like 2.3D-R & 2.3D-BT

Mohan Prashanth Javaregowda¹, Js Paek², Han-wen Lin², Hans-Gerd Jetten¹, Thomas Huber¹

¹Intel Corporation, Germany; ²Intel Corporation,Taiwan

Thermal-mechanical Coupling Simulation of Chiplet 2.5D Packaging Based on Chiplet Distribution and Full Copper Interconnection

Shizhen Li¹, ChenShan Gao¹, Xu Liu², Huaiyu Ye^1,2, Guoqi Zhang²

¹Southern University of Science and Technology. China; ²Delft University of Technology, The Netherlands

Thermo-Mechanical Warpage Prediction and Validation of Large Chiplet Packages

Klara Volckaert, Riet Labie, Kurt Herremans, Kris Vanstreels, Mario Gonzalez, Bart Vandevelde

Imec, Belgium

Numerical Simulation of a Neuron-Electrode Interface in Python and Ansys

Patrick Kohaus¹, Arwed Schütz¹, Dennis Hohlfeld², Tamara Bechtold^1,2

¹Jade University of Applied Sciences, Germany; ²University of Rostock, Germany

3D Parametric Simulations of Mass Transport and Mechanical Properties of a Microfluidic Barrier-on-Chip Device

Sjoerd D.M de Jong, Pratik V. Tawade, Massimo Mastrangeli, Willem D. van Driel

Delft University of Technology, The Netherlands

Multiphysics Topology Optimization for MEMS

Yongbo Deng, Jan G. Korvink

Institute of Microstructure Technology (IMT), Karlsruhe Institute of Technology (KIT), Germany

Layout-oriented Design of MEMS Acceleration Sensor and Evaluation of Packaging Effects

Alexey Shaporin¹, Annett Krusch², Sebastian Weidlich², Petra Kuenzel¹, Christian Behl¹, Roman Forke¹, Karla Hiller², Susann Hahn², Danny Reuter²

¹FhI ENAS, Germany; ²TU Chemnitz, Germany

Design Optimization of a Multi-resonant Folded Beam Piezoelectric Energy Harvester Using an Efficient Two-phase Topology Optimization

Siyang Hu^1,2, Dennis Hohlfeld¹, Tamara Bechtold^2,1

¹University of Rostock, Germany; ²Jade University of Applied Sciences, Germany

Physics-based State-space Model for Self-sensing in Piezoelectric MEMS Microphones

Nikita Ovsiannikov¹, Til Friebe¹, Christian Bretthauer², Gabriele Schrag¹

¹Technical University of Munich, Germany; ²Infineon Technologies AG, Germany

Lab-on-Chip Acoustic Detection Platform: Design, Fabrication and Performance Evaluation

Makrem BEN ABDELKADER^1,2,3, Hatem DAHMANI¹, Reda AITAYAD¹, Samuel DUPONT¹, Chérif DRIDI², Julien CARLIER¹

¹Univ. Polytechnique Hauts-de-France, France; ²NANOMISENE Laboratory, Tunisia; ³University of Sousse, Tunisia

An ANN-based Digital Twin for PCB Temperature Monitoring: Development and Validation

Jakub Korta, Krzysztof Hołoń, Grzegorz Wyszyński

Aptiv Services Poland

A Neural Network-Based Performance Assessment Approach for Heat-Dissipating Microchannels in Packages

Bo Sun, Zhenhao Tang, Kunzhao Li, Chunbing Guo

Guangdong University of Technology, China

Physics-inspired AI Models Trained on Abstract Synthetic Systems for Thermal Propagation

Helios Sanchis Alepuz, Monika Stipsitz

Silicon Austria Labs, Austria

Electro-thermal Co-simulation of SiC MOSFET Double-pulse Tests Using a Peak-power-threshold (PPT) Method for Junction-temperature Estimation

Filip Simjanoski, Nils Lurie, Mladen Gagic, Aditya Shekhar, Kouchi Zhang, Willem van Driel

TU Delft, The Netherlands

Applying the Global-local Approach with the Equivalent Structure for Reliability Assessment of the Multilevel Area Array Interconnects

Cadmus Yuan, Si-Han Lin, Jian-Cheng Hong

Feng Chia University, Taiwan

Deep Learning-driven Undamaged-to-damaged Response Translation for Proactive Structural Health Monitoring of Semiconductor Probe Cards

Mehdi Bejani^1,2, Marco Mauri², Stefano Mariani¹

¹Politecnico di Milano, Italy; ²Technoprobe, Italy

Development of Piezoelectric Patterns by Direct 3D Writing Applied to Atomic Layer Deposition

Francesco Pio Merafina, Anna Maria Coclite

University of Bari, Italy

Comparative Evaluation Methodology for Full Order and Superelement-containing Finite Element Models for Predicting Solder Joint Fatigue

Chengzhe Lyu, Harshitha Sriramulu, Karsten Meier, Karlheinz Bock, Juliana Panchenko

Technische Universität Dresden, Germany

Effect of Underfill Cracking and Interfacial Delamination on Reliability of Advanced Electronic Packages

Pranav Srinivasan¹, Aniket Bharamgonda¹, Abhijit Dasgupta¹, Rohit Gandhi², Christopher Bailey², George Dogiamis³

¹University of Maryland, United States of America; ²Arizona State University, United States of America; ³Deca Technologies, United States of America

Detecting Single Event Transients on a 28-nm SRAM-based FPGA under Neutron Radiation Exposure

Eike Hendrik Trumann¹, Gia Bao Thieu¹, Kirsten Weide-Zaage², Dorian von Wolff³, Andre Bausen³, Alexander Müller³, Guillermo Payá-Vayá¹

¹TU Braunschweig, Germany; ²Leibniz Universität Hannover, Germany; ³Bundeswehr Research Institute for Protective Technologies and CBRN Protection (WIS), Germany

On Moisture Absorption in Non-hermetic Packages, Finite Element Model Validation through Real-time Characterization

Samuele Zalaffi, Carlo Passagrilli, Marco Rovitto

STMicroelectronics, Italy

Criticality Assessment Methodology of Microvias in Printed Circuit Boards

Vikram G Kamble^1,2,3, Julia Zuendel¹, Thomas Krivec¹, Thomas Antretter², Peter Fillip Fuchs³

¹AT&S Austria Technologie & Systemtechnik, Austria; ²Montanuniversität Leoben, Austria; ³Polymer Competence Center Leoben GmbH, Austria

Asymmetric Warpage: Determination of a Curvature Scale for Warpage Predictions

Vincenzo Vinciguerra, Giuseppe Luigi Malgioglio, Marco Renna

STMicroelectronics, Italy

Electromagnetic Finite Element Modeling of PCB-Embedded Toroidal Inductors Featuring Iron-powder Magnetic Cores

Mohamed Alkurdi^1,2,3, Jesus Acero⁴, Christian Martin⁵, Mounira Bouarroudj^3,6

¹Université Paris-Saclay, France; ²Centre national de la recherche scientifique (CNRS), France; ³Satie Lab, France; ⁴Universidad de Zaragoza, Spain; ⁵Universite Claude Bernard Lyon 1 Ampére, France; ⁶Université Gustave Eiffe, France

Integrated Multi-physics Optimisation of MOSFET Power Modules for Reduced Parasitic Inductance and Enhanced Thermal Reliability

Thibault Jacobs

Noesis Solutions NV, Belgium

Additive Manufacturing of Copper and Ceramic for Electronics Cooling and Packaging

Saeed Akbari, Erik Adolfsson, Cristina Rusu, Michael Salter

RISE Research Institutes of Sweden, Sweden

Experimental and Numerical Investigations of Mechanical Failure for a Direct Bonded Copper in Power Modules under Assembly Processes

H.-Y. Chan, Kuo-Chi Liao

National Taiwan University, Taiwan

Fabrication and FEM Analysis of Flip-chip Bonded Si Chip with Au Stud Bumps on Si Interposer

Seonho Seok¹, Michele Casselle², David Bouville¹, Etinne Herth¹, Jaehyun Kim¹

¹C2N-UPSACLAY, France; ²2Karlsruhe Institute of Technology (KIT), Germany

Surrogate Model Development for Transient Thermal Response of Power Devices via Enhanced Integration Neural Network Functionality

Yoshyuki Yamauchi, Yoshiharu Iwata, Hidefumi Wakamatsu

The University of Osaka, Japan

Improving Simulation Efficiency of Chiplet Package Solder Bump Reliability Analysis Using Equivalent Beam Model

Chia-En Chang, Qinghua Su, Kuo-Ning Chiang

National Tsing Hua University, Taiwan

Design Analysis of Wire Bonding Reliability for Low Profile Quad Flat Package Based on Numerical Methods

Chih-Yen Su, Nai-Jen Hsuan

Realtek Semiconductor Corp.

Parametric Assessment of Cu Pillar Microbump Interconnects Co-design for Thermomechanical Reliability

Pranav Srinivasan, Joseph Hutchinson, Abhijit Dasgupta

University of Maryland, United States of America

Transformer-enhanced Metamodels for Optimizing Material, Geometric, and Process Temperature Features in Warpage Control of Package-on-package Assemblies

Fredy John Porathur^1,2, Fabian Huber¹, Peter Fuchs³, Dieter P. Gruber^2,3

¹ams OSRAM AG, Austria; ²Montanuniversität Leoben, Austria; ³Polymer Competence Centre Leoben (PCCL) GmbH, Austria

Optimized Design of a Liquid Precursor Flow-control Sensor System for Semiconductor Deposition Equipment via Heat-transfer Simulation

Jae-Seong Jeong¹, Yu-Hwan Kim²

¹Korea Electronics Technology Institute (KETI), Korea, Republic of (South Korea); ²YHENS, Korea, Republic of (South Korea)

The Metal-Insulator Transition of VO2: A Fresh Look at a Prototypical System

Volker Eyert

Materials Design SARL, France

Efficient Space Charge Current Injection in Silicon Implanted Fe-doped Beta-Ga2O3 Crystals Resulting in Extremely Low Thermal Breakdown Field

Pierre Gallarday¹, Aniol Vellvehí¹, Verena Leitgeb², Miquel Vellvehí¹, José Rebollo¹, Josep Montserrat¹, Barbara Kosednar-Legenstein², Lisa Mitterhuber², Elke Kraker², Anton Köck², Amador Pérez-Tomás¹

¹Institute of Microelectronics of Barcelona (IMB-CNM-CSIC), Spain; ²Materials Center Leoben (MCL), Austria

Physics-of-Failure Based Reliability Investigations of Copper Sintered Die Attaches for Wide Band Gap Power Electronics

Jens Heilmann¹, Philipp Wittwer², Jannis Schuh³, Corinna Grosse-Kockert⁴, Adrian Stelzer², Dirk Busse³, Mohamad Abo Ras⁴, Bernhard Wunderle^1,5

¹Technische Universität Chemnitz, Germany; ²Nano-Join GmbH, Berlin, Germany; ³budatec GmbH,12487 Berlin, Germany; ⁴berliner Nanotest und Design GmbH, Germany; ⁵Fraunhofer ENAS, Chemnitz, Germany

Transformer based SHM of Semiconductor Probe Cards: Unifying Optimal Sensor Placement and Missing Data Imputation for Reliable Online Monitoring

Mehdi Bejani^1,2, Marco Mauri², Stefano Mariani¹

¹Politecnico di Milano, Italy; ²Technoprobe, Italy

Comparison between Linear and Nonlinear Modelling of Viscoelastic Material Behaviour on the Example of Polymer Encapsulation for Advanced Electronic Virtual Design

Robert Schwerz, Mike Röllig

Fraunhofer IKTS, Germany

Design and Optimization of MEMS Variable-Area Capacitive Pressure Sensors for Improved Sensitivity and Linearity in Fingertip Tactile Sensing

Rhiyan Mae Ladlad, Jarod Soriano, Walton Matthew Kuo, Ralph Maru Grande, Rafael Pangilinan, Maria Theresa De Leon

University of the Philippines, Philippines

Extending the Advanced Mixed-Mode Bending Method toward Subcritical Interfacial Fracture Characterization under Cyclic Loading

Marcus Schulz^1,2, Daniel May², Mohamad Abo Ras¹, Bernhard Wunderle²

¹Berliner Nanotest und Design GmbH, Germany; ²TU Chemnitz, Germany

Noise-preserving Circuit Synthesis from Vector-fitted Macromodels

Ferdinand Schiller^1,2, Christian Görner Tenorio^1,2, Christian Bretthauer¹, Gabriele Schrag²

¹Infineon Technologies AG, Germany; ²Technical University of Munich, Germany

Rapid and Accurate Estimation of Acoustic Coupling in MUT Devices Using finite Element Modeling

Samer Houri, Rachid Haouari, Bart Weekers, Veronique Rochus

imec, Belgium

FEM-based Design Guidelines for the Thermal Management of PCBs with Paralleled GaN HEMT Devices

Antonio Pio Catalano¹, Ciro Scognamillo¹, Vincenzo d'Alessandro¹, Paweł Górecki^1,2

¹University of Naples Federico II, Italy; ²Gdynia Maritime University, Poland

Thermal Analysis of Chiplet Packaging Using an Equivalent Material Modeling Approach

Wei-Fong Wang, Yu-Ting Su, Qinghua Su, Kuo-Ning Chiang

National Tsing Hua University, Taiwan

Liquid-assisted Contactless Adhesive Bonding: Experimental validation and 2D Multiphysics Simulation

Ahmed Abdelwahab¹, Zohreh Farmani², Hans Kuipers³, Marcel Tichem², Jiajie Fan¹, G. Q. Zhang¹

¹Delft University of Technology (TU Delft), Netherlands, ECTM; ²Delft University of Technology (TU Delft), Netherlands, PME; ³ITEC Equipment

CNN-based Prediction of Thermo-mechanical Properties of PCB and Interposer Conductive Layers with WGAN-augmented Data

Qinghua Su, Kuo-Ning Chiang

National Tsing Hua University, Taiwan

Raman Spectroscopy for Rapid Assessment of Topography-dependent Oxidation in Copper Foils

Verena Leitgeb¹, Barbara Kosednar-Legenstein¹, Elke Kraker¹, Julien Magnien¹, Maike Sagerer², Julia Zündel²

¹Materials Center Leoben Forschung GmbH, Austria; ²AT&S Austrian Technologie & Systemtechnik Aktiengesellschaft

Modelling Framework to Capture Differences in Anisotropy Between Primary and Secondary Creep Deformation in Solder Interconnects During Rapid Temperature Excursions

Aniket Bharamgonda¹, Pranav Srinivasan¹, Abhijit Dasgupta¹, Shran Kishor², Abdullah Fahim², Jeroen Zaal²

¹University of Maryland, USA; ²NXP Semiconductors, USA

Modeling Electrode and Microchannel Geometry for Detection of Cadmium (Cd), Lead (Pb), and Copper (Cu) in Drinking Water through a Capillary-driven Microfluidic Electrochemical Sensor

Victore Anand Abao, Hannah Isabel Basbas, Jericho Kent Co, Ralph Maru Grande, Rafael Pangilinan, Maria Theresa De Leon

University of the Philippines Diliman, Philippines

Reverse Engineering of QFN Epoxy Mold Compound Properties using Digital Image Correlation

Simon Kuttler¹, Marius van Dijk¹, Olaf Wittler¹, Martin Schneider-Ramelow²

¹Fraunhofer IZM, Germany; ²Technische Universität Berlin, Germany

Thermal Cycling Lifetime of BGA Microcontroller Package and Influence of Assembly on Aluminum Baseplates

Iulia-Eliza Tinca, Florian Pielmeier, Martin Niessner, Paola Altieri-Weimar, Sophia Stautner, Mario Soric

Infineon Technologies AG, Germany

A Multi-Agent System for Automated Lifetime Prediction of Power Devices

Jialong Liang¹, Jiajie Fan^1,2, Willem van Driel¹, Guoqi Zhang¹

¹Delft University of Technology, The Netherlands; ²Fudan University, China

Quantitative, Statistically Robust Characterization of Solder Joint Geometry and Voiding in Commercial BGA Assemblies

Jana Faes¹, Matthieu Boone², Jaianth Vijayakumar³, Nicolas Lammens⁴, Wim Van Paepegem^1,5

¹Department of Materials, Textiles and Chemical Engineering (MaTCh), Ghent University; ²Centre for X-ray Tomography, Ghent University; ³European Synchrotron Radiation Facility, 71 Avenue des Martyrs, 38000, Grenoble, France; ⁴Siemens Industry Software NV; ⁵FlandersMake@UGent-MIRO

A SAW-based Platform of AlN Layer on Si for Accelerated Stress Testing of Micro and Nano Structures

Arash Mohammadi¹, Chris Stöckel², Sven Voigt², David Kriebel¹, George Boldeiu³, Dan Vasilache³, Alexandru Muller³, Jan Mehner¹, Bernhard Wunderle¹

¹University of Chemnitz, Germany; ²Fraunhofer Institute for Electronic Nano Systems ENAS, Germany; ³National Institute for Research and Development in Microtechnologies (IMT), Romania

Design, Structural Characterization, and Superconducting Behavior of Niobium Thin-Film Microstructures for Ion-Trap Quantum Computers: Toward J–B–T Critical Surface Mapping for Cryogenic 3D SiP Integration

Awais Qadir^1,2, Uwe Zschenderlein¹, Nathanael Jöhrmann^1,2, Peter Meszmer^1,2, Carlos Rincon-Ruiz^1,2, Vogel Klaus³, Christian Hofmann³, Sounak Nandi³, Maham Ayaz^1,2, Marcel Melzer³, Sven Zimmermann³, Bernhard Wunderle^1,2,3,4

¹Chemnitz University of Technology, Germany; ²TU Chemnitz, Germany; ³Fraunhofer Institute for Electronic Nano Systems – ENAS, Germany; ⁴Centre for Microtechnologies (ZfM) Chemnitz, Germany

Failure Analysis of Electronic Packaging using Eddy Current Thermography

Yanan Wu^1,2, Daniel May², Mohamad Abo Ras¹, Bernhard Wunderle^2,3

¹Berliner Nanotest and Design GmbH, Germany; ²Chemnitz University of Technology, Germany; ³Fraunhofer ENAS, Germany

Development of a Method for Parylene-Based Interface Toughness Characterization under Fatigue Loads for Electronic Packaging Applications

Carlos Rincon-Ruiz¹, Martin Kuehn², Uwe Zschenderlein¹, Imants Cirulis², Franz Selbmann², Patrick Tuerk¹, Frank Roscher², Bernhard Wunderle^1,2

¹TU Chemnitz, Germany; ²Fraunhofer ENAS, Germany

Verification of the Mold Material Model Through Simulation Studies At The Product Level

Akshay Vivek Panchwagh¹, Przemyslaw Jakub Gromala², Sven Rzepka³

¹Robert Bosch GmbH, Germany; ²Robert Bosch Kft., Hungary; ³Fraunhofer ENAS, Germany

Impact of Thermal Gap Filler vs. Thermal Gap Pad Materials on the Solder Joint Lifetime of eWLB Packages in Topside Cooling Setups

Martin Niessner, Peter Lutz, Walter Hartner, Harald Preu, Juliane Junesch, Holger Mai

Infineon Technologies AG, Germany

Effect of PFAS Removal on the Underfill and TIM Interface Properties and Performance

Pradeep Lall, Padmanava Choudhury, Aathi Pandurangan

Auburn University, United States of America

A Simple and Thermo-mechanically Robust Multiaxial Force Sensing Scheme Based on Polymer-MEMS and AI-based Signal Post-processing for Smart Skin Technologies

Bernhard Wunderle^1,2,3,4, Peter Meszmer^1,4, Daniel May¹, Uwe Zschenderlein¹

¹TU Chemnitz, Germany; ²Fraunhofer ENAS, Germany; ³Centre for micro- and nanotechnologies (ZfM) at TU Chemnitz, Germany; ⁴Centre for Materials, Architectures and Integration of Nanomembranes (MAIN), Germany

Modeling of nonlinear ferroelectric microactuator with Fourier Neural Operator

Binh Nguyen, Piotr Czarnecki, Guilherme Brondani Torri, Véronique Rochus

imec, Belgium

AVA-Based Surrogate Modeling of Localized Strain in Microvia

Qiulin Yu^1,2,3, Thomas Krivec¹, Jan Albrecht⁴, Tobias Horn⁴, Karl Fendt¹, Dieter P. Gruber^2,3

¹Austria Technologie & Systemtechnik AG; ²Montanuniversitaet Leoben; ³Polymer Competence Center Leoben GmbH; ⁴Fraunhofer Institute for Electronic Nano Systems (ENAS)

A Multi-agent Digital Twin Framework for Health Monitoring of SiC MOSFETs in Power Converters

Alireza Mehrabi, Zihan Zhang, Filip Simjanoski, Rene H. Poelma, Willem D. van Driel, GuoQi Zhang

Delft University of Technology, Netherlands, The

AI Surrogate Model for PBGA Solder Fatigue Assessment Using Progressive Transfer Learning with Multi-fidelity Data

Cadmus Yuan, Jian-Cheng Hong, Pin-Sian Li

Feng Chia University, Taiwan

The Prediction of Solder Joint Geometries through the Characterization of the Micro-wetting Behavior on Component Metallizations – Experiments and Simulations

Cham Thi Trinh, Erik Wiss, Jilin He, Steffen Wiese

Universität des Saarlandes, Germany

Thermo-elastic-viscoplastic Damage Model for Sn-Ag-Cu Solder

Torsten Hauck¹, Aleksandr Morozov¹, Wolfgang H. Müller¹, Golam Rakib Mazumder², Jeffrey C. Suhling²

¹TU Berlin, Germany; ²Auburn University, USA

Numerical analysis of solder-joint stress during the process of encapsulating an entire PCBA

Harald Ziegelwanger¹, Mario Gschwandl², Thomas Hollinger³, Venu Prakash Kasinikota³, Peter Fuchs³, Margit Lang³

¹Elastic-Simulations GmbH, Germany; ²Ottronic Regeltechnik Gesellschaft m.b.H., Germany; ³Polymer Competence Center Leoben GmbH, Germany

Modified Infrared Thermal Characterization Methodology coupled with Modelling for GaN RF Power Amplifier Transistors in Compact SMD Packages

Amir Mirza Gheytaghi, Fan Li, Albert van Zuijlen

Ampleon B.V.

Evaluation of the Young’s Modulus of Silicon Carbide from Specific Heat Measurements

Vincenzo Vinciguerra, Giuseppe Luigi Malgioglio, Marco Renna

STMicroelectronics, Italy

A New Packaging and Flow Boiling Cooling Concept for HPC Applications Enabling High Thermal and Thermo-mechanical Performance on Organic Substrates

Ralph Schacht¹, Mathias Koch², Tobias Gruen³, Joerg Arnold⁴, Ben Majed¹, Karl-Friedrich Becker², Mohamad Abo Ras³, Bernhard Wunderle⁴

¹BTU Cottbus, Germany; ²Fraunhofer IZM , Germany; ³Berliner Nanotest and Design GmbH, Germany; ⁴TU Chemnitz, Germany

Measurement of SiC Chip CTE using Digital Image Correlation

Dong-Hyeon Kim, Sung-Min Park, Sung-Uk Zhang

Dong-Eui University, South Korea

An Advanced Mission Profile-based Lifetime Assessment in Power Electronics Assembly Using Physics-informed Surrogate Modeling

Abantika Bose, Dawei Zhao, Jürgen Leib, Maximilian Hofmann

Fraunhofer IISB, Germany

Compact Thermal RC Model of a Multi Die Power Stage with In-Package Sensing for Remaining Useful Life Prediction

Ole J. Bergmann¹, Henk van Zeijl¹, Willem van Driel¹, Guoqi Zhang¹, René H. Poelma^1,2

¹Delft University of Technology, The Netherlands; ²Nexperia BV, The Netherlands

Using Fragility Surfaces for Remaining Useful Lifetime Estimations

Roland Niemeier¹, Günther Hasna¹, Alexander Kabakchiev², Dharshan Barkur², Przemyslaw Jakub Gromala³

¹Ansys Germany GmbH, Germany; ²Robert Bosch GmbH, Germany; ³Bosch Hungary Kft, Hungary

Efficient Reliability Assessment of Solder Joints in Automotive Applications Using HYPER-SUB

Mike Feuchter¹, Hanna Baumgartl¹, Martin Hanke¹, Bernhard Wunderle³, Sven Rzepka²

¹CADFEM Germany GmbH, Germany; ²Fraunhofer Institute for Electronic Nano Systems ENAS; ³Technische Universität Chemnitz

The Oxidation Effects of Copper Layer on AMB Substrate in Power Modules: A Multiscale Simulation Study

Ping Sun^1,2, Xiao Hu^1,2, Jiajie Fan¹, Emiel de Bruin², Willem van Driel¹, Guoqi Zhang¹

¹Delft University of Technology, The Netherlands; ²Boschman Technologies B.V.,The Netherlands

Study on Finite Element Analysis Modeling of Crack Propagation in Hybrid Bonding Structures Based on the Cohesive Zone Method

Yudong Yang^1,2, Xuanyu Ding², Ze Zhang¹, Haoyang Sun³, Fengze Hou¹, Rui Ma¹, Yu Zhang¹, Hongchao Zhang¹, Chi Zhang^2,4, Qiushi Kang¹, Fei Ding¹, Haibo Yang¹, Renxi Jin¹, Feng Ji³, Qidong Wang¹, Wei Wang^2,4,5, Liqiang Cao¹

¹Chinese Academy of Sciences, China; ²Peking University. China; ³Beijing Institute of Remote Sensing Equipment, China; ⁴National Key Lab of Micro/Nano Fabrication Technology, China; ⁵Beijing Advanced Innovation Center for Integrated Circuits, China

Constitutive Model Identification for Aluminium Wires and Potting Resin used in IGBT Power Modules

Clément Chedozeau^1,2, Merouane Ouhab², Natasha Vermaak³, François Hild¹

¹Université Paris-Saclay, France; ²Mitsubishi Electric R&D Centre Europe, France; ³Lehigh University, USA

A Defect-Informed Phase-Field Model for Gate Oxide Breakdown in SiC MOS Structures

Jinglin Li, Aditya Shekhar, Yaqian Zhang, Willem. D vanDriel, Guoqi Zhang

TU Delft, The Netherlands

Predicting Redistribution Layer (RDL) Interfacial Strength and Delamination in Fan-out Wafer Level Packaging

Rohit Gandhi¹, Nikhitha Poornabodha¹, Pallavi Jithendrriyan¹, Pranav Srinivasan², Aniket Bharamgonda², Christopher Bailey¹, Abhijit Dasgupta²

¹Arizona State University - Tempe, USA; ²University of Maryland, USA

Application of Bayesian Optimization to Wire Reliability Prediction in LED Packaging

Muyuan Li, Lavinia Israel, Lukas Geisler

ams-OSRAM International GmbH, Germany

Reliability Assessment of Advanced Fan-Out Packages Under Drop Impact Conditions

Meng-Kai Shih¹, Bo-Rui Ding², Chung-Chih Lin²

¹National Sun Yat-sen University, Taiwan; ²National Formosa University, Taiwan

Numerical Characterization of Acoustic Fields within Cylindrical Air-coupled Sono-photonic Waveguides

Sonja Wismath¹, Sören Soennecken¹, Hanna Malang², Jan Helge Dörsam¹, Yannick Schrödel^2,3,4, Christoph Haugwitz¹, Elena Wiemer¹, Nils Demuth¹, Stephan Schaumann¹, Christoph M. Heyl^2,3,4, Mario Kupnik¹

¹Technische Universität Darmstadt, Germany; ²Deutsches Elektronen-Synchrotron DESY, Germany; ³Helmholtz Institute Jena, Germany; ⁴GSI Helmholtzzentrum für Schwerionenforschung GmbH, Germany

Piezoelectric Contour Mode Resonators for Fast & Power-efficient On-chip Acousto-optic Modulation

Ferdinand Schiller^1,2, Sofia Cano Castro^3,4, Christian Görner Tenorio^1,2, Christian Bretthauer¹, Gabriele Schrag²

¹Infineon Technologies AG, Germany; ²Technical University of Munich, Germany; ³Infineon Technologies Austria AG, Austria; ⁴ETH Zurich, Switzerland

In Situ Evaluation of an Antifouling Vibrating System for Marine Sensors

Fabrice Casset¹, Gallien Delattre¹, Sebastian Dinescu², Raphaelle Barry-Martinet², Kada Boukerma³, Catherine Dreanno³, Christine Bressy², Hugues Brisset², Jean-francois Briand², Mikael Colin¹

¹CEA-Leti, France; ²MAPIEM, University of Toulon, France; ³IFREMER, France

Influence of Low Temperature Swings on Solder Joint Reliability

Muhammad Musadiq¹, Romuald Roucou², Willem Van Driel¹, Rene Rongen², Guoqi Zhang¹

¹Delft University of Technology (TU Delft), Netherlands, The; ²NXP Semiconductors

Machine Learning for Microstructure Characterisation of Intermetallic Layers in BGA Solder Joints

Muhammad Umair Najeem^1,2, Razia Sulthana Abdul Kareem¹, Aidan Robinson², Patricia Ferrie², Stewart McCracken², Stoyan Stoyanov¹

¹University of Greenwich, United Kingdom; ²Materials Consultancy Services Limited, Midlothian Innovation Centre, Scotland

Efficient Augmented Kalman Filter Parameter Tuning for Thermal Virtual Sensing in Electronic Systems

Matteo Depaola^1,2,3, Daniel De Gregoriis², Robin Bornoff², Bart Vandevelde¹, David Moens^3,4

¹imec; ²Siemens Digital Industries Software; ³KU Leuven; ⁴Flanders Make

Effect of Electroplating-induced Copper Thickness Variations on the Thermomechanical Reliability of Plated Through Holes

Marco Sperti¹, Nicolas Lammens¹, Chinmay Nawghane², Bart Vandevelde², Mathias Verbeke^3,4

¹Siemens Industry Software nv, Belgium; ²imec, Belgium; ³KU Leuven, Belgium; ⁴Flanders Make@KU Leuven, Belgium

Physics-informed Neural Network for Multi-scale Thermal Transport in AlGaN/GaN HEMT Heterostructures

Shehryar Imtiaz¹, Francesco Stranieri¹, Lisa Mitterhuber-Gress², Marco Mauri¹, Stefano Mariani³

¹Technoprobe, Cernusco Lombardone, Italy; ²Materials Center Leoben Forschung GmbH (MCL), Austria; ³Department of Civil and Environmental Engineering, Politecnico di Milano, Italy

Hybrid Zener–NTC Dynamic Circuit for Active Hot-spot Mitigation in Photovoltaic Modules

Gerardo Saggese, Antonio Pio Catalano, Zain ul Abdin Qureshi, Monica De Riso, Pierluigi Guerriero, Santolo Daliento

University of Napoli Federico II, Italy

Influence of Heat Source Size and Location on the Comparative Performance of Vapor Chambers and Copper Heat Spreaders

Wee Jian Ng, Jeff Punch, Vanessa Egan

University of Limerick, Ireland

Advanced 3D Modeling of Reactive Multilayer Systems for Chip- and Wafer-Level Bonding Applications

Sounak Nandi, Klaus Vogel, Christian Hofmann, Silvia Braun

Fraunhofer Institute for Electronic Nano Systems, Germany

Research on Design Optimization of Temperature and Current Sharing Uniformity of SiC HybridPACK Drive Power Modules Under MultiPhysics Coupling

Yueqian Wu¹, Hanshi Wang², Yong Wang³, Chunjian Tan², Huaiyu Ye^2,4, Wei Zhang¹, Guoqi Zhang⁴

¹Southern University of Science and Technology, People's Republic of China; ²Southern University of Science and Technology, China; ³AccoPower, China; ⁴Delft University of Technology, The Netherlands

Surrogate-Integrated, Simulation-Driven Digital Twin for Thermoset Molding Processes

Venu Prakash Kasinikota¹, Alexander Steiner¹, Wolfgang Muehleisen², Markus Grinschgl³, Peter Fuchs¹, Margit Christa Lang¹

¹Polymer Competence Center Leoben GmbH (PCCL), Germany; ²Silicon Austria Labs GmbH (SAL), Austria; ³GIPRO GmbH, Austria

Software-agnostic Thermal-mechanical Model Exchange via FMUs for Microelectronics Reliability Simulation

Michiel van Soestbergen

NXP Semiconductors, Netherlands, The

A Minimal-Interface Reduced-Order Modeling Approach for Including Convection Effects in Thermomechanical Field Simulation

Max Keller², Tamara Bechtold¹

¹CADFEM Germany GmbH, Germany; ²Jade University, Germany

Subcritical Crack Propagation in Solder Resist Materials During Fatigue Bulge Testing in Experiment and Simulation

Brinda George¹, Ingolf Rau¹, Georg M. Reuther¹, Martin R. Niessner¹, Uwe Zschenderlein², Bernhard Wunderle²

¹Infineon Technologies AG Munich, Germany; ²TU Chemnitz, Germany

Elastic-plastic Temperature and Porosity dependent Material Model for Sinter Silver with Minimal Measurement Effort by using RVE

Tobias Daniel Horn^1,2, Jan Albrecht^1,2, Sven Rzepka^1,2

¹Fraunhofer ENAS, Micro Materials Center; ²Technical University of Chemnitz, Center for Micro and Nanotechnologies

Moisture Transport under Power Cycling in Silicone-gel Encapsulated Power Modules

Zoubir Khatir, Mounira Bouarroudj, Ali Ibrahim

SATIE, Gustave Eiffel University, France

Modelling Approach to Assess Localized Strain Effects in Copper Plated Through Holes for Highly Reliable PCBs

Janine Conrad¹, Martin Schneider-Ramelow², Olaf Wittler¹

¹Fraunhofer IZM, Germany; ²TU Berlin, Germany

Optimizing Multilevel Microvia Structures for Thermo-mechanical Reliability in High-speed HDI PCBs

Chinmay Nawghane¹, Maarten Cauwe¹, Marnix Van De Slyeke², Stan Heltzel³

¹imec, Belgium; ²ACB, Belgium; ³ESA-ESTEC, The Netherlands

PCB embedding: A Case Study on MOSFETs and more

René Poelma¹, Ole Bergman², Jue Chen³, Nikhil Gupta², Rami Younis², Willem van Driel², Guo Qi Zhang²

¹Nexperia B.V., The Netherlands; ²Delft Universtiy of Technology, The Netherlands; ³Schweizer Electronic AG, Germany

A Viscoelastic Effective Model and Characterization Method for Woven Composites and a Homogenization Approach for Applications in Complex PCB Simulations

Aleksei Sokolov¹, Marius van Dijk², Anne Groth², Olaf Wittler², Martin Schneider-Ramelow¹

¹Technische Universität Berlin, Germany; ²Fraunhofer Institute for Reliability and Microintegration (IZM), Germany

Investigating the Switching Loss-Reliability Trade-Off in TFP-MOSFET Voltage Regulators through Calibrated SPICE Simulations

Giorgio Eliseo^1,2, Ciro Scognamillo¹, Antonio Pio Catalano¹, Vincenzo d'Alessandro¹, Francesco De Paola², Jaume Roig Guitart³, Petr Betak³, James Victory³, Dean Probst⁴

¹University of Naples "Federico II", Italy; ²onsemi, Analog and Mixed-Signal Group, Milan, Italy; ³onsemi, Central Engineering, Oudenaarde, Belgium; Roznov pod Radhostem, Czech Republic; Sunnyvale, CA, USA; ⁴onsemi, Power Solution Group, Hopewell Junction, NY

Thermal and electrical simulations of Rad-hard Si VDMOS Transistors

EUSEBIO RODRIGO¹, MIQUEL VELLVEHI¹, XAVIER JORDA¹, LLORENÇ LATORRE², JOSÉ CAMPS², JOSÉ REBOLLO¹

¹CNM CSIC Spain; ²Power electronics Llíria, Spain

A Fast Multidomain System-level Simulation Model for GaN Transistor Package Optimization

Damiano Caponi, Giovanna Grosso, Abinash Pradhan, Ali Roshanghias

Silicon Austria Labs GmbH, Austria

Electromigration Simulation of C4 Solder Bumps with Cu and Ni Under-bump Metallization

Facheng Zhao¹, Liping Zhu², YongTaek Lee³, JaeMyeong Kim³

¹STATS ChipPAC, Singapore; ²STATS ChipPAC, USA; ³STATS ChipPAC, Korea

Artificial Intelligence (AI)-Enabled Reliability Prediction and Prognostics for Electronic Packages: A Perspective on Data, Models, and Applications

Xuejun Fan¹, Cadmus Yuan², Xinyu Liu¹

¹Lamar University, United States of America; ²Feng Chia University, Taichung, Taiwan

From Chip to AI Factory: A Five-Year Roadmap for Silicon Suppliers and Hyperscalers

Gamal Refai-Ahmed¹, Mohammed Shaheen², CW Chen³

¹AMD, USA; ²Humain, Saudia Arabia; ³Supermicor, Taiwan