Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
Sun 19 Apr Mon 20 Apr Tue 21 Apr Wed 22 Apr
Sun19Apr
Alder+Poplar
Hazel
Pine
No specific location / location unknown
08:00
09:00
10:00
11:00
12:00
13:00
14:00
15:00
16:00
17:00
18:00
19:00
20:00
21:00
22:00
PDC 5
2:00pm - 5:00pm
Alder+Poplar
Location: Alder+Poplar
»Practical Model Order Reduction and Linear Superelements in Ansys Mechanical for Multiphysics Applications«

Course Instructors: Mike Feuchter & Max Keller, CADFEM, Germany
PDC 1
9:00am - 12:00pm
Hazel
Location: Hazel
»Current and Future Challenges and Solutions in AI & HPC System and Thermal Management«

Course Instructor: Dr. Gamal Refai-Ahmed, AMD, USA
PDC 3
2:00pm - 5:00pm
Hazel
Location: Hazel
»Warpage Modelling and Validation in Fan-out Wafer/Panel Level Packaging and Assembly Processes«

Course Instructors: Olaf Wittler & Saskia Huber, Fraunhofer IZM, Germany
PDC 2
9:00am - 12:00pm
Pine
Location: Pine

»Advanced Packaging for Chiplets and Heterogeneous Integration«

Course Instructor: John H Lau, Unimicron Technology Corporation, USA

PDC 4
2:00pm - 5:00pm
Pine
Location: Pine
»Advanced Packaging for MEMS and Sensors«

Course Instructor: Horst Theuss, Infineon Technologies AG, Germany
Lunch
12:00pm - 2:00pm
Room: ZAZEN Club & Lounge