Index of Authors
A list of all persons who contribute to the sessions of this conference. Please select a letter below to list all persons with the corresponding last name. Select the presentation in the right-hand column to access session and presentation details.
List Options: Authors and Sessions · Authors and Sessions (Short Titles) · Authors and Presentations
| Author(s) | Organization(s) | Session |
|---|---|---|
| Abao, Victore Anand | University of the Philippines Diliman, Philippines | Interactive Poster Session |
| Abdalla, Omer Mohamed Osman | Department of Civil and Environmental Engineering, Politecnico di Milano, Italy. | Ultrasound Devices |
| Abdelwahab, Ahmed | Delft University of Technology (TU Delft), Netherlands, ECTM | Interactive Poster Session Presenter |
| Abdul Kareem, Razia Sulthana | University of Greenwich, United Kingdom | Mirelai Session |
| Abo Ras, Mohamad | Berliner Nanotest und Design GmbH, Germany | Interactive Poster Session Interactive Poster Session Interactive Poster Session Thermal Experimental Characterization |
| Acero, Jesus | Universidad de Zaragoza, Spain | Interactive Poster Session |
| Adolfsson, Erik | RISE Research Institutes of Sweden, Sweden | Interactive Poster Session |
| AITAYAD, Reda | Univ. Polytechnique Hauts-de-France, France | MEMS Sensors |
| Akbari, Saeed | RISE Research Institutes of Sweden, Sweden | Interactive Poster Session Presenter |
| Albrecht, Jan | Fraunhofer ENAS, Chemnitz, Germany; Fraunhofer Institute for Electronic Nano Systems (ENAS); Fraunhofer ENAS, Micro Materials Center; Technical University of Chemnitz, Center for Micro and Nanotechnologies | Interconnect Degradation Machine Learning-based Methods Material Modeling for Packaging |
| Alincant, David | CEA LETI, France | Ultrasound Devices |
| Alkurdi, Mohamed | Université Paris-Saclay, France; Centre national de la recherche scientifique (CNRS), France; Satie Lab, France | Interactive Poster Session Presenter |
| Altieri-Weimar, Paola | Infineon Technologies AG, Germany | Interactive Poster Session |
| Antonietti, Paola | MOX, Dipartimento di Matematica, Politecnico di Milano, Italy. | Ultrasound Devices |
| Antretter, Thomas | Montanuniversität Leoben, Austria | Interactive Poster Session Interconnect Degradation |
| ARATI, Baptiste | IRT Saint Exupéry, France. | Interconnect Degradation |
| Arnold, Joerg | TU Chemnitz, Germany | Thermal Experimental Characterization |
| Ayaz, Maham | Chemnitz University of Technology, Germany; TU Chemnitz, Germany | Interactive Poster Session |
| Bailey, Christopher | Arizona State University - Tempe, USA | Advanced Packaging Reliability |
| Bailey, Christopher | Arizona State University, United States of America | Interactive Poster Session |
| Barkur, Dharshan | Robert Bosch GmbH, Germany | Mission Profiles & RUL |
| Barry-Martinet, Raphaelle | MAPIEM, University of Toulon, France | Advanced MEMS |
| Basbas, Hannah Isabel | University of the Philippines Diliman, Philippines | Interactive Poster Session |
| Baumgartl, Hanna | CADFEM Germany GmbH, Germany | Mission Profiles & RUL |
| Bausen, Andre | Bundeswehr Research Institute for Protective Technologies and CBRN Protection (WIS), Germany | Interactive Poster Session |
| Bechtold, Tamara | Jade University of Applied Sciences, Germany; University of Rostock, Germany; CADFEM Germany GmbH, Germany | Advanced Simulation Methods Digital Twins & Model Exchange MEMS Sensors |
| Becker, Karl-Friedrich | Fraunhofer IZM , Germany | Thermal Experimental Characterization |
| Behl, Christian | FhI ENAS, Germany | MEMS Sensors |
| Bejani, Mehdi | Politecnico di Milano, Italy; Technoprobe, Italy | Interactive Poster Session Presenter Interactive Poster Session Presenter |
| BEN ABDELKADER, Makrem | Univ. Polytechnique Hauts-de-France, France; NANOMISENE Laboratory, Tunisia; University of Sousse, Tunisia | MEMS Sensors Presenter |
| Ben Dhiab, Ayoub | CEA LIST, France | Ultrasound Devices |
| Bergman, Ole | Delft Universtiy of Technology, The Netherlands | PCB Reliability |
| Bergmann, Ole J. | Delft University of Technology, The Netherlands | Mission Profiles & RUL Presenter |
| Betak, Petr | onsemi, Central Engineering, Oudenaarde, Belgium; Roznov pod Radhostem, Czech Republic; Sunnyvale, CA, USA | Multiphysics Simulation for Packaging |
| Bharamgonda, Aniket | University of Maryland, USA; University of Maryland, United States of America | Advanced Packaging Reliability Interactive Poster Session Interactive Poster Session |
| Bock, Karlheinz | Technische Universität Dresden, Germany | Interactive Poster Session |
| Boldeiu, George | National Institute for Research and Development in Microtechnologies (IMT), Romania | Interactive Poster Session |
| Boone, Matthieu | Centre for X-ray Tomography, Ghent University | Interactive Poster Session |
| Bornoff, Robin | Siemens Digital Industries Software | Mirelai Session |
| Bose, Abantika | Fraunhofer IISB, Germany | Mission Profiles & RUL Presenter |
| Bouarroudj, Mounira | Satie Lab, France; Université Gustave Eiffe, France | Interactive Poster Session |
| Bouarroudj, Mounira | SATIE, Gustave Eiffel University, France | Material Modeling for Packaging |
| Boukerma, Kada | IFREMER, France | Advanced MEMS |
| Bouville, David | C2N-UPSACLAY, France | Interactive Poster Session |
| Braun, Silvia | Fraunhofer Institute for Electronic Nano Systems, Germany | Thermal Design Modeling and Experimental Characterization |
| Bressy, Christine | MAPIEM, University of Toulon, France | Advanced MEMS |
| Bretthauer, Christian | Infineon Technologies AG, Germany | Advanced MEMS Interactive Poster Session MEMS Sensors |
| Briand, Jean-francois | MAPIEM, University of Toulon, France | Advanced MEMS |
| Brisset, Hugues | MAPIEM, University of Toulon, France | Advanced MEMS |
| Busse, Dirk | budatec GmbH,12487 Berlin, Germany | Interactive Poster Session |
| CAMPS, JOSÉ | Power electronics Llíria, Spain | Multiphysics Simulation for Packaging |
| Cano Castro, Sofia | Infineon Technologies Austria AG, Austria; ETH Zurich, Switzerland | Advanced MEMS |
| Cao, Liqiang | Chinese Academy of Sciences, China | Materials Modelling |
| Caponi, Damiano | Silicon Austria Labs GmbH, Austria | Multiphysics Simulation for Packaging Presenter |
| CARLIER, Julien | Univ. Polytechnique Hauts-de-France, France | MEMS Sensors |
| Casselle, Michele | 2Karlsruhe Institute of Technology (KIT), Germany | Interactive Poster Session |
| Casset, Fabrice | CEA-Leti, France | Advanced MEMS Presenter Ultrasound Devices |
| Catalano, Antonio Pio | University of Naples Federico II, Italy; University of Naples "Federico II", Italy | Interactive Poster Session Presenter Multiphysics Simulation for Packaging Thermal Design Modeling and Experimental Characterization |
| Cauwe, Maarten | imec, Belgium | PCB Reliability |
| Chan, H.-Y. | National Taiwan University, Taiwan | Interactive Poster Session |
| Chang, Chia-En | National Tsing Hua University, Taiwan | Interactive Poster Session Presenter |
| Chedozeau, Clément | Université Paris-Saclay, France; Mitsubishi Electric R&D Centre Europe, France | Materials Modelling Presenter |
| Chen, CW | Supermicor, Taiwan | IEEE EPS Distinguished Lectures |
| Chen, Jue | Schweizer Electronic AG, Germany | PCB Reliability |
| Chiang, Kuo-Ning | National Tsing Hua University, Taiwan | Interactive Poster Session Interactive Poster Session Interactive Poster Session |
| Choudhury, Padmanava | Auburn University, United States of America | Mold & interface Materials |
| Cirulis, Imants | Fraunhofer ENAS, Germany | Mold & interface Materials |
| Co, Jericho Kent | University of the Philippines Diliman, Philippines | Interactive Poster Session |
| COCCETTI, Fabio | IRT Saint Exupéry, France. | Interconnect Degradation |
| Coclite, Anna Maria | University of Bari, Italy | Interactive Poster Session |
| Colin, Mikael | CEA-Leti, France | Advanced MEMS Ultrasound Devices |
| Conrad, Janine | Fraunhofer IZM, Germany | PCB Reliability Presenter |
| Corigliano, Alberto | Department of Civil and Environmental Engineering, Politecnico di Milano, Italy. | Ultrasound Devices |
| COUGO, Bernardo | IRT Saint Exupéry, France. | Interconnect Degradation |
| Czarnecki, Piotr | imec, Belgium | Machine Learning-based Methods |
| D. van Driel, Willem | Delft University of Technology, Netherlands, The | Machine Learning-based Methods |
| d'Alessandro, Vincenzo | University of Naples Federico II, Italy | Interactive Poster Session |
| d'Alessandro, Vincenzo | University of Naples "Federico II", Italy | Multiphysics Simulation for Packaging |
| DAHMANI, Hatem | Univ. Polytechnique Hauts-de-France, France | MEMS Sensors |
| Daliento, Santolo | University of Napoli Federico II, Italy | Thermal Design Modeling and Experimental Characterization |
| Dasgupta, Abhijit | University of Maryland, USA; University of Maryland, United States of America | Advanced Packaging Reliability Interactive Poster Session Presenter Interactive Poster Session Interactive Poster Session Presenter |
| de Bruin, Emiel | Boschman Technologies B.V.,The Netherlands | Materials Modelling |
| De Gregoriis, Daniel | Siemens Digital Industries Software | Mirelai Session |
| de Jong, Sjoerd D.M | Delft University of Technology, The Netherlands | Advanced Simulation Methods Presenter |
| De Leon, Maria Theresa | University of the Philippines, Philippines; University of the Philippines Diliman, Philippines | Interactive Poster Session Interactive Poster Session |
| De Paola, Francesco | onsemi, Analog and Mixed-Signal Group, Milan, Italy | Multiphysics Simulation for Packaging |
| De Riso, Monica | University of Napoli Federico II, Italy | Thermal Design Modeling and Experimental Characterization |
| Delattre, Gallien | CEA-Leti, France | Advanced MEMS |
| Demuth, Nils | Technische Universität Darmstadt, Germany | Advanced MEMS |
| Deng, Yongbo | Institute of Microstructure Technology (IMT), Karlsruhe Institute of Technology (KIT), Germany | Advanced Simulation Methods Presenter |
| Depaola, Matteo | imec; Siemens Digital Industries Software; KU Leuven | Mirelai Session Presenter |
| Dinescu, Sebastian | MAPIEM, University of Toulon, France | Advanced MEMS |
| Ding, Bo-Rui | National Formosa University, Taiwan | Advanced Packaging Reliability |
| Ding, Fei | Chinese Academy of Sciences, China | Materials Modelling |
| Ding, Xuanyu | Peking University. China | Materials Modelling |
| Dogiamis, George | Deca Technologies, United States of America | Interactive Poster Session |
| Dörsam, Jan Helge | Technische Universität Darmstadt, Germany | Advanced MEMS |
| Dreanno, Catherine | IFREMER, France | Advanced MEMS |
| DRIDI, Chérif | NANOMISENE Laboratory, Tunisia | MEMS Sensors |
| Dudek, Rainer | Fraunhofer ENAS, Chemnitz, Germany | Interconnect Degradation Presenter |
| DUPONT, Samuel | Univ. Polytechnique Hauts-de-France, France | MEMS Sensors |
| Egan, Vanessa | University of Limerick, Ireland | Thermal Design Modeling and Experimental Characterization |
| Eliseo, Giorgio | University of Naples "Federico II", Italy; onsemi, Analog and Mixed-Signal Group, Milan, Italy | Multiphysics Simulation for Packaging Presenter |
| Erden, Oguz Kaan | Imec, Leuven, Belgium; KU Leuven, Belgium | Ultrasound Devices Presenter |
| Eyert, Volker | Materials Design SARL, France | Interactive Poster Session Presenter |
| Faes, Jana | Department of Materials, Textiles and Chemical Engineering (MaTCh), Ghent University | Interactive Poster Session Presenter |
| Fahim, Abdullah | NXP Semiconductors, USA | Interactive Poster Session |
| Fan, Jiajie | Delft University of Technology (TU Delft), Netherlands, ECTM; Delft University of Technology, The Netherlands; Fudan University, China | Interactive Poster Session Interactive Poster Session Materials Modelling |
| Fan, Xuejun | Lamar University, United States of America | IEEE EPS Distinguished Lectures Presenter |
| Farmani, Zohreh | Delft University of Technology (TU Delft), Netherlands, PME | Interactive Poster Session |
| Fendt, Karl | Austria Technologie & Systemtechnik AG | Machine Learning-based Methods |
| Ferrie, Patricia | Materials Consultancy Services Limited, Midlothian Innovation Centre, Scotland | Mirelai Session |
| Feuchter, Mike | CADFEM Germany GmbH, Germany | Mission Profiles & RUL Presenter |
| Forke, Roman | FhI ENAS, Germany | MEMS Sensors |
| FRADIN, Jean-Pierre | Icam School of Engineering, France. | Interconnect Degradation |
| Frangi, Attilio | Department of Civil and Environmental Engineering, Politecnico di Milano, Italy. | Ultrasound Devices |
| Franiatte, Rémi | CEA LETI, France | Ultrasound Devices |
| Friebe, Til | Technical University of Munich, Germany | MEMS Sensors |
| Fruehauf, Peter | Siemens AG, Technology, Berlin, Germany | Interconnect Degradation |
| Fuchs, Peter Fillip | Polymer Competence Center Leoben GmbH (PCCL), Germany | Digital Twins & Model Exchange Interactive Poster Session Solder Fatigue: Models & Mechanisms Interactive Poster Session |
| Gagic, Mladen | TU Delft, The Netherlands | Thermal Behavioral Modeling |
| Gallarday, Pierre | Institute of Microelectronics of Barcelona (IMB-CNM-CSIC), Spain | Interactive Poster Session Presenter |
| Gandhi, Rohit | Arizona State University - Tempe, USA; Arizona State University, United States of America | Advanced Packaging Reliability Presenter Interactive Poster Session |
| Gao, ChenShan | Southern University of Science and Technology. China | Chiplets & Warpage |
| Garroni, Michelangelo Gabriele | MOX, Dipartimento di Matematica, Politecnico di Milano, Italy. | Ultrasound Devices Presenter |
| Geisler, Lukas | ams-OSRAM International GmbH, Germany | Advanced Packaging Reliability |
| George, Brinda | Infineon Technologies AG Munich, Germany | Material Modeling for Packaging Presenter |
| Gheytaghi, Amir Mirza | Ampleon B.V. | Thermal Experimental Characterization Presenter |
| GIRARD, Gautier | Université de Lorraine, France. | Interconnect Degradation |
| Giusti, Domenico | STMicroelectronics Agrate, Italy. | Ultrasound Devices |
| Gonzalez, Mario | Imec, Belgium | Chiplets & Warpage |
| Górecki, Paweł | University of Naples Federico II, Italy; Gdynia Maritime University, Poland | Interactive Poster Session |
| Görner Tenorio, Christian | Infineon Technologies AG, Germany; Technical University of Munich, Germany | Advanced MEMS Interactive Poster Session |
| Goubault, Theotime | CEA LETI, France | Ultrasound Devices Presenter |
| Grande, Ralph Maru | University of the Philippines, Philippines; University of the Philippines Diliman, Philippines | Interactive Poster Session Interactive Poster Session |
| Grinschgl, Markus | GIPRO GmbH, Austria | Digital Twins & Model Exchange |
| Gromala, Przemyslaw Jakub | Bosch Hungary Kft, Hungary | Mission Profiles & RUL |
| Gromala, Przemyslaw Jakub | Robert Bosch Kft., Hungary | Mold & interface Materials |
| Grosse-Kockert, Corinna | berliner Nanotest und Design GmbH, Germany | Interactive Poster Session |
| Grosso, Giovanna | Silicon Austria Labs GmbH, Austria | Multiphysics Simulation for Packaging |
| Groth, Anne | Fraunhofer Institute for Reliability and Microintegration (IZM), Germany | PCB Reliability |
| Gruber, Dieter P. | Montanuniversität Leoben, Austria; Polymer Competence Centre Leoben (PCCL) GmbH, Austria | Interactive Poster Session Machine Learning-based Methods |
| Gruen, Tobias | Berliner Nanotest and Design GmbH, Germany | Thermal Experimental Characterization |
| Gschwandl, Mario | Ottronic Regeltechnik Gesellschaft m.b.H., Germany | Solder Fatigue: Models & Mechanisms |
| Guerriero, Pierluigi | University of Napoli Federico II, Italy | Thermal Design Modeling and Experimental Characterization |
| Guo, Chunbing | Guangdong University of Technology, China | Thermal Behavioral Modeling |
| Gupta, Nikhil | Delft Universtiy of Technology, The Netherlands | PCB Reliability |
| H. Poelma, Rene | Delft University of Technology, Netherlands, The | Machine Learning-based Methods |
| Hahn, Susann | TU Chemnitz, Germany | MEMS Sensors |
| Hanke, Martin | CADFEM Germany GmbH, Germany | Mission Profiles & RUL |
| Haouari, Rachid | imec, Belgium | Interactive Poster Session |
| Hartner, Walter | Infineon Technologies AG, Germany | Mold & interface Materials |
| Hasna, Günther | Ansys Germany GmbH, Germany | Mission Profiles & RUL |
| Hauck, Torsten | TU Berlin, Germany | Solder Fatigue: Models & Mechanisms Presenter |
| Haugwitz, Christoph | Technische Universität Darmstadt, Germany | Advanced MEMS |
| He, Jilin | Universität des Saarlandes, Germany | Solder Fatigue: Models & Mechanisms |
| Heilmann, Jens | Technische Universität Chemnitz, Germany | Interactive Poster Session |
| Heltzel, Stan | ESA-ESTEC, The Netherlands | PCB Reliability |
| Herremans, Kurt | Imec, Belgium | Chiplets & Warpage |
| Herth, Etinne | C2N-UPSACLAY, France | Interactive Poster Session |
| Heyl, Christoph M. | Deutsches Elektronen-Synchrotron DESY, Germany; Helmholtz Institute Jena, Germany; GSI Helmholtzzentrum für Schwerionenforschung GmbH, Germany | Advanced MEMS |
| Hild, François | Université Paris-Saclay, France | Materials Modelling |
| Hiller, Karla | TU Chemnitz, Germany | MEMS Sensors |
| Hofmann, Christian | Fraunhofer Institute for Electronic Nano Systems – ENAS, Germany | Interactive Poster Session Thermal Design Modeling and Experimental Characterization |
| Hofmann, Maximilian | Fraunhofer IISB, Germany | Mission Profiles & RUL |
| Hohlfeld, Dennis | University of Rostock, Germany | Advanced Simulation Methods MEMS Sensors |
| Hollinger, Thomas | Polymer Competence Center Leoben GmbH, Germany | Solder Fatigue: Models & Mechanisms |
| Hołoń, Krzysztof | Aptiv Services Poland | Thermal Behavioral Modeling |
| Hong, Jian-Cheng | Feng Chia University, Taiwan | Interactive Poster Session Solder Fatigue: Models & Mechanisms |
| Horn, Tobias Daniel | Fraunhofer Institute for Electronic Nano Systems (ENAS); Fraunhofer ENAS, Micro Materials Center; Technical University of Chemnitz, Center for Micro and Nanotechnologies | Machine Learning-based Methods Material Modeling for Packaging Presenter |
| Hou, Fengze | Chinese Academy of Sciences, China | Materials Modelling |
| Houri, Samer | imec, Belgium | Interactive Poster Session |
| Hsuan, Nai-Jen | Realtek Semiconductor Corp. | Interactive Poster Session |
| Hu, Siyang | University of Rostock, Germany; Jade University of Applied Sciences, Germany | MEMS Sensors Presenter |
| Hu, Xiao | Delft University of Technology, The Netherlands; Boschman Technologies B.V.,The Netherlands | Materials Modelling |
| Huber, Alexander | Montanuniversität Leoben, Austria; Kompetenzzentrum Automobil- und Industrieelektronik GmbH, Austria | Interconnect Degradation Presenter |
| Huber, Fabian | ams OSRAM AG, Austria | Interactive Poster Session |
| Huber, Thomas | Intel Corporation, Germany | Chiplets & Warpage |
| Hutchinson, Joseph | University of Maryland, United States of America | Interactive Poster Session |
| Ibrahim, Ali | SATIE, Gustave Eiffel University, France | Material Modeling for Packaging |
| Imtiaz, Shehryar | Technoprobe, Cernusco Lombardone, Italy | Mirelai Session Presenter |
| Israel, Lavinia | ams-OSRAM International GmbH, Germany | Advanced Packaging Reliability |
| Iwata, Yoshiharu | The University of Osaka, Japan | Interactive Poster Session |
| Jacobs, Thibault | Noesis Solutions NV, Belgium | Interactive Poster Session Presenter |
| Javaregowda, Mohan Prashanth | Intel Corporation, Germany | Chiplets & Warpage Presenter |
| Jeong, Jae-Seong | Korea Electronics Technology Institute (KETI), Korea, Republic of (South Korea) | Interactive Poster Session Presenter |
| Jetten, Hans-Gerd | Intel Corporation, Germany | Chiplets & Warpage |
| Ji, Feng | Beijing Institute of Remote Sensing Equipment, China | Materials Modelling |
| Jin, Renxi | Chinese Academy of Sciences, China | Materials Modelling |
| Jithendrriyan, Pallavi | Arizona State University - Tempe, USA | Advanced Packaging Reliability |
| Jöhrmann, Nathanael | Chemnitz University of Technology, Germany; TU Chemnitz, Germany | Interactive Poster Session |
| JORDA, XAVIER | CNM CSIC Spain | Multiphysics Simulation for Packaging |
| Junesch, Juliane | Infineon Technologies AG, Germany | Mold & interface Materials |
| Kabakchiev, Alexander | Robert Bosch GmbH, Germany | Mission Profiles & RUL |
| Kamble, Vikram G | AT&S Austria Technologie & Systemtechnik, Austria; Montanuniversität Leoben, Austria; Polymer Competence Center Leoben GmbH, Austria | Interactive Poster Session Presenter |
| Kang, Qiushi | Chinese Academy of Sciences, China | Materials Modelling |
| Kasinikota, Venu Prakash | Polymer Competence Center Leoben GmbH (PCCL), Germany | Digital Twins & Model Exchange Solder Fatigue: Models & Mechanisms |
| Kazar Mendes, Munique | CEA LETI, France | Ultrasound Devices |
| Keller, Max | Jade University, Germany | Digital Twins & Model Exchange Presenter |
| Khatir, Zoubir | SATIE, Gustave Eiffel University, France | Material Modeling for Packaging Presenter |
| Kim, Dong-Hyeon | Dong-Eui University, South Korea | Thermal Experimental Characterization |
| Kim, Jaehyun | C2N-UPSACLAY, France | Interactive Poster Session |
| Kim, JaeMyeong | STATS ChipPAC, Korea | Multiphysics Simulation for Packaging |
| Kim, Yu-Hwan | YHENS, Korea, Republic of (South Korea) | Interactive Poster Session |
| Kishor, Shran | NXP Semiconductors, USA | Interactive Poster Session |
| Klaus, Vogel | Fraunhofer Institute for Electronic Nano Systems – ENAS, Germany | Interactive Poster Session |
| Koch, Mathias | Fraunhofer IZM , Germany | Thermal Experimental Characterization |
| Köck, Anton | Materials Center Leoben (MCL), Austria | Interactive Poster Session |
| Kohaus, Patrick | Jade University of Applied Sciences, Germany | Advanced Simulation Methods Presenter |
| Korta, Jakub | Aptiv Services Poland | Thermal Behavioral Modeling Presenter |
| Korvink, Jan G. | Institute of Microstructure Technology (IMT), Karlsruhe Institute of Technology (KIT), Germany | Advanced Simulation Methods |
| Kosednar-Legenstein, Barbara | Materials Center Leoben Forschung GmbH, Austria; Materials Center Leoben (MCL), Austria | Interactive Poster Session Interactive Poster Session |
| Kraker, Elke | Materials Center Leoben Forschung GmbH, Austria; Materials Center Leoben (MCL), Austria | Interactive Poster Session Interactive Poster Session |
| Kreher, Lisa | Fraunhofer ENAS, Chemnitz, Germany | Interconnect Degradation |
| Kriebel, David | University of Chemnitz, Germany | Interactive Poster Session |
| Krivec, Thomas | AT&S Austria Technologie & Systemtechnik, Austria | Interactive Poster Session Machine Learning-based Methods |
| Krusch, Annett | TU Chemnitz, Germany | MEMS Sensors |
| Kuehn, Martin | Fraunhofer ENAS, Germany | Mold & interface Materials |
| Kuenzel, Petra | FhI ENAS, Germany | MEMS Sensors |
| Kuipers, Hans | ITEC Equipment | Interactive Poster Session |
| Kuo, Walton Matthew | University of the Philippines, Philippines | Interactive Poster Session |
| Kupnik, Mario | Technische Universität Darmstadt, Germany | Advanced MEMS |
| Kuttler, Simon | Fraunhofer IZM, Germany | Interactive Poster Session Presenter |
| Labie, Riet | Imec, Belgium | Chiplets & Warpage |
| Ladlad, Rhiyan Mae | University of the Philippines, Philippines | Interactive Poster Session Presenter |
| LAGADEC, Aymeric | ELVIA Electronics, France. | Interconnect Degradation |
| Lall, Pradeep | Auburn University, United States of America | Interconnect Degradation Presenter Mold & interface Materials Presenter |
| Lammens, Nicolas | Siemens Industry Software NV | Interactive Poster Session Mirelai Session |
| Lang, Margit Christa | Polymer Competence Center Leoben GmbH, Germany | Solder Fatigue: Models & Mechanisms Digital Twins & Model Exchange Presenter |
| LATORRE, LLORENÇ | Power electronics Llíria, Spain | Multiphysics Simulation for Packaging |
| Le Rhun, Gwenael | CEA LETI, France | Ultrasound Devices |
| Lee, YongTaek | STATS ChipPAC, Korea | Multiphysics Simulation for Packaging |
| Leib, Jürgen | Fraunhofer IISB, Germany | Mission Profiles & RUL |
| LEICHT, Mickaël | Université de Lorraine, France.; IRT Saint Exupéry, France. | Interconnect Degradation Presenter |
| Leitgeb, Verena | Materials Center Leoben Forschung GmbH, Austria; Materials Center Leoben (MCL), Austria | Interactive Poster Session Presenter Interactive Poster Session |
| Li, Fan | Ampleon B.V. | Thermal Experimental Characterization |
| Li, Jinglin | TU Delft, The Netherlands | Materials Modelling Presenter |
| Li, Kunzhao | Guangdong University of Technology, China | Thermal Behavioral Modeling |
| Li, Muyuan | ams-OSRAM International GmbH, Germany | Advanced Packaging Reliability Presenter |
| Li, Pin-Sian | Feng Chia University, Taiwan | Solder Fatigue: Models & Mechanisms |
| Li, Shizhen | Southern University of Science and Technology. China | Chiplets & Warpage Presenter |
| Liang, Jialong | Delft University of Technology, The Netherlands | Interactive Poster Session Presenter |
| Liao, Kuo-Chi | National Taiwan University, Taiwan | Interactive Poster Session Presenter |
| Lin, Chung-Chih | National Formosa University, Taiwan | Advanced Packaging Reliability |
| Lin, Han-wen | Intel Corporation,Taiwan | Chiplets & Warpage |
| Lin, Si-Han | Feng Chia University, Taiwan | Interactive Poster Session |
| Liu, Xinyu | Lamar University, United States of America | IEEE EPS Distinguished Lectures |
| Liu, Xu | Delft University of Technology, The Netherlands | Chiplets & Warpage |
| Locker, David | Auburn University, United States of America | Interconnect Degradation |
| Lurie, Nils | TU Delft, The Netherlands | Thermal Behavioral Modeling |
| Lutz, Peter | Infineon Technologies AG, Germany | Mold & interface Materials |
| Lykourinas, Antonios | University of Patras, Greece | Ultrasound Devices |
| Lyu, Chengzhe | Technische Universität Dresden, Germany | Interactive Poster Session Presenter |
| M. Reuther, Georg | Infineon Technologies AG Munich, Germany | Material Modeling for Packaging |
| Ma, Rui | Chinese Academy of Sciences, China | Materials Modelling |
| Magnien, Julien | Materials Center Leoben Forschung GmbH, Austria | Interactive Poster Session |
| Mai, Holger | Infineon Technologies AG, Germany | Mold & interface Materials |
| Majed, Ben | BTU Cottbus, Germany | Thermal Experimental Characterization |
| Malang, Hanna | Deutsches Elektronen-Synchrotron DESY, Germany | Advanced MEMS |
| Malgioglio, Giuseppe Luigi | STMicroelectronics, Italy | Interactive Poster Session Thermal Experimental Characterization |
| Mariani, Stefano | Politecnico di Milano, Italy | Interactive Poster Session Interactive Poster Session Mirelai Session |
| MARIE, Alexandre | Icam School of Engineering, France. | Interconnect Degradation |
| Martin, Christian | Universite Claude Bernard Lyon 1 Ampére, France | Interactive Poster Session |
| Mastrangeli, Massimo | Delft University of Technology, The Netherlands | Advanced Simulation Methods |
| Mauri, Marco | Technoprobe, Italy; Technoprobe, Cernusco Lombardone, Italy | Interactive Poster Session Interactive Poster Session Mirelai Session |
| May, Daniel | TU Chemnitz, Germany; Chemnitz University of Technology, Germany | Interactive Poster Session Interactive Poster Session Machine Learning-based Methods |
| Mazumder, Golam Rakib | Auburn University, USA | Solder Fatigue: Models & Mechanisms |
| Mazzieri, Ilario | MOX, Dipartimento di Matematica, Politecnico di Milano, Italy. | Ultrasound Devices |
| McCracken, Stewart | Materials Consultancy Services Limited, Midlothian Innovation Centre, Scotland | Mirelai Session |
| Mehner, Jan | University of Chemnitz, Germany | Interactive Poster Session |
| Mehrabi, Alireza | Delft University of Technology, Netherlands, The | Machine Learning-based Methods Presenter |
| Mehta, Vishal | Auburn University, United States of America | Interconnect Degradation |
| Meier, Karsten | Technische Universität Dresden, Germany | Interactive Poster Session |
| Melzer, Marcel | Fraunhofer Institute for Electronic Nano Systems – ENAS, Germany | Interactive Poster Session |
| Merafina, Francesco Pio | University of Bari, Italy | Interactive Poster Session Presenter |
| MERCIER, Sébastien | Université de Lorraine, France. | Interconnect Degradation |
| Mermin, Daniel | CEA LETI, France | Ultrasound Devices |
| Meszmer, Peter | Chemnitz University of Technology, Germany; TU Chemnitz, Germany; Centre for Materials, Architectures and Integration of Nanomembranes (MAIN), Germany | Interactive Poster Session Machine Learning-based Methods |
| Mitterhuber, Lisa | Materials Center Leoben (MCL), Austria | Interactive Poster Session |
| Mitterhuber-Gress, Lisa | Materials Center Leoben Forschung GmbH (MCL), Austria | Mirelai Session |
| Moens, David | KU Leuven; Flanders Make | Mirelai Session |
| Mohammadi, Arash | University of Chemnitz, Germany | Interactive Poster Session Presenter |
| Montserrat, Josep | Institute of Microelectronics of Barcelona (IMB-CNM-CSIC), Spain | Interactive Poster Session |
| Moretti, Edoardo | Department of Civil and Environmental Engineering, Politecnico di Milano, Italy. | Ultrasound Devices |
| Morozov, Aleksandr | TU Berlin, Germany | Solder Fatigue: Models & Mechanisms |
| Muehleisen, Wolfgang | Silicon Austria Labs GmbH (SAL), Austria | Digital Twins & Model Exchange |
| Müller, Alexander | Bundeswehr Research Institute for Protective Technologies and CBRN Protection (WIS), Germany | Interactive Poster Session |
| Muller, Alexandru | National Institute for Research and Development in Microtechnologies (IMT), Romania | Interactive Poster Session |
| Müller, Wolfgang H. | TU Berlin, Germany | Solder Fatigue: Models & Mechanisms |
| Musadiq, Muhammad | Delft University of Technology (TU Delft), Netherlands, The | Mirelai Session Presenter |
| Najeem, Muhammad Umair | University of Greenwich, United Kingdom; Materials Consultancy Services Limited, Midlothian Innovation Centre, Scotland | Mirelai Session Presenter |
| Nandi, Sounak | Fraunhofer Institute for Electronic Nano Systems – ENAS, Germany | Interactive Poster Session Thermal Design Modeling and Experimental Characterization Presenter |
| Nawghane, Chinmay | imec, Belgium | Mirelai Session PCB Reliability Presenter |
| Ng, Wee Jian | University of Limerick, Ireland | Thermal Design Modeling and Experimental Characterization Presenter |
| Nguyen, Binh | imec, Belgium | Machine Learning-based Methods |
| Niemeier, Roland | Ansys Germany GmbH, Germany | Mission Profiles & RUL Presenter |
| Niessner, Martin | Infineon Technologies AG, Germany | Interactive Poster Session Mold & interface Materials Presenter |
| Ouhab, Merouane | Mitsubishi Electric R&D Centre Europe, France | Materials Modelling |
| Ovsiannikov, Nikita | Technical University of Munich, Germany | MEMS Sensors Presenter |
| Paek, Js | Intel Corporation,Taiwan | Chiplets & Warpage |
| Panchenko, Juliana | Technische Universität Dresden, Germany | Interactive Poster Session |
| Panchwagh, Akshay Vivek | Robert Bosch GmbH, Germany | Mold & interface Materials Presenter |
| Pandit, Milind | imec, Belgium | Ultrasound Devices |
| Pandurangan, Aathi | Auburn University, United States of America | Mold & interface Materials |
| Pangilinan, Rafael | University of the Philippines, Philippines; University of the Philippines Diliman, Philippines | Interactive Poster Session Interactive Poster Session Presenter |
| Park, Sung-Min | Dong-Eui University, South Korea | Thermal Experimental Characterization |
| Parolini, Nicola | MOX, Dipartimento di Matematica, Politecnico di Milano, Italy. | Ultrasound Devices |
| Passagrilli, Carlo | STMicroelectronics, Italy | Interactive Poster Session |
| Payá-Vayá, Guillermo | TU Braunschweig, Germany | Interactive Poster Session |
| Pendse, Chinmay | KU Leuven, Belgium; imec, Belgium | Ultrasound Devices Presenter |
| Pérez-Tomás, Amador | Institute of Microelectronics of Barcelona (IMB-CNM-CSIC), Spain | Interactive Poster Session |
| PERROTIN, Olivier | Alter Technology France,France. | Interconnect Degradation |
| Petersmann, Manuel | Kompetenzzentrum Automobil- und Industrieelektronik GmbH, Austria | Interconnect Degradation |
| Pielmeier, Florian | Infineon Technologies AG, Germany | Interactive Poster Session |
| Poelma, René | Nexperia B.V., The Netherlands | PCB Reliability Presenter |
| Poelma, René H. | Delft University of Technology, The Netherlands; Nexperia BV, The Netherlands | Mission Profiles & RUL |
| Poornabodha, Nikhitha | Arizona State University - Tempe, USA | Advanced Packaging Reliability |
| Porathur, Fredy John | ams OSRAM AG, Austria; Montanuniversität Leoben, Austria | Interactive Poster Session Presenter |
| Pradhan, Abinash | Silicon Austria Labs GmbH, Austria | Multiphysics Simulation for Packaging |
| Preu, Harald | Infineon Technologies AG, Germany | Mold & interface Materials |
| Prinz, Matthias | Fraunhofer ENAS, Chemnitz, Germany | Interconnect Degradation |
| Probst, Dean | onsemi, Power Solution Group, Hopewell Junction, NY | Multiphysics Simulation for Packaging |
| Punch, Jeff | University of Limerick, Ireland | Thermal Design Modeling and Experimental Characterization |
| Qadir, Awais | Chemnitz University of Technology, Germany; TU Chemnitz, Germany | Interactive Poster Session Presenter |
| Qureshi, Zain ul Abdin | University of Napoli Federico II, Italy | Thermal Design Modeling and Experimental Characterization Presenter |
| R. Niessner, Martin | Infineon Technologies AG Munich, Germany | Material Modeling for Packaging |
| Rau, Ingolf | Infineon Technologies AG Munich, Germany | Material Modeling for Packaging |
| Rebollo, José | Institute of Microelectronics of Barcelona (IMB-CNM-CSIC), Spain; CNM CSIC Spain | Interactive Poster Session Multiphysics Simulation for Packaging |
| Refai-Ahmed, Gamal | AMD, USA | IEEE EPS Distinguished Lectures Presenter |
| Renna, Marco | STMicroelectronics, Italy | Interactive Poster Session Thermal Experimental Characterization |
| Reuter, Danny | TU Chemnitz, Germany | MEMS Sensors |
| Richter-Trummer, Susana | Fraunhofer ENAS, Chemnitz, Germany | Interconnect Degradation |
| Rincon-Ruiz, Carlos | Chemnitz University of Technology, Germany; TU Chemnitz, Germany | Interactive Poster Session Mold & interface Materials Presenter |
| Robinson, Aidan | Materials Consultancy Services Limited, Midlothian Innovation Centre, Scotland | Mirelai Session |
| Rochus, Veronique | imec, Belgium | Interactive Poster Session Presenter Machine Learning-based Methods Presenter Ultrasound Devices |
| RODRIGO, EUSEBIO | CNM CSIC Spain | Multiphysics Simulation for Packaging Presenter |
| Roig Guitart, Jaume | onsemi, Central Engineering, Oudenaarde, Belgium; Roznov pod Radhostem, Czech Republic; Sunnyvale, CA, USA | Multiphysics Simulation for Packaging |
| Rolland, Delphine | CEA LETI, France | Ultrasound Devices |
| Röllig, Mike | Fraunhofer IKTS, Germany | Interactive Poster Session |
| Rongen, Rene | NXP Semiconductors | Mirelai Session |
| Roscher, Frank | Fraunhofer ENAS, Germany | Mold & interface Materials |
| Roshanghias, Ali | Silicon Austria Labs GmbH, Austria | Multiphysics Simulation for Packaging |
| Rottenberg, Xavier | Imec, Leuven, Belgium | Ultrasound Devices Ultrasound Devices |
| Roucou, Romuald | NXP Semiconductors | Mirelai Session |
| Rovitto, Marco | STMicroelectronics, Italy | Interactive Poster Session |
| Rusu, Cristina | RISE Research Institutes of Sweden, Sweden | Interactive Poster Session |
| Rzepka, Sven | Fraunhofer ENAS, Chemnitz, Germany; Fraunhofer ENAS, Micro Materials Center; Technical University of Chemnitz, Center for Micro and Nanotechnologies; Fraunhofer Institute for Electronic Nano Systems ENAS | Interconnect Degradation Material Modeling for Packaging Mission Profiles & RUL Mold & interface Materials |
| Sagerer, Maike | AT&S Austrian Technologie & Systemtechnik Aktiengesellschaft | Interactive Poster Session |
| Saggese, Gerardo | University of Napoli Federico II, Italy | Thermal Design Modeling and Experimental Characterization |
| Salter, Michael | RISE Research Institutes of Sweden, Sweden | Interactive Poster Session |
| Sanchis Alepuz, Helios | Silicon Austria Labs, Austria | Thermal Behavioral Modeling Presenter |
| Savoia, Alessandro Stuart | Università degli Studi Roma Tre, Italy. | Ultrasound Devices |
| Schacht, Ralph | BTU Cottbus, Germany | Thermal Experimental Characterization Presenter |
| Schaumann, Stephan | Technische Universität Darmstadt, Germany | Advanced MEMS |
| Scheiter, Lutz | CWM GmbH, Chemnitz, Germany | Interconnect Degradation |
| Schiller, Ferdinand | Infineon Technologies AG, Germany; Technical University of Munich, Germany | Advanced MEMS Presenter Interactive Poster Session Presenter |
| Schneider-Ramelow, Martin | Technische Universität Berlin, Germany | Interactive Poster Session |
| Schneider-Ramelow, Martin | TU Berlin, Germany; Technische Universität Berlin, Germany | PCB Reliability PCB Reliability |
| Schrag, Gabriele | Technical University of Munich, Germany | Advanced MEMS Interactive Poster Session MEMS Sensors |
| Schrödel, Yannick | Deutsches Elektronen-Synchrotron DESY, Germany; Helmholtz Institute Jena, Germany; GSI Helmholtzzentrum für Schwerionenforschung GmbH, Germany | Advanced MEMS |
| Schuh, Jannis | budatec GmbH,12487 Berlin, Germany | Interactive Poster Session |
| Schulz, Marcus | Berliner Nanotest und Design GmbH, Germany; TU Chemnitz, Germany | Interactive Poster Session Presenter |
| Schütz, Arwed | Jade University of Applied Sciences, Germany | Advanced Simulation Methods |
| Schwerz, Robert | Fraunhofer IKTS, Germany | Interactive Poster Session Presenter |
| Scognamillo, Ciro | University of Naples Federico II, Italy; University of Naples "Federico II", Italy | Interactive Poster Session Multiphysics Simulation for Packaging |
| SEGOND, Gilles | IRT Saint Exupéry, France. | Interconnect Degradation |
| Selbmann, Franz | Fraunhofer ENAS, Germany | Mold & interface Materials |
| Seok, Seonho | C2N-UPSACLAY, France | Interactive Poster Session Presenter |
| Shaheen, Mohammed | Humain, Saudia Arabia | IEEE EPS Distinguished Lectures |
| Shaporin, Alexey | FhI ENAS, Germany | MEMS Sensors Presenter |
| Shekhar, Aditya | TU Delft, The Netherlands | Materials Modelling Thermal Behavioral Modeling |
| Shih, Meng-Kai | National Sun Yat-sen University, Taiwan | Advanced Packaging Reliability Presenter |
| Simjanoski, Filip | Delft University of Technology, Netherlands, The; TU Delft, The Netherlands | Machine Learning-based Methods Thermal Behavioral Modeling Presenter |
| Soennecken, Sören | Technische Universität Darmstadt, Germany | Advanced MEMS |
| Sokolov, Aleksei | Technische Universität Berlin, Germany | PCB Reliability Presenter |
| Soriano, Jarod | University of the Philippines, Philippines | Interactive Poster Session |
| Soric, Mario | Infineon Technologies AG, Germany | Interactive Poster Session |
| Sperti, Marco | Siemens Industry Software nv, Belgium | Mirelai Session Presenter |
| Srinivasan, Pranav | University of Maryland, USA; University of Maryland, United States of America | Advanced Packaging Reliability Interactive Poster Session Interactive Poster Session Presenter Interactive Poster Session |
| Sriramulu, Harshitha | Technische Universität Dresden, Germany | Interactive Poster Session |
| Stautner, Sophia | Infineon Technologies AG, Germany | Interactive Poster Session |
| Steiner, Alexander | Polymer Competence Center Leoben GmbH (PCCL), Germany | Digital Twins & Model Exchange |
| Stelzer, Adrian | Nano-Join GmbH, Berlin, Germany | Interactive Poster Session |
| Stipsitz, Monika | Silicon Austria Labs, Austria | Thermal Behavioral Modeling |
| Stöckel, Chris | Fraunhofer Institute for Electronic Nano Systems ENAS, Germany | Interactive Poster Session |
| Stoyanov, Stoyan | University of Greenwich, United Kingdom | Mirelai Session |
| Stranieri, Francesco | Technoprobe, Cernusco Lombardone, Italy | Mirelai Session |
| Su, Chih-Yen | Realtek Semiconductor Corp. | Interactive Poster Session Presenter |
| Su, Qinghua | National Tsing Hua University, Taiwan | Interactive Poster Session Presenter Interactive Poster Session Interactive Poster Session |
| Su, Yu-Ting | National Tsing Hua University, Taiwan | Interactive Poster Session |
| Suhling, Jeff | Auburn University, United States of America | Interconnect Degradation |
| Suhling, Jeffrey C. | Auburn University, USA | Solder Fatigue: Models & Mechanisms |
| Sun, Bo | Guangdong University of Technology, China | Thermal Behavioral Modeling Presenter |
| Sun, Haoyang | Beijing Institute of Remote Sensing Equipment, China | Materials Modelling |
| Sun, Ping | Delft University of Technology, The Netherlands; Boschman Technologies B.V.,The Netherlands | Materials Modelling Presenter |
| Tan, Chunjian | Southern University of Science and Technology, China | Thermal Design Modeling and Experimental Characterization |
| Tang, Zhenhao | Guangdong University of Technology, China | Thermal Behavioral Modeling |
| Tawade, Pratik V. | Delft University of Technology, The Netherlands | Advanced Simulation Methods |
| Thieu, Gia Bao | TU Braunschweig, Germany | Interactive Poster Session |
| Tichem, Marcel | Delft University of Technology (TU Delft), Netherlands, PME | Interactive Poster Session |
| Tinca, Iulia-Eliza | Infineon Technologies AG, Germany | Interactive Poster Session Presenter |
| Torri, Guilherme Brondani | imec, Belgium | Machine Learning-based Methods |
| Trinh, Cham Thi | Universität des Saarlandes, Germany | Solder Fatigue: Models & Mechanisms |
| Trumann, Eike Hendrik | TU Braunschweig, Germany | Interactive Poster Session Presenter |
| Tuerk, Patrick | TU Chemnitz, Germany | Mold & interface Materials |
| Van De Slyeke, Marnix | ACB, Belgium | PCB Reliability |
| van Dijk, Marius | Fraunhofer IZM, Germany; Fraunhofer Institute for Reliability and Microintegration (IZM), Germany | Interactive Poster Session PCB Reliability |
| van Driel, Willem | Delft University of Technology, The Netherlands | Interactive Poster Session Materials Modelling |
| Van Driel, Willem D. | Delft University of Technology (TU Delft), Netherlands, The; Delft University of Technology, The Netherlands; Delft Universtiy of Technology, The Netherlands; TU Delft, The Netherlands | Mirelai Session Mission Profiles & RUL PCB Reliability Thermal Behavioral Modeling Advanced Simulation Methods |
| Van Hoof, Chris | Imec, Leuven, Belgium; KU Leuven, Belgium | Ultrasound Devices Ultrasound Devices |
| Van Paepegem, Wim | Department of Materials, Textiles and Chemical Engineering (MaTCh), Ghent University; FlandersMake@UGent-MIRO | Interactive Poster Session |
| van Soestbergen, Michiel | NXP Semiconductors, Netherlands, The | Digital Twins & Model Exchange Presenter |
| van Zeijl, Henk | Delft University of Technology, The Netherlands | Mission Profiles & RUL |
| van Zuijlen, Albert | Ampleon B.V. | Thermal Experimental Characterization |
| Vandevelde, Bart | Imec, Belgium | Chiplets & Warpage Mirelai Session Mirelai Session |
| vanDriel, Willem. D | TU Delft, The Netherlands | Materials Modelling |
| Vanstreels, Kris | Imec, Belgium | Chiplets & Warpage |
| Vasilache, Dan | National Institute for Research and Development in Microtechnologies (IMT), Romania | Interactive Poster Session |
| Vellvehí, Aniol | Institute of Microelectronics of Barcelona (IMB-CNM-CSIC), Spain | Interactive Poster Session |
| Vellvehí, Miquel | Institute of Microelectronics of Barcelona (IMB-CNM-CSIC), Spain | Interactive Poster Session |
| VELLVEHI, MIQUEL | CNM CSIC Spain | Multiphysics Simulation for Packaging |
| Verbeke, Mathias | KU Leuven, Belgium; Flanders Make@KU Leuven, Belgium | Mirelai Session |
| Vermaak, Natasha | Lehigh University, USA | Materials Modelling |
| Victory, James | onsemi, Central Engineering, Oudenaarde, Belgium; Roznov pod Radhostem, Czech Republic; Sunnyvale, CA, USA | Multiphysics Simulation for Packaging |
| Vijayakumar, Jaianth | European Synchrotron Radiation Facility, 71 Avenue des Martyrs, 38000, Grenoble, France | Interactive Poster Session |
| Vinciguerra, Vincenzo | STMicroelectronics, Italy | Interactive Poster Session Presenter Thermal Experimental Characterization Presenter |
| Vogel, Klaus | Fraunhofer Institute for Electronic Nano Systems, Germany | Thermal Design Modeling and Experimental Characterization |
| Voigt, Sven | Fraunhofer Institute for Electronic Nano Systems ENAS, Germany | Interactive Poster Session |
| Volckaert, Klara | Imec, Belgium | Chiplets & Warpage Presenter |
| von Wolff, Dorian | Bundeswehr Research Institute for Protective Technologies and CBRN Protection (WIS), Germany | Interactive Poster Session |
| Vysotskyi, Bogdan | Imec, Leuven, Belgium | Ultrasound Devices |
| Wakamatsu, Hidefumi | The University of Osaka, Japan | Interactive Poster Session |
| Wang, Hanshi | Southern University of Science and Technology, China | Thermal Design Modeling and Experimental Characterization |
| Wang, Qidong | Chinese Academy of Sciences, China | Materials Modelling |
| Wang, Wei | Peking University. China; National Key Lab of Micro/Nano Fabrication Technology, China; Beijing Advanced Innovation Center for Integrated Circuits, China | Materials Modelling |
| Wang, Wei-Fong | National Tsing Hua University, Taiwan | Interactive Poster Session Presenter |
| Wang, Yong | AccoPower, China | Thermal Design Modeling and Experimental Characterization |
| Weekers, Bart | imec, Belgium | Interactive Poster Session |
| Weide-Zaage, Kirsten | Leibniz Universität Hannover, Germany | Interactive Poster Session |
| Weidlich, Sebastian | TU Chemnitz, Germany | MEMS Sensors |
| Wiemer, Elena | Technische Universität Darmstadt, Germany | Advanced MEMS |
| Wiese, Steffen | Universität des Saarlandes, Germany | Solder Fatigue: Models & Mechanisms Presenter |
| Wismath, Sonja | Technische Universität Darmstadt, Germany | Advanced MEMS Presenter |
| Wiss, Erik | Universität des Saarlandes, Germany | Solder Fatigue: Models & Mechanisms |
| Wittler, Olaf | Fraunhofer IZM, Germany; Fraunhofer Institute for Reliability and Microintegration (IZM), Germany | Interactive Poster Session PCB Reliability PCB Reliability |
| Wittwer, Philipp | Nano-Join GmbH, Berlin, Germany | Interactive Poster Session |
| Wu, Yanan | Berliner Nanotest and Design GmbH, Germany; Chemnitz University of Technology, Germany | Interactive Poster Session Presenter |
| Wu, Yueqian | Southern University of Science and Technology, People's Republic of China | Thermal Design Modeling and Experimental Characterization |
| Wunderle, Bernhard | TU Chemnitz, Germany; Chemnitz University of Technology, Germany; Fraunhofer Institute for Electronic Nano Systems – ENAS, Germany; Centre for Microtechnologies (ZfM) Chemnitz, Germany; Fraunhofer ENAS, Germany; Technische Universität Chemnitz, Germany; Fraunhofer ENAS, Chemnitz, Germany; Centre for Materials, Architectures and Integration of Nanomembranes (MAIN), Germany | Interactive Poster Session Interactive Poster Session Interactive Poster Session Interactive Poster Session Interactive Poster Session Presenter Machine Learning-based Methods Presenter Material Modeling for Packaging Mission Profiles & RUL Mold & interface Materials Thermal Experimental Characterization |
| Wyszyński, Grzegorz | Aptiv Services Poland | Thermal Behavioral Modeling |
| Yamauchi, Yoshyuki | The University of Osaka, Japan | Interactive Poster Session Presenter |
| Yang, Haibo | Chinese Academy of Sciences, China | Materials Modelling |
| Yang, Yudong | Chinese Academy of Sciences, China; Peking University. China | Materials Modelling Presenter |
| Ye, Huaiyu | Southern University of Science and Technology. China; Delft University of Technology, The Netherlands | Chiplets & Warpage Thermal Design Modeling and Experimental Characterization Presenter |
| Younis, Rami | Delft Universtiy of Technology, The Netherlands | PCB Reliability |
| Yu, Qiulin | Austria Technologie & Systemtechnik AG; Montanuniversitaet Leoben; Polymer Competence Center Leoben GmbH | Machine Learning-based Methods Presenter |
| Yuan, Cadmus | Feng Chia University, Taichung, Taiwan | IEEE EPS Distinguished Lectures Interactive Poster Session Presenter Solder Fatigue: Models & Mechanisms Presenter |
| Zaal, Jeroen | NXP Semiconductors, USA | Interactive Poster Session |
| Zalaffi, Samuele | STMicroelectronics, Italy | Interactive Poster Session Presenter |
| Zhang, Chi | Peking University. China; National Key Lab of Micro/Nano Fabrication Technology, China | Materials Modelling |
| Zhang, Guo Qi | Delft University of Technology (TU Delft), Netherlands, ECTM; Delft Universtiy of Technology, The Netherlands; Delft University of Technology, The Netherlands; TU Delft, The Netherlands | Interactive Poster Session PCB Reliability Chiplets & Warpage Interactive Poster Session Machine Learning-based Methods Materials Modelling Materials Modelling Mirelai Session Mission Profiles & RUL Thermal Design Modeling and Experimental Characterization |
| Zhang, Hongchao | Chinese Academy of Sciences, China | Materials Modelling |
| Zhang, Kouchi | TU Delft, The Netherlands | Thermal Behavioral Modeling |
| Zhang, Sung-Uk | Dong-Eui University, South Korea | Thermal Experimental Characterization Presenter |
| Zhang, Wei | Southern University of Science and Technology, People's Republic of China | Thermal Design Modeling and Experimental Characterization |
| Zhang, Yaqian | TU Delft, The Netherlands | Materials Modelling |
| Zhang, Yu | Chinese Academy of Sciences, China | Materials Modelling |
| Zhang, Ze | Chinese Academy of Sciences, China | Materials Modelling |
| Zhang, Zihan | Delft University of Technology, Netherlands, The | Machine Learning-based Methods |
| Zhao, Dawei | Fraunhofer IISB, Germany | Mission Profiles & RUL |
| Zhao, Facheng | STATS ChipPAC, Singapore | Multiphysics Simulation for Packaging Presenter |
| Zhu, Liping | STATS ChipPAC, USA | Multiphysics Simulation for Packaging |
| Ziegelwanger, Harald | Elastic-Simulations GmbH, Germany | Solder Fatigue: Models & Mechanisms Presenter |
| Zimmermann, Sven | Fraunhofer Institute for Electronic Nano Systems – ENAS, Germany | Interactive Poster Session |
| Zschenderlein, Uwe | Chemnitz University of Technology, Germany; TU Chemnitz, Germany | Interactive Poster Session Machine Learning-based Methods Material Modeling for Packaging Mold & interface Materials |
| Zuendel, Julia | AT&S Austria Technologie & Systemtechnik, Austria | Interactive Poster Session |
| Zündel, Julia | AT&S Austrian Technologie & Systemtechnik Aktiengesellschaft | Interactive Poster Session |