Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Agenda Overview |
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S4: Chiplets & Warpage
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2:40pm - 3:00pm
Holistic Warpage Evaluation Methodology Across Assembly Flow with Focus on Final Package Integrity in advanced packages like 2.3D-R & 2.3D-BT 1Intel Corporation, Germany; 2Intel Corporation,Taiwan 3:00pm - 3:20pm
Thermal-mechanical Coupling Simulation of Chiplet 2.5D Packaging Based on Chiplet Distribution and Full Copper Interconnection 1Southern University of Science and Technology. China; 2Delft University of Technology, The Netherlands 3:20pm - 3:40pm
Thermo-Mechanical Warpage Prediction and Validation of Large Chiplet Packages Imec, Belgium | ||