Conference Agenda

Session

S2: Interconnect Degradation

Time:

Monday, 20/Apr/2026:

1:10pm - 2:30pm

Session Chair: Jeffrey C. Suhling, Auburn University
Session Chair: Iulia-Eliza Tinca, Infineon Technologies AG

Location: Cedar-Magnolia-Sycamore

Presentations

1:10pm - 1:30pm

Material Property Prediction of Bi-doped SnAgCu Solders under High Strain Rates of Mechanical Shock and Vibration

Pradeep Lall, Vishal Mehta, Jeff Suhling, David Locker

Auburn University, United States of America

1:30pm - 1:50pm

Thermomechanical and Microstructural Mechanisms Governing Copper Degradation under High Strain Rate Thermo-mechanical Fatigue

Alexander Huber^1,2, Manuel Petersmann², Thomas Antretter¹

¹Montanuniversität Leoben, Austria; ²Kompetenzzentrum Automobil- und Industrieelektronik GmbH, Austria

1:50pm - 2:10pm

Thermal Shock Simulations of a PCB with Embedded Components and Microvia Based Interconnection: Meso-scale Modeling of the Woven Composite

Mickaël LEICHT^1,2, Baptiste ARATI², Gautier GIRARD¹, Alexandre MARIE³, Aymeric LAGADEC⁴, Gilles SEGOND², Bernardo COUGO², Olivier PERROTIN⁵, Jean-Pierre FRADIN³, Fabio COCCETTI², Sébastien MERCIER¹

¹Université de Lorraine, France.; ²IRT Saint Exupéry, France.; ³Icam School of Engineering, France.; ⁴ELVIA Electronics, France.; ⁵Alter Technology France,France.

2:10pm - 2:30pm

Secondary Effects Causing Early Solder Fatigue Failure of QFN Components Subjected to Test- and Field Cycling

Rainer Dudek¹, Peter Fruehauf², Matthias Prinz¹, Lisa Kreher¹, Susana Richter-Trummer¹, Lutz Scheiter³, Jan Albrecht¹, Sven Rzepka¹

¹Fraunhofer ENAS, Chemnitz, Germany; ²Siemens AG, Technology, Berlin, Germany; ³CWM GmbH, Chemnitz, Germany