Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Session Overview |
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S2: Interconnect Degradation
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| Presentations | |
1:25pm - 1:45pm
Subcritical Crack Propagation in Solder Resist Materials During Fatigue Bulge Testing in Experiment and Simulation 1Infineon Technologies AG Munich, Germany; 2Technical University of Chemnitz, Germany 1:45pm - 2:05pm
Thermomechanical and Microstructural Mechanisms Governing Copper Degradation under High Strain Rate Thermo-mechanical Fatigue 1Montanuniversität Leoben, Austria; 2Kompetenzzentrum für Automobil- und Industrieelektronik 2:05pm - 2:25pm
Secondary Effects Causing Early Solder Fatigue Failure of QFN Components Subjected to Test- and Field Cycling 1Fraunhofer ENAS, Chemnitz, Germany; 2Siemens AG, Technology, Berlin, Germany; 3CWM GmbH, Chemnitz, Germany 2:25pm - 2:45pm
Simulation of Thermal Shock Testing for PCB with embedded components and microvia based interconnection: influence of the residual stresses on the lifetime estimation 1Université de Lorraine – CNRS – Arts et Métiers ParisTech, Laboratoire d’Etude des Microstructures et de Mécaniques des Matériaux, 7 rue Félix Savart, Metz, 57070, France.; 2IRT Saint Exupéry, 3 rue Tarfaya, Toulouse, 31400, France.; 3Icam School of Engineering, Toulouse Campus, 31330 Toulouse, France.; 4ELVIA Electronics – Avenue d’Ochsenfurt, Coutances, 50211, France.; 5Alter Technology France, 2 Rue des Satellites, 31520 Ramonville-Saint-Agne, France. | |