Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Session Overview |
| Session | |
S21: Multiphysics Simulation for Packaging
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| Presentations | |
11:25am - 11:45am
Optimization of Co-integrated Clamping Diode Design for Voltage Regulators through Experimentally-calibrated SPICE Simulations 1University of Naples "Federico II", Italy; 2onsemi, Analog and Mixed-Signal Group, Milan, Italy; 3onsemi, Central Engineering Group, Oudenaarde, Belgium; Roznov pod Radhostem, Czech Republic; Sunnyvale, CA, USA; 4onsemi, Power Solution Group, Hopewell Junction, NY 11:45am - 12:05pm
Thermal and electrical simulations of Rad-hard Si VDMOS Transistors 1Institute of Microelectronics of Barcelona. CNM CSIC, Cerdanyola del Vallés, Spain; 2Power electronics Llíria, Llíria, Spain 12:05pm - 12:25pm
A Fast Multidomain System-level Simulation Model for GaN Transistor Package Optimization Silicon Austria Labs GmbH, Austria Investigation of Temperature Induced Stress Development around Tungsten-TSVs in Silicon Structures in a Cryogenic Environment using Micro-raman Spectroscopy 1Chemnitz University of Technology, Germany; 2Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz, Germany; 3Fraunhofer ENAS, Chemnitz, Germany; 4Center for Micro-and Nanotechnologies (ZfM), Chemnitz, Germany; 5Joint Lab Berlin, Berlin-Adlershof, Germany | |