Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Agenda Overview |
| Session | ||
S21: Multiphysics Simulation for Packaging
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| Presentations | ||
11:25am - 11:45am
Investigating the Switching Loss-Reliability Trade-Off in TFP-MOSFET Voltage Regulators through Calibrated SPICE Simulations 1University of Naples "Federico II", Italy; 2onsemi, Analog and Mixed-Signal Group, Milan, Italy; 3onsemi, Central Engineering, Oudenaarde, Belgium; Roznov pod Radhostem, Czech Republic; Sunnyvale, CA, USA; 4onsemi, Power Solution Group, Hopewell Junction, NY 11:45am - 12:05pm
Thermal and electrical simulations of Rad-hard Si VDMOS Transistors 1CNM CSIC Spain; 2Power electronics Llíria, Spain 12:05pm - 12:25pm
A Fast Multidomain System-level Simulation Model for GaN Transistor Package Optimization Silicon Austria Labs GmbH, Austria 12:25pm - 12:45pm
Electromigration Simulation of C4 Solder Bumps with Cu and Ni Under-bump Metallization 1STATS ChipPAC, Singapore; 2STATS ChipPAC, USA; 3STATS ChipPAC, Korea | ||