Modelling Approach to Assess Localized Strain Effects in Copper Plated Through Holes for Highly Reliable PCBs

Janine Conrad¹, Martin Schneider-Ramelow², Olaf Wittler¹

¹Fraunhofer IZM, Germany; ²TU Berlin, Germany

Optimizing Multilevel Microvia Structures for Thermo-mechanical Reliability in High-speed HDI PCBs

Chinmay Nawghane¹, Maarten Cauwe¹, Marnix Van De Slyeke², Stan Heltzel³

¹imec, Belgium; ²ACB, Belgium; ³ESA-ESTEC, The Netherlands

PCB embedding: A Case Study on MOSFETs and more

René Poelma¹, Ole Bergman², Jue Chen³, Nikhil Gupta², Rami Younis², Willem van Driel², Guo Qi Zhang²

¹Nexperia B.V., The Netherlands; ²Delft Universtiy of Technology, The Netherlands; ³Schweizer Electronic AG, Germany

A Viscoelastic Effective Model and Characterization Method for Woven Composites and a Homogenization Approach for Applications in Complex PCB Simulations

Aleksei Sokolov¹, Marius van Dijk², Anne Groth², Olaf Wittler², Martin Schneider-Ramelow¹

¹Technische Universität Berlin, Germany; ²Fraunhofer Institute for Reliability and Microintegration (IZM), Germany