Conference Agenda

Session

S19: Material Modeling for Packaging

Time:

Wednesday, 22/Apr/2026:

10:15am - 11:15am

Session Chair: Torsten Hauck, Berlin Institute of Technology / Technische Universität Berlin
Session Chair: Mickaël LEICHT, Université de Lorraine - IRT Saint Exupéry

Location: Alder+Poplar

Presentations

10:15am - 10:35am

Subcritical Crack Propagation in Solder Resist Materials During Fatigue Bulge Testing in Experiment and Simulation

Brinda George¹, Ingolf Rau¹, Georg M. Reuther¹, Martin R. Niessner¹, Uwe Zschenderlein², Bernhard Wunderle²

¹Infineon Technologies AG Munich, Germany; ²TU Chemnitz, Germany

10:35am - 10:55am

Elastic-plastic Temperature and Porosity dependent Material Model for Sinter Silver with Minimal Measurement Effort by using RVE

Tobias Daniel Horn^1,2, Jan Albrecht^1,2, Sven Rzepka^1,2

¹Fraunhofer ENAS, Micro Materials Center; ²Technical University of Chemnitz, Center for Micro and Nanotechnologies

10:55am - 11:15am

Moisture Transport under Power Cycling in Silicone-gel Encapsulated Power Modules

Zoubir Khatir, Mounira Bouarroudj, Ali Ibrahim

SATIE, Gustave Eiffel University, France