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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Only Sessions at Date / Time

Session Overview

Session

S19: Material Modeling for Packaging

Time:

Wednesday, 22/Apr/2026:

10:15am - 11:15am

Presentations

10:15am - 10:35am

Material Property Prediction of Bi-doped SnAgCu Solders under High Strain Rates of Mechanical Shock and Vibration

Pradeep Lall, Vishal Mehta, Jeff Suhling, David Locker

Auburn University, United States of America

10:35am - 10:55am

Elastic-plastic Temperature and Porosity dependent Material Model for Sinter Silver with Minimal Measurement Effort by using RVE

Tobias Daniel Horn^1,2, Jan Albrecht^1,2

¹Fraunhofer ENAS, Micro Materials Center; ²Technical University of Chemnitz, Center for Micro and Nanotechnologies

10:55am - 11:15am

Moisture Transport under Power Cycling in Silicone-gel Encapsulated Power Modules - Pumping and Reverse Pumping

Zoubir Khatir, Mounira Bouarroudj, Ali Ibrahim

SATIE, Gustave Eiffel University, France