Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Agenda Overview |
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S19: Material Modeling for Packaging
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10:15am - 10:35am
Subcritical Crack Propagation in Solder Resist Materials During Fatigue Bulge Testing in Experiment and Simulation 1Infineon Technologies AG Munich, Germany; 2TU Chemnitz, Germany 10:35am - 10:55am
Elastic-plastic Temperature and Porosity dependent Material Model for Sinter Silver with Minimal Measurement Effort by using RVE 1Fraunhofer ENAS, Micro Materials Center; 2Technical University of Chemnitz, Center for Micro and Nanotechnologies 10:55am - 11:15am
Moisture Transport under Power Cycling in Silicone-gel Encapsulated Power Modules SATIE, Gustave Eiffel University, France | ||