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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Agenda Overview

Session

S18: Digital Twins & Model Exchange

Time:

Wednesday, 22/Apr/2026:

10:15am - 11:15am

Session Chair: Roseanne Duca, STMicroelectronics
Session Chair: Sjoerd Douwe Medard de Jong, TU Delft

Location: Cedar-Magnolia-Sycamore

Presentations

10:15am - 10:35am

Surrogate-Integrated, Simulation-Driven Digital Twin for Thermoset Molding Processes

Venu Prakash Kasinikota¹, Alexander Steiner¹, Wolfgang Muehleisen², Markus Grinschgl³, Peter Fuchs¹, Margit Christa Lang¹

¹Polymer Competence Center Leoben GmbH (PCCL), Germany; ²Silicon Austria Labs GmbH (SAL), Austria; ³GIPRO GmbH, Austria

10:35am - 10:55am

Software-agnostic Thermal-mechanical Model Exchange via FMUs for Microelectronics Reliability Simulation

Michiel van Soestbergen

NXP Semiconductors, Netherlands, The

10:55am - 11:15am

A Minimal-Interface Reduced-Order Modeling Approach for Including Convection Effects in Thermomechanical Field Simulation

Max Keller², Tamara Bechtold¹

¹CADFEM Germany GmbH, Germany; ²Jade University, Germany

EuroSimE 2026

27^th International Conference on Thermal, Mechanical and Multi-Physics Simulation
and Experiments in Microelectronics and Microsystems

April 19–22, 2026 | Warsaw, Poland

Conference Agenda