Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Agenda Overview |
| Session | ||
S17: Thermal Design Modeling and Experimental Characterization
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| Presentations | ||
8:30am - 8:50am
Hybrid Zener–NTC Dynamic Circuit for Active Hot-spot Mitigation in Photovoltaic Modules University of Napoli Federico II, Italy 8:50am - 9:10am
Influence of Heat Source Size and Location on the Comparative Performance of Vapor Chambers and Copper Heat Spreaders University of Limerick, Ireland 9:10am - 9:30am
Advanced 3D Modeling of Reactive Multilayer Systems for Chip- and Wafer-Level Bonding Applications Fraunhofer Institute for Electronic Nano Systems, Germany 9:30am - 9:50am
Research on Design Optimization of Temperature and Current Sharing Uniformity of SiC HybridPACK Drive Power Modules Under MultiPhysics Coupling 1Southern University of Science and Technology, People's Republic of China; 2Southern University of Science and Technology, China; 3AccoPower, China; 4Delft University of Technology, The Netherlands | ||