Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Session Overview |
| Session | |
S16: Mirelai Session
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| Presentations | |
8:30am - 8:50am
Failure Analysis of Electronic Packaging using Eddy Current Thermography 1Berliner Nanotest and Design GmbH, Berlin, Germany; 2Chemnitz University of Technology, Chemnitz, Germany; 3Fraunhofer ENAS, Chemnitz, Germany 8:50am - 9:05am
Influence of Low Temperature Swings on Solder Joint Reliability 1Delft University of Technology (TU Delft), Netherlands, The; 2NXP Semiconductors 9:05am - 9:20am
Machine Learning for Microstructure Characterisation of Intermetallic Layers in BGA Solder Joints 1School of Computing and Mathematical Sciences, University of Greenwich, London, United Kingdom; 2Materials Consultancy Services Limited, Midlothian Innovation Centre, Edinburgh 9:20am - 9:35am
Efficient Augmented Kalman Filter Parameter Tuning for Thermal Virtual Sensing in Electronic Systems 1imec; 2Siemens Digital Industries Software; 3KU Leuven; 4Flanders Make 9:35am - 9:50am
Effect of Electroplating-induced Copper Thickness Variations on the Thermomechanical Reliability of Plated Through Holes 1Siemens Industry Software nv, Strategy & Innovation, Leuven, Belgium; 2imec, Belgium; 3Department of Computer Science, KU Leuven, Belgium; 4Flanders Make@KU Leuven, Belgium | |