Influence of Low Temperature Swings on Solder Joint Reliability

Muhammad Musadiq¹, Romuald Roucou², Willem Van Driel¹, Rene Rongen², Guoqi Zhang¹

¹Delft University of Technology (TU Delft), Netherlands, The; ²NXP Semiconductors

Machine Learning for Microstructure Characterisation of Intermetallic Layers in BGA Solder Joints

Muhammad Umair Najeem^1,2, Razia Sulthana Abdul Kareem¹, Aidan Robinson², Patricia Ferrie², Stewart McCracken², Stoyan Stoyanov¹

¹University of Greenwich, United Kingdom; ²Materials Consultancy Services Limited, Midlothian Innovation Centre, Scotland

Efficient Augmented Kalman Filter Parameter Tuning for Thermal Virtual Sensing in Electronic Systems

Matteo Depaola^1,2,3, Daniel De Gregoriis², Robin Bornoff², Bart Vandevelde¹, David Moens^3,4

¹imec; ²Siemens Digital Industries Software; ³KU Leuven; ⁴Flanders Make

Effect of Electroplating-induced Copper Thickness Variations on the Thermomechanical Reliability of Plated Through Holes

Marco Sperti¹, Nicolas Lammens¹, Chinmay Nawghane², Bart Vandevelde², Mathias Verbeke^3,4

¹Siemens Industry Software nv, Belgium; ²imec, Belgium; ³KU Leuven, Belgium; ⁴Flanders Make@KU Leuven, Belgium

Physics-informed Neural Network for Multi-scale Thermal Transport in AlGaN/GaN HEMT Heterostructures

Shehryar Imtiaz¹, Francesco Stranieri¹, Lisa Mitterhuber-Gress², Marco Mauri¹, Stefano Mariani³

¹Technoprobe, Cernusco Lombardone, Italy; ²Materials Center Leoben Forschung GmbH (MCL), Austria; ³Department of Civil and Environmental Engineering, Politecnico di Milano, Italy