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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Agenda Overview

Session

S14: Advanced Packaging Reliability

Time:

Tuesday, 21/Apr/2026:

5:00pm - 6:10pm

Session Chair: Mike Röllig, Fraunhofer-Institut für Keramische Technologien und Systeme - Institutsteil Materialdiagnostik
Session Chair: Marco Sperti, imec

Location: Cedar-Magnolia-Sycamore

Presentations

5:00pm - 5:30pm

Predicting Redistribution Layer (RDL) Interfacial Strength and Delamination in Fan-out Wafer Level Packaging

Rohit Gandhi¹, Nikhitha Poornabodha¹, Pallavi Jithendrriyan¹, Pranav Srinivasan², Aniket Bharamgonda², Christopher Bailey¹, Abhijit Dasgupta²

¹Arizona State University - Tempe, USA; ²University of Maryland, USA

5:30pm - 5:50pm

Application of Bayesian Optimization to Wire Reliability Prediction in LED Packaging

Muyuan Li, Lavinia Israel, Lukas Geisler

ams-OSRAM International GmbH, Germany

5:50pm - 6:10pm

Reliability Assessment of Advanced Fan-Out Packages Under Drop Impact Conditions

Meng-Kai Shih¹, Bo-Rui Ding², Chung-Chih Lin²

¹National Sun Yat-sen University, Taiwan; ²National Formosa University, Taiwan

EuroSimE 2026

27^th International Conference on Thermal, Mechanical and Multi-Physics Simulation
and Experiments in Microelectronics and Microsystems

April 19–22, 2026 | Warsaw, Poland

Conference Agenda