The Oxidation Effects of Copper Layer on AMB Substrate in Power Modules: A Multiscale Simulation Study

Ping Sun^1,2, Xiao Hu^1,2, Jiajie Fan¹, Emiel de Bruin², Willem van Driel¹, Guoqi Zhang¹

¹Delft University of Technology, The Netherlands; ²Boschman Technologies B.V.,The Netherlands

Study on Finite Element Analysis Modeling of Crack Propagation in Hybrid Bonding Structures Based on the Cohesive Zone Method

Yudong Yang^1,2, Xuanyu Ding², Ze Zhang¹, Haoyang Sun³, Fengze Hou¹, Rui Ma¹, Yu Zhang¹, Hongchao Zhang¹, Chi Zhang^2,4, Qiushi Kang¹, Fei Ding¹, Haibo Yang¹, Renxi Jin¹, Feng Ji³, Qidong Wang¹, Wei Wang^2,4,5, Liqiang Cao¹

¹Chinese Academy of Sciences, China; ²Peking University. China; ³Beijing Institute of Remote Sensing Equipment, China; ⁴National Key Lab of Micro/Nano Fabrication Technology, China; ⁵Beijing Advanced Innovation Center for Integrated Circuits, China

Constitutive Model Identification for Aluminium Wires and Potting Resin used in IGBT Power Modules

Clément Chedozeau^1,2, Merouane Ouhab², Natasha Vermaak³, François Hild¹

¹Université Paris-Saclay, France; ²Mitsubishi Electric R&D Centre Europe, France; ³Lehigh University, USA

A Defect-Informed Phase-Field Model for Gate Oxide Breakdown in SiC MOS Structures

Jinglin Li, Aditya Shekhar, Yaqian Zhang, Willem. D vanDriel, Guoqi Zhang

TU Delft, The Netherlands