Conference Agenda

1:25pm - 1:55pm

Modified Infrared Thermal Characterization Methodology coupled with Modelling for GaN RF Power Amplifier Transistors in Compact SMD Packages

Amir Mirza Gheytaghi, Fan Li, Albert van Zuijlen

Ampleon B.V.

1:55pm - 2:15pm

Evaluation of the Young’s Modulus of Silicon Carbide from Specific Heat Measurements

Vincenzo Vinciguerra, Giuseppe Luigi Malgioglio, Marco Renna

STMicroelectronics, Italy

2:15pm - 2:35pm

A New Packaging and Flow Boiling Cooling Concept for HPC Applications Enabling High Thermal and Thermo-mechanical Performance on Organic Substrates

Ralph Schacht¹, Mathias Koch², Tobias Gruen³, Joerg Arnold⁴, Ben Majed¹, Karl-Friedrich Becker², Mohamad Abo Ras³, Bernhard Wunderle⁴

¹BTU Cottbus, Germany; ²Fraunhofer IZM , Germany; ³Berliner Nanotest and Design GmbH, Germany; ⁴TU Chemnitz, Germany

2:35pm - 2:55pm

Measurement of SiC Chip CTE using Digital Image Correlation

Dong-Hyeon Kim, Sung-Min Park, Sung-Uk Zhang

Dong-Eui University, South Korea