Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
|
Session Overview |
| Session | |
S11: Thermal Experimental Characterization
| |
    | |
1:25pm - 1:55pm
On-Chip Pulsed Microheater for Rapid Nanoparticle Sintering ECTM, Department of Microelectronics, TuDelft, Delft, The Netherlands 1:55pm - 2:15pm
Evaluation of the Young’s Modulus of Silicon Carbide from Specific Heat Measurements STMicroelectronics, Italy 2:15pm - 2:35pm
A New Packaging and Flow Boiling Cooling Concept for HPC Applications Enabling High Thermal and Thermo-mechanical Performance on Organic Substrates 1Brandenburg University of Technology Cottbus-Senftenberg, Germany; 2Fraunhofer IZM , Germany; 3Berliner Nanotest and Design GmbH, Germany; 4Chemnitz University of Technology, Germany 2:35pm - 2:55pm
In-situ Quantification of CTE in Packaged SiC Chips via Synchronized Thermal Imaging and Digital Image Correlation Dong-Eui University, Korea, Republic of (South Korea) | |