Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Agenda Overview |
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S11: Thermal Experimental Characterization
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1:25pm - 1:55pm
Modified Infrared Thermal Characterization Methodology coupled with Modelling for GaN RF Power Amplifier Transistors in Compact SMD Packages Ampleon B.V. 1:55pm - 2:15pm
Evaluation of the Young’s Modulus of Silicon Carbide from Specific Heat Measurements STMicroelectronics, Italy 2:15pm - 2:35pm
A New Packaging and Flow Boiling Cooling Concept for HPC Applications Enabling High Thermal and Thermo-mechanical Performance on Organic Substrates 1BTU Cottbus, Germany; 2Fraunhofer IZM , Germany; 3Berliner Nanotest and Design GmbH, Germany; 4TU Chemnitz, Germany 2:35pm - 2:55pm
Measurement of SiC Chip CTE using Digital Image Correlation Dong-Eui University, South Korea | ||