Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Agenda Overview |
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S10: Solder Fatigue: Models & Mechanisms
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1:25pm - 1:55pm
AI Surrogate Model for PBGA Solder Fatigue Assessment Using Progressive Transfer Learning with Multi-fidelity Data Feng Chia University, Taiwan 1:55pm - 2:15pm
The Prediction of Solder Joint Geometries through the Characterization of the Micro-wetting Behavior on Component Metallizations – Experiments and Simulations Universität des Saarlandes, Germany 2:15pm - 2:35pm
Thermo-elastic-viscoplastic Damage Model for Sn-Ag-Cu Solder 1TU Berlin, Germany; 2Auburn University, USA 2:35pm - 2:55pm
Numerical analysis of solder-joint stress during the process of encapsulating an entire PCBA 1Elastic-Simulations GmbH, Germany; 2Ottronic Regeltechnik Gesellschaft m.b.H., Germany; 3Polymer Competence Center Leoben GmbH, Germany | ||