Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Agenda Overview |
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S8: Mold & interface Materials
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10:55am - 11:25am
Development of a Method for Parylene-Based Interface Toughness Characterization under Fatigue Loads for Electronic Packaging Applications 1TU Chemnitz, Germany; 2Fraunhofer ENAS, Germany 11:25am - 11:45am
Verification of the Mold Material Model Through Simulation Studies At The Product Level 1Robert Bosch GmbH, Germany; 2Robert Bosch Kft., Hungary; 3Fraunhofer ENAS, Germany 11:45am - 12:05pm
Impact of Thermal Gap Filler vs. Thermal Gap Pad Materials on the Solder Joint Lifetime of eWLB Packages in Topside Cooling Setups Infineon Technologies AG, Germany 12:05pm - 12:25pm
Effect of PFAS Removal on the Underfill and TIM Interface Properties and Performance Auburn University, United States of America | ||