Conference Agenda
| Session | ||
P: Interactive Poster Session
| ||
| Presentations | ||
Applying the Global-local Approach with the Equivalent Structure for Reliability Assessment of the Multilevel Area Array Interconnects Feng Chia University, Taiwan Deep Learning-driven Undamaged-to-damaged Response Translation for Proactive Structural Health Monitoring of Semiconductor Probe Cards 1Politecnico di Milano, Italy; 2Technoprobe, Italy Development of Piezoelectric Patterns by Direct 3D Writing Applied to Atomic Layer Deposition University of Bari, Italy Comparative Evaluation Methodology for Full Order and Superelement-containing Finite Element Models for Predicting Solder Joint Fatigue Technische Universität Dresden, Germany Effect of Underfill Cracking and Interfacial Delamination on Reliability of Advanced Electronic Packages 1University of Maryland, United States of America; 2Arizona State University, United States of America; 3Deca Technologies, United States of America Detecting Single Event Transients on a 28-nm SRAM-based FPGA under Neutron Radiation Exposure 1TU Braunschweig, Germany; 2Leibniz Universität Hannover, Germany; 3Bundeswehr Research Institute for Protective Technologies and CBRN Protection (WIS), Germany On Moisture Absorption in Non-hermetic Packages, Finite Element Model Validation through Real-time Characterization STMicroelectronics, Italy Criticality Assessment Methodology of Microvias in Printed Circuit Boards 1AT&S Austria Technologie & Systemtechnik, Austria; 2Montanuniversität Leoben, Austria; 3Polymer Competence Center Leoben GmbH, Austria Asymmetric Warpage: Determination of a Curvature Scale for Warpage Predictions STMicroelectronics, Italy Electromagnetic Finite Element Modeling of PCB-Embedded Toroidal Inductors Featuring Iron-powder Magnetic Cores 1Université Paris-Saclay, France; 2Centre national de la recherche scientifique (CNRS), France; 3Satie Lab, France; 4Universidad de Zaragoza, Spain; 5Universite Claude Bernard Lyon 1 Ampére, France; 6Université Gustave Eiffe, France Integrated Multi-physics Optimisation of MOSFET Power Modules for Reduced Parasitic Inductance and Enhanced Thermal Reliability Noesis Solutions NV, Belgium Additive Manufacturing of Copper and Ceramic for Electronics Cooling and Packaging RISE Research Institutes of Sweden, Sweden Experimental and Numerical Investigations of Mechanical Failure for a Direct Bonded Copper in Power Modules under Assembly Processes National Taiwan University, Taiwan Fabrication and FEM Analysis of Flip-chip Bonded Si Chip with Au Stud Bumps on Si Interposer 1C2N-UPSACLAY, France; 22Karlsruhe Institute of Technology (KIT), Germany Surrogate Model Development for Transient Thermal Response of Power Devices via Enhanced Integration Neural Network Functionality The University of Osaka, Japan Improving Simulation Efficiency of Chiplet Package Solder Bump Reliability Analysis Using Equivalent Beam Model National Tsing Hua University, Taiwan Design Analysis of Wire Bonding Reliability for Low Profile Quad Flat Package Based on Numerical Methods Realtek Semiconductor Corp. Parametric Assessment of Cu Pillar Microbump Interconnects Co-design for Thermomechanical Reliability University of Maryland, United States of America Transformer-enhanced Metamodels for Optimizing Material, Geometric, and Process Temperature Features in Warpage Control of Package-on-package Assemblies 1ams OSRAM AG, Austria; 2Montanuniversität Leoben, Austria; 3Polymer Competence Centre Leoben (PCCL) GmbH, Austria Optimized Design of a Liquid Precursor Flow-control Sensor System for Semiconductor Deposition Equipment via Heat-transfer Simulation 1Korea Electronics Technology Institute (KETI), Korea, Republic of (South Korea); 2YHENS, Korea, Republic of (South Korea) The Metal-Insulator Transition of VO2: A Fresh Look at a Prototypical System Materials Design SARL, France Efficient Space Charge Current Injection in Silicon Implanted Fe-doped Beta-Ga2O3 Crystals Resulting in Extremely Low Thermal Breakdown Field 1Institute of Microelectronics of Barcelona (IMB-CNM-CSIC), Spain; 2Materials Center Leoben (MCL), Austria Physics-of-Failure Based Reliability Investigations of Copper Sintered Die Attaches for Wide Band Gap Power Electronics 1Technische Universität Chemnitz, Germany; 2Nano-Join GmbH, Berlin, Germany; 3budatec GmbH,12487 Berlin, Germany; 4berliner Nanotest und Design GmbH, Germany; 5Fraunhofer ENAS, Chemnitz, Germany Transformer based SHM of Semiconductor Probe Cards: Unifying Optimal Sensor Placement and Missing Data Imputation for Reliable Online Monitoring 1Politecnico di Milano, Italy; 2Technoprobe, Italy Comparison between Linear and Nonlinear Modelling of Viscoelastic Material Behaviour on the Example of Polymer Encapsulation for Advanced Electronic Virtual Design Fraunhofer IKTS, Germany Design and Optimization of MEMS Variable-Area Capacitive Pressure Sensors for Improved Sensitivity and Linearity in Fingertip Tactile Sensing University of the Philippines, Philippines Extending the Advanced Mixed-Mode Bending Method toward Subcritical Interfacial Fracture Characterization under Cyclic Loading 1Berliner Nanotest und Design GmbH, Germany; 2TU Chemnitz, Germany Noise-preserving Circuit Synthesis from Vector-fitted Macromodels 1Infineon Technologies AG, Germany; 2Technical University of Munich, Germany Rapid and Accurate Estimation of Acoustic Coupling in MUT Devices Using finite Element Modeling imec, Belgium FEM-based Design Guidelines for the Thermal Management of PCBs with Paralleled GaN HEMT Devices 1University of Naples Federico II, Italy; 2Gdynia Maritime University, Poland Thermal Analysis of Chiplet Packaging Using an Equivalent Material Modeling Approach National Tsing Hua University, Taiwan Liquid-assisted Contactless Adhesive Bonding: Experimental validation and 2D Multiphysics Simulation 1Delft University of Technology (TU Delft), Netherlands, ECTM; 2Delft University of Technology (TU Delft), Netherlands, PME; 3ITEC Equipment CNN-based Prediction of Thermo-mechanical Properties of PCB and Interposer Conductive Layers with WGAN-augmented Data National Tsing Hua University, Taiwan Raman Spectroscopy for Rapid Assessment of Topography-dependent Oxidation in Copper Foils 1Materials Center Leoben Forschung GmbH, Austria; 2AT&S Austrian Technologie & Systemtechnik Aktiengesellschaft Modelling Framework to Capture Differences in Anisotropy Between Primary and Secondary Creep Deformation in Solder Interconnects During Rapid Temperature Excursions 1University of Maryland, USA; 2NXP Semiconductors, USA Modeling Electrode and Microchannel Geometry for Detection of Cadmium (Cd), Lead (Pb), and Copper (Cu) in Drinking Water through a Capillary-driven Microfluidic Electrochemical Sensor University of the Philippines Diliman, Philippines Reverse Engineering of QFN Epoxy Mold Compound Properties using Digital Image Correlation 1Fraunhofer IZM, Germany; 2Technische Universität Berlin, Germany Thermal Cycling Lifetime of BGA Microcontroller Package and Influence of Assembly on Aluminum Baseplates Infineon Technologies AG, Germany A Multi-Agent System for Automated Lifetime Prediction of Power Devices 1Delft University of Technology, The Netherlands; 2Fudan University, China Quantitative, Statistically Robust Characterization of Solder Joint Geometry and Voiding in Commercial BGA Assemblies 1Department of Materials, Textiles and Chemical Engineering (MaTCh), Ghent University; 2Centre for X-ray Tomography, Ghent University; 3European Synchrotron Radiation Facility, 71 Avenue des Martyrs, 38000, Grenoble, France; 4Siemens Industry Software NV; 5FlandersMake@UGent-MIRO A SAW-based Platform of AlN Layer on Si for Accelerated Stress Testing of Micro and Nano Structures 1University of Chemnitz, Germany; 2Fraunhofer Institute for Electronic Nano Systems ENAS, Germany; 3National Institute for Research and Development in Microtechnologies (IMT), Romania Design, Structural Characterization, and Superconducting Behavior of Niobium Thin-Film Microstructures for Ion-Trap Quantum Computers: Toward J–B–T Critical Surface Mapping for Cryogenic 3D SiP Integration 1Chemnitz University of Technology, Germany; 2TU Chemnitz, Germany; 3Fraunhofer Institute for Electronic Nano Systems – ENAS, Germany; 4Centre for Microtechnologies (ZfM) Chemnitz, Germany Failure Analysis of Electronic Packaging using Eddy Current Thermography 1Berliner Nanotest and Design GmbH, Germany; 2Chemnitz University of Technology, Germany; 3Fraunhofer ENAS, Germany | ||