Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Interactive Poster Session
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Applying the Global-local Approach with the Equivalent Structure for Reliability Assessment of the Multilevel Area Array Interconnects Feng Chia University, Taiwan Kinetic Monte Carlo Simulation Study on the Step-Flow Growth Mechanism of 4° Off-Axis 4H-SiC 1Foshan University, Foshan 528225, China; 2Guangdong Tianyu Semiconductor Co., Ltd.; 3Fudan University, Shanghai 200433, China; 4Delft University of Technology, Delft 2628, the Netherlands Detection and Localization of Subsurface Thermal Hotspots in 3D Microelectronics via Machine Learning 1University of Michigan, United States of America; 2American University of Madaba, Jordan; 3University of Arkansas Deep Learning-driven Undamaged-to-damaged Response Translation for Proactive Structural Health Monitoring of Semiconductor Probe Cards 1Politecnico di Milano, Italy; 2Technoprobe, Italy Development of Piezoelectric Patterns by Direct 3D Writing Applied to Atomic Layer Deposition University of Bari, Italy Comparative Evaluation Methodology for Full Order and Superelement-containing Finite Element Models for Predicting Solder Joint Fatigue Technische Universität Dresden, Germany Dynamic and Thermal Performance Evaluation of Three-Phase Full-Bridge Power Factor Correction Converters for On-Board Charger Applications 1Ph. D Program of Mechanical and Aeronautical Engineering, Feng Chia University; 2Department of Aerospace and Systems Engineering, Feng Chia University; 3Electronic and Optoelectronic System Research Laboratories, Industrial Technology Research Institute Lab-on-Chip Acoustic Detection Platform: Design, Fabrication and Performance Evaluation 1Univ. Polytechnique Hauts-de-France, CNRS, Univ. Lille, ISEN, Centrale Lille, UMR 8520 -IEMN - Institute of Electronics, Microelectronics and Nanotechnology, DOAE - Department of Opto-Acousto-Electronics, F-59313 Valenciennes, France.; 2NANOMISENE Laboratory, LR16CRMN01, Research Center in Microelectronics and Nanotechnology (CRMN), Sousse Technopole, Tunisia.; 3University of Sousse, National Engineering School of Sousse (ENISo), Tunisia. Effect of Underfill Cracking and Interfacial Delamination on Reliability of Advanced Electronic Packages 1University of Maryland, United States of America; 2Arizona State University, United States of America; 3Deca Technologies, United States of America Efficient Electro-thermal-structural Co-design Using a TCAD-FEM Integrated Surrogate Model 1Dong-Eui University, Korea, Republic of Korea; 2Pusan National University, Republic of Korea Detecting Single Event Transients on a 28-nm SRAM-based FPGA under Neutron Radiation Exposure 1Chair for Chip Design for Embedded Computing, Technische Universität Braunschweig, Braunschweig, Germany; 2RESRI Group, Institute of Microelectronic Systems (IMS), Leibniz Universität Hannover, Hannover, Germany; 3Bundeswehr Research Institute for Protective Technologies and CBRN Protection (WIS), Munster, Germany On Moisture Absorption in Non-hermetic Packages, Finite Element Model Validation through Real-time Characterization STMicroelectronics, Italy Criticality assessment methodology of Microvias in Printed Circuit Boards 1AT&S Austria Technologie & Systemtechnik, Austria; 2Montanuniversität Leoben, Institute of Mechanics, Franz-Josef-Strasse 18, 8700 Leoben, Austria; 3Polymer Competence Center Leoben GmbH, Sauraugasse 1, 8700 Leoben, Austria Design and TCAD analysis of AlN-based Devices for VUV Detection 1College of Intelligent Robotics and Advanced Manufacturing, Fudan University, Shanghai 200433, China; 2Shanghai Engineering Technology Research Center for SiC Power Device, Fudan University, Shanghai 200433, China; 3State Key Laboratory of Luminescence and Applications, Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun, Jilin 130033, China; 4EEMCS Faculty, Delft University of Technology, Delft 2628CD, the Netherlands Advanced 3D Modeling of Reactive Multilayer Systems for Chip- and Wafer-Level Bonding Applications Fraunhofer Institute for Electronic Nano Systems, Chemnitz, Germany Device level Fingerprint Methodology RISE, Sweden Asymmetric Warpage: Determination of a Curvature Scale for Warpage Predictions STMicroelectronics, Italy Electromagnetic Finite Element Modeling of PCB-Embedded Toroidal Inductors Featuring Iron-powder Magnetic Cores 1Paris-Saclay University; 2CNRS; 3Satie; 4Universidad de Zaragoza; 5Siemens Germany; 6Université Claude Bernard Lyon 1; 7Ampere; 8Université Gustave Eiffe Integrated Multi-physics Optimisation of MOSFET Power Modules for Reduced Parasitic Inductance and Enhanced Thermal Reliability Noesis Solutions NV, Belgium Measurement and CAE Analysis of Film degradation as Repeated Deformation of Foldable Displays Korea Electronics Technology Institute, Korea, Republic of (South Korea) Scaling Ion Traps using 3D Heterogeneous Integration 1Infineon Technologies Austria, Austria; 2TU Chemnitz, Germany; 3Fraunhofer ENAS, Germany Additive Manufacturing of Copper and Ceramic for Electronics Cooling and Packaging: Potential and Challenges Rise Research Institutes of Sweden, Sweden Experimental and Numerical Investigations of Mechanical Failure for a Direct Bonded Copper in an Intelligent Power Module under Assembly Processes National Taiwan University, Taiwan Fabrication and FEM Analysis of Flip-chip Bonded Si Chip with Au Stud Bumps on Si Interposer 1C2N-UPSACLAY, France; 22Karlsruhe Institute of Technology (KIT), Germany Surrogate Model Development for Transient Thermal Response of Power Devices via Enhanced Integration Neural Network Functionality The University of Osaka, Japan Improving Simulation Efficiency of Chiplet Package Solder Bump Reliability Analysis Using Equivalent Beam Model Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu 300, Taiwan, R.O.C. Criticality Assessment of Microvias at the PCBA Level Using Feature Surrogates 1Austria Technologie & Systemtechnik AG, Fabriksgasse 13, 8700 Leoben; 2Chair of Materials Science and Testing of Polymers, Montanuniversitaet Leoben, Otto-Glöckel-Straße 2, 8700 Leoben; 3Polymer Competence Center Leoben GmbH, Sauraugasse 1, 8700 Leoben Design Analysis of Wire Bonding Reliability for Low Profile Quad Flat Package Based on Numerical Methods Realtek Semiconductor Corp. Parametric Assessment of Cu Pillar Microbump Interconnects Co-design for Thermomechanical Reliability University of Maryland, United States of America Material and Microstructural Characterization via Nano and Micro Scratching Aarhus University, Denmark Transformer-enhanced Metamodels for Optimizing Material, Geometric, and Process Temperature Features in Warpage Control of Package-on-package Assemblies 1ams OSRAM AG, Austria; 2Institute of Materials Science and Testing of Polymers, Montanuniversität Leoben, Leoben, Austria; 3Polymer Competence Centre Leoben (PCCL) GmbH, Leoben, Austria Acoustic Noise Improvement with High Efficiency Samsung, Korea, Republic of (South Korea) Numerical Investigation of Double Layer Minichannel in Data Center Thermal Management Combined with Thermal Storage for Cascade Energy Utilization Indian Institute of Information Technology, Design and manufacturing, India Optimized Design of a Liquid Precursor Flow-control Sensor System for Semiconductor Deposition Equipment via Heat-transfer Simulation 1Korea Electronics Technology Institute (KETI), Korea, Republic of (South Korea); 2YHENS, Korea, Republic of (South Korea) Physical Estimation for Vertical Interconnect of Glass Substrate 1Industrial Technology Research Institute Hsinchu, Taiwan; 2National Tsing Hua University, Taiwan The Metal-Insulator Transition of VO2: A Fresh Look at a Prototypical System Materials Design SARL, France Efficient Space Charge Current Injection in Silicon Implanted Fe-doped Beta-Ga2O3 Crystals Resulting in Extremely Low Thermal Breakdown Field. Institute of Microelectronics of Barcelona (IMB-CNM-CSIC) Reliability Analysis of Sintered Ag Solder Joints for Cu Clip Bonding in Power Semiconductors Considering Geometric and Process Variations 1Dong-Eui University, Korea, Republic of (South Korea); 2Heraeus Material Limited Singapore Reliability Assessment of Advanced Fan-Out Packages Under Drop Impact Conditions 1National Sun Yat-sen University, Taiwan; 2National Formosa University Simulation of a Novel TSV Interposer for Reduced Thermal Stress While Maintaining Thermal Performance Graduate School of Advanced Technology, National Taiwan University, Taipei, Taiwan Physics-of-Failure Based Reliability Investigations of Copper Sintered Die Attaches for Wide Band Gap Power Electronics 1Chemnitz University of Technology, Germany; 2Nano-Join GmbH, Berlin, Germany; 3budatec GmbH,12487 Berlin, Germany; 4Fraunhofer ENAS, Chemnitz, Germany Transformer based SHM of Semiconductor Probe Cards: Unifying Optimal Sensor Placement and Missing Data Imputation for Reliable Online Monitoring 1Politecnico di Milano, Italy; 2Technoprobe, Italy Comparative Performance Assessment of Model Order Reduction Techniques for a Power Converter Silicon Austria Labs GmbH, Austria Comparison between Linear and Nonlinear Modelling of Viscoelastic Material Behaviour on the Example of Polymer Encapsulation for Advanced Electronic Virtual Design Fraunhofer IKTS, Germany Design and Optimization of MEMS Variable-Area Capacitive Pressure Sensors for Improved Sensitivity and Linearity in Fingertip Tactile Sensing University of the Philippines, Philippines Optimized Surface Treatment Strategies for Improved Cu-Cu Direct Bonding 1Department of Electrical Engineering, KU Leuven, Belgium; 2Department of Physics and Astronomy, KU Leuven, Belgium; 3imec, Leuven, Belgium; 4Xenics, Leuven, Belgium Assessing the Role of Vibration Excitation Method on Solder Fatigue in Board Level Vibration Tests 1NXP Semiconductors, Netherlands, The; 2Delft University of Technology, Netherlands, The Influence of Hotspot Effects on Thermo-mechanical Reliability of Integrated Gradient Microchannel Heat Sink for Data Center Thermal Management Indian Institute of Information Technology, Design and manufacturing, India Exploring Subcritical Interfacial Fracture Characterization Extending the Advanced Mixed-Mode Bending Method 1Berliner Nanotest und Design GmbH, Germany; 2University of Technology Chemnitz, Germany Noise-preserving Circuit Synthesis from Vector-fitted Macromodels 1Infineon Technologies AG, Germany; 2Technical University of Munich, Germany Rapid and Accurate Estimation of Acoustic Coupling in MUT Devices Using finite Element Modeling imec, Belgium Electromigration Simulation of C4 Solder Bumps with Cu and Ni Under-bump Metallization 1STATS ChipPAC, Singapore; 2JCET Group, China; 3STATS ChipPAC, Korea Study on Sintered Cu Interconnect Interfaces in the Substrate-embedded SiC MOSFET Power Module Institute of Microelectronics of the Chinese Academy of Sciences, China, People's Republic of FEM-based Design Guidelines for the Thermal Management of PCBs with Paralleled GaN HEMT Devices 1Department of Electrical Engineering and Information Technology, University of Naples Federico II, Italy; 2Department of Ship and Industry Automation, Gdynia Maritime University, Gdynia, Poland Thermal Analysis of Chiplet Packaging Using an Equivalent Material Modeling Approach 1College of Semiconductor Research, National Tsing Hua University, Hsinchu 300, Taiwan, R.O.C.; 2Dept. of Power Mechanical Engineering, National Tsing Hua University, Hsinchu 300, Taiwan, R.O.C. Dynamic Digital Twin as a Virtual Sensor for Temperature Estimation in WBG Power Devices Delft University of Technology, Netherlands, The Liquid-assisted Contactless Adhesive Bonding: Experimental validation and 2D Multiphysics Simulation 1Delft University of Technology (TU Delft), Netherlands, ECTM; 2Delft University of Technology (TU Delft), Netherlands, PME CNN-based Prediction of Thermo-mechanical Properties of PCB and Interposer Conductive Layers with WGAN-augmented Data National Tsing Hua University, Taiwan Raman Spectroscopy as a Rapid Screening Method for Microstructure-Dependent Oxidation of Copper Films Materials Center Leoben Forschung GmbH, Austria Artificial Intelligence (AI)-Enabled Reliability Prediction and Prognostics for Electronic Packages: A Perspective on Data, Models, and Applications 1Lamar University, United States of America; 2Feng Chia University, Taichung, Taiwan Creep Response Variability in Oligocrystalline SAC Solder Joints due to Primary Creep During Rapid Temperature Excursions 1University of Maryland, United States of America; 2NXP Semiconductors, USA Modeling Electrode and Microchannel Geometry for Detection of Cadmium (Cd), Lead (Pb), and Copper (Cu) in Drinking Water through a Capillary-driven Microfluidic Electrochemical Sensor Electrical and Electronics Engineering Institute, University of the Philippines Diliman, Philippines Physics-informed Neural Network for Multi-scale Thermal Transport in AlGaN/GaN HEMT Heterostructures 1Technoprobe, Cernusco Lombardone, Italy; 2Materials Center Leoben Forschung GmbH (MCL), Leoben, Austria; 3Department of Civil and Environmental Engineering, Politecnico di Milano, Milan, Italy Reverse Engineering of QFN Epoxy Mold Compound Properties using Digital Image Correlation 1Fraunhofer IZM, Germany; 2Technische Universität Berlin, Germany Thermal Cycling Lifetime of BGA Microcontroller Package and Influence of Assembly on Aluminum Baseplates Infineon Technologies AG, Germany High-power RF-MEMS Metal contact Switch Operating up to 300 GHz for 6G Communication Systems Indian Institute of Technology Delhi, New Delhi, India, India A Multi-Agent System for Automated Lifetime Prediction of Power Devices 1EEMCS Faculty, Delft University of Technology, Delft, 2628 CD, The Netherlands; 2Shanghai Engineering Technology Research Center of SiC Power Device, College of Intelligent Robotics and Advanced Manufacturing, Fudan University, 200433, China Flow-boiling Cooling Concept for a Small Form-factor Embedded MOSFET Half-bridge Power Module 1Brandenburg University of Technology Cottbus-Senftenberg, Germany; 2Fraunhofer IZM, Germany; 3Berliner Nanotest and Design GmbH, Germany; 4Chemnitz University of Technology, Germany Research on Optimizing Current Sharing and Temperature Uniformity Performance for SiC HPD Modules 1Southern University of Science and Technology, China, People's Republic of; 2School of Microelectronics, Southern University of Science and Technology, Shenzhen , China; 3AccoPower, Guangzhou, China; 4Delft University of Technology, Fac. EEMCS, Mekelweg 4, 2628CD Delft, The Netherlands | |