Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Agenda Overview | |
| Location: Alder+Poplar |
| 2:00pm - 5:00pm |
PDC 5 Location: Alder+Poplar »Practical Model Order Reduction and Linear Superelements in Ansys Mechanical for Multiphysics Applications« Course Instructors: Mike Feuchter & Max Keller, CADFEM, Germany |
| 1:10pm - 2:30pm |
S3: Ultrasound Devices Location: Alder+Poplar Chair: Gabriele Schrag, Technical University of Munich Chair: Marcus Schulz, Berliner Nanotest und Design GmbH High-performance and Scalable DG-SEM Modeling of Large PMUT Arrays for Biomedical Imaging 1: MOX, Dipartimento di Matematica, Politecnico di Milano, Italy.; 2: Department of Civil and Environmental Engineering, Politecnico di Milano, Italy.; 3: STMicroelectronics Agrate, Italy.; 4: Università degli Studi Roma Tre, Italy. 1:30pm - 1:50pm Finite Element Modeling and Experimental Validation of Dual-mode Ultrasonic Haptics on OLED Screens 1: CEA LETI, France; 2: CEA LIST, France 1:50pm - 2:10pm Analytical System-level Model for Optimization of pMUT Based Acoustic Power Delivery for Implants 1: Imec, Leuven, Belgium; 2: KU Leuven, Belgium 2:10pm - 2:30pm Simulating pMUT Array Characteristics for Sonomyographic Hand Gesture Recognition 1: KU Leuven, Belgium; 2: University of Patras, Greece; 3: imec, Belgium |
| 2:40pm - 3:40pm |
S5: Advanced Simulation Methods Location: Alder+Poplar Chair: Alexander Huber, Montanuniversität Leoben Chair: Rene Poelma, Nexperia B.V. Numerical Simulation of a Neuron-Electrode Interface in Python and Ansys 1: Jade University of Applied Sciences, Germany; 2: University of Rostock, Germany 3:00pm - 3:20pm 3D Parametric Simulations of Mass Transport and Mechanical Properties of a Microfluidic Barrier-on-Chip Device Delft University of Technology, The Netherlands 3:20pm - 3:40pm Multiphysics Topology Optimization for MEMS Institute of Microstructure Technology (IMT), Karlsruhe Institute of Technology (KIT), Germany |
| 4:05pm - 5:25pm |
S7: Thermal Behavioral Modeling Location: Alder+Poplar Chair: Cadmus Yuan, Feng Chia University Chair: Julia Zündel, AT&S Austria Technologie & Systemtechnik Aktiengesellschaft An ANN-based Digital Twin for PCB Temperature Monitoring: Development and Validation Aptiv Services Poland 4:25pm - 4:45pm A Neural Network-Based Performance Assessment Approach for Heat-Dissipating Microchannels in Packages Guangdong University of Technology, China 4:45pm - 5:05pm Physics-inspired AI Models Trained on Abstract Synthetic Systems for Thermal Propagation Silicon Austria Labs, Austria 5:05pm - 5:25pm Electro-thermal Co-simulation of SiC MOSFET Double-pulse Tests Using a Peak-power-threshold (PPT) Method for Junction-temperature Estimation TU Delft, The Netherlands |
| 10:55am - 12:25pm |
S9: Machine Learning-based Methods Location: Alder+Poplar Chair: Nikita Ovsiannikov, Technical University of Munich Chair: Steffen Wiese, Universität des Saarlandes A Simple and Thermo-mechanically Robust Multiaxial Force Sensing Scheme Based on Polymer-MEMS and AI-based Signal Post-processing for Smart Skin Technologies 1: TU Chemnitz, Germany; 2: Fraunhofer ENAS, Germany; 3: Centre for micro- and nanotechnologies (ZfM) at TU Chemnitz, Germany; 4: Centre for Materials, Architectures and Integration of Nanomembranes (MAIN), Germany 11:25am - 11:45am Modeling of nonlinear ferroelectric microactuator with Fourier Neural Operator imec, Belgium 11:45am - 12:05pm AVA-Based Surrogate Modeling of Localized Strain in Microvia 1: Austria Technologie & Systemtechnik AG; 2: Montanuniversitaet Leoben; 3: Polymer Competence Center Leoben GmbH; 4: Fraunhofer Institute for Electronic Nano Systems (ENAS) 12:05pm - 12:25pm A Multi-agent Digital Twin Framework for Health Monitoring of SiC MOSFETs in Power Converters Delft University of Technology, Netherlands, The |
| 1:25pm - 2:55pm |
S11: Thermal Experimental Characterization Location: Alder+Poplar Chair: Mike Feuchter, CADFEM Germany GmbH Chair: Miquel Vellvehi, Instituto de Microelectrònica de Barcelona (IMB-CNM) Modified Infrared Thermal Characterization Methodology coupled with Modelling for GaN RF Power Amplifier Transistors in Compact SMD Packages Ampleon B.V. 1:55pm - 2:15pm Evaluation of the Young’s Modulus of Silicon Carbide from Specific Heat Measurements STMicroelectronics, Italy 2:15pm - 2:35pm A New Packaging and Flow Boiling Cooling Concept for HPC Applications Enabling High Thermal and Thermo-mechanical Performance on Organic Substrates 1: BTU Cottbus, Germany; 2: Fraunhofer IZM , Germany; 3: Berliner Nanotest and Design GmbH, Germany; 4: TU Chemnitz, Germany 2:35pm - 2:55pm Measurement of SiC Chip CTE using Digital Image Correlation Dong-Eui University, South Korea |
| 3:05pm - 4:35pm |
S13: Materials Modelling Location: Alder+Poplar Chair: Thomas Krivec, AT&S AG Chair: Bernhard Wunderle, TU Chemnitz The Oxidation Effects of Copper Layer on AMB Substrate in Power Modules: A Multiscale Simulation Study 1: Delft University of Technology, The Netherlands; 2: Boschman Technologies B.V.,The Netherlands 3:35pm - 3:55pm Study on Finite Element Analysis Modeling of Crack Propagation in Hybrid Bonding Structures Based on the Cohesive Zone Method 1: Chinese Academy of Sciences, China; 2: Peking University. China; 3: Beijing Institute of Remote Sensing Equipment, China; 4: National Key Lab of Micro/Nano Fabrication Technology, China; 5: Beijing Advanced Innovation Center for Integrated Circuits, China 3:55pm - 4:15pm Constitutive Model Identification for Aluminium Wires and Potting Resin used in IGBT Power Modules 1: Université Paris-Saclay, France; 2: Mitsubishi Electric R&D Centre Europe, France; 3: Lehigh University, USA 4:15pm - 4:35pm A Defect-Informed Phase-Field Model for Gate Oxide Breakdown in SiC MOS Structures TU Delft, The Netherlands |
| 5:00pm - 6:10pm |
S15: Advanced MEMS Location: Alder+Poplar Chair: Tamara Bechtold, Jade University Chair: Huaiyu Ye, Southern University of Science and Technology Numerical Characterization of Acoustic Fields within Cylindrical Air-coupled Sono-photonic Waveguides 1: Technische Universität Darmstadt, Germany; 2: Deutsches Elektronen-Synchrotron DESY, Germany; 3: Helmholtz Institute Jena, Germany; 4: GSI Helmholtzzentrum für Schwerionenforschung GmbH, Germany 5:30pm - 5:50pm Piezoelectric Contour Mode Resonators for Fast & Power-efficient On-chip Acousto-optic Modulation 1: Infineon Technologies AG, Germany; 2: Technical University of Munich, Germany; 3: Infineon Technologies Austria AG, Austria; 4: ETH Zurich, Switzerland 5:50pm - 6:10pm In Situ Evaluation of an Antifouling Vibrating System for Marine Sensors 1: CEA-Leti, France; 2: MAPIEM, University of Toulon, France; 3: IFREMER, France |
| 8:30am - 9:50am |
S17: Thermal Design Modeling and Experimental Characterization Location: Alder+Poplar Chair: Jiajie Fan, Fudan University Chair: Amir Mirza Gheytaghi, Ampleon Hybrid Zener–NTC Dynamic Circuit for Active Hot-spot Mitigation in Photovoltaic Modules University of Napoli Federico II, Italy 8:50am - 9:10am Influence of Heat Source Size and Location on the Comparative Performance of Vapor Chambers and Copper Heat Spreaders University of Limerick, Ireland 9:10am - 9:30am Advanced 3D Modeling of Reactive Multilayer Systems for Chip- and Wafer-Level Bonding Applications Fraunhofer Institute for Electronic Nano Systems, Germany 9:30am - 9:50am Research on Design Optimization of Temperature and Current Sharing Uniformity of SiC HybridPACK Drive Power Modules Under MultiPhysics Coupling 1: Southern University of Science and Technology, People's Republic of China; 2: Southern University of Science and Technology, China; 3: AccoPower, China; 4: Delft University of Technology, The Netherlands |
| 10:15am - 11:15am |
S19: Material Modeling for Packaging Location: Alder+Poplar Chair: Torsten Hauck, Berlin Institute of Technology / Technische Universität Berlin Chair: Mickaël LEICHT, Université de Lorraine - IRT Saint Exupéry Subcritical Crack Propagation in Solder Resist Materials During Fatigue Bulge Testing in Experiment and Simulation 1: Infineon Technologies AG Munich, Germany; 2: TU Chemnitz, Germany 10:35am - 10:55am Elastic-plastic Temperature and Porosity dependent Material Model for Sinter Silver with Minimal Measurement Effort by using RVE 1: Fraunhofer ENAS, Micro Materials Center; 2: Technical University of Chemnitz, Center for Micro and Nanotechnologies 10:55am - 11:15am Moisture Transport under Power Cycling in Silicone-gel Encapsulated Power Modules SATIE, Gustave Eiffel University, France |
| 11:25am - 12:45pm |
S21: Multiphysics Simulation for Packaging Location: Alder+Poplar Chair: Georg Michael Reuther, Infineon Technologies AG Chair: Robert Schwerz, Fraunhofer IKTS Investigating the Switching Loss-Reliability Trade-Off in TFP-MOSFET Voltage Regulators through Calibrated SPICE Simulations 1: University of Naples "Federico II", Italy; 2: onsemi, Analog and Mixed-Signal Group, Milan, Italy; 3: onsemi, Central Engineering, Oudenaarde, Belgium; Roznov pod Radhostem, Czech Republic; Sunnyvale, CA, USA; 4: onsemi, Power Solution Group, Hopewell Junction, NY 11:45am - 12:05pm Thermal and electrical simulations of Rad-hard Si VDMOS Transistors 1: CNM CSIC Spain; 2: Power electronics Llíria, Spain 12:05pm - 12:25pm A Fast Multidomain System-level Simulation Model for GaN Transistor Package Optimization Silicon Austria Labs GmbH, Austria 12:25pm - 12:45pm Electromigration Simulation of C4 Solder Bumps with Cu and Ni Under-bump Metallization 1: STATS ChipPAC, Singapore; 2: STATS ChipPAC, USA; 3: STATS ChipPAC, Korea |