Material Property Prediction of Bi-doped SnAgCu Solders under High Strain Rates of Mechanical Shock and Vibration

Pradeep Lall, Vishal Mehta, Jeff Suhling, David Locker

Auburn University, United States of America

Thermomechanical and Microstructural Mechanisms Governing Copper Degradation under High Strain Rate Thermo-mechanical Fatigue

Alexander Huber^1,2, Manuel Petersmann², Thomas Antretter¹

1: Montanuniversität Leoben, Austria; 2: Kompetenzzentrum Automobil- und Industrieelektronik GmbH, Austria

Thermal Shock Simulations of a PCB with Embedded Components and Microvia Based Interconnection: Meso-scale Modeling of the Woven Composite

Mickaël LEICHT^1,2, Baptiste ARATI², Gautier GIRARD¹, Alexandre MARIE³, Aymeric LAGADEC⁴, Gilles SEGOND², Bernardo COUGO², Olivier PERROTIN⁵, Jean-Pierre FRADIN³, Fabio COCCETTI², Sébastien MERCIER¹

1: Université de Lorraine, France.; 2: IRT Saint Exupéry, France.; 3: Icam School of Engineering, France.; 4: ELVIA Electronics, France.; 5: Alter Technology France,France.

Secondary Effects Causing Early Solder Fatigue Failure of QFN Components Subjected to Test- and Field Cycling

Rainer Dudek¹, Peter Fruehauf², Matthias Prinz¹, Lisa Kreher¹, Susana Richter-Trummer¹, Lutz Scheiter³, Jan Albrecht¹, Sven Rzepka¹

1: Fraunhofer ENAS, Chemnitz, Germany; 2: Siemens AG, Technology, Berlin, Germany; 3: CWM GmbH, Chemnitz, Germany

Holistic Warpage Evaluation Methodology Across Assembly Flow with Focus on Final Package Integrity in advanced packages like 2.3D-R & 2.3D-BT

Mohan Prashanth Javaregowda¹, Js Paek², Han-wen Lin², Hans-Gerd Jetten¹, Thomas Huber¹

1: Intel Corporation, Germany; 2: Intel Corporation,Taiwan

Thermal-mechanical Coupling Simulation of Chiplet 2.5D Packaging Based on Chiplet Distribution and Full Copper Interconnection

Shizhen Li¹, ChenShan Gao¹, Xu Liu², Huaiyu Ye^1,2, Guoqi Zhang²

1: Southern University of Science and Technology. China; 2: Delft University of Technology, The Netherlands

Thermo-Mechanical Warpage Prediction and Validation of Large Chiplet Packages

Klara Volckaert, Riet Labie, Kurt Herremans, Kris Vanstreels, Mario Gonzalez, Bart Vandevelde

Imec, Belgium

Layout-oriented Design of MEMS Acceleration Sensor and Evaluation of Packaging Effects

Alexey Shaporin¹, Annett Krusch², Sebastian Weidlich², Petra Kuenzel¹, Christian Behl¹, Roman Forke¹, Karla Hiller², Susann Hahn², Danny Reuter²

1: FhI ENAS, Germany; 2: TU Chemnitz, Germany

Design Optimization of a Multi-resonant Folded Beam Piezoelectric Energy Harvester Using an Efficient Two-phase Topology Optimization

Siyang Hu^1,2, Dennis Hohlfeld¹, Tamara Bechtold^2,1

1: University of Rostock, Germany; 2: Jade University of Applied Sciences, Germany

Physics-based State-space Model for Self-sensing in Piezoelectric MEMS Microphones

Nikita Ovsiannikov¹, Til Friebe¹, Christian Bretthauer², Gabriele Schrag¹

1: Technical University of Munich, Germany; 2: Infineon Technologies AG, Germany

Lab-on-Chip Acoustic Detection Platform: Design, Fabrication and Performance Evaluation

Makrem BEN ABDELKADER^1,2,3, Hatem DAHMANI¹, Reda AITAYAD¹, Samuel DUPONT¹, Chérif DRIDI², Julien CARLIER¹

1: Univ. Polytechnique Hauts-de-France, France; 2: NANOMISENE Laboratory, Tunisia; 3: University of Sousse, Tunisia

Development of a Method for Parylene-Based Interface Toughness Characterization under Fatigue Loads for Electronic Packaging Applications

Carlos Rincon-Ruiz¹, Martin Kuehn², Uwe Zschenderlein¹, Imants Cirulis², Franz Selbmann², Patrick Tuerk¹, Frank Roscher², Bernhard Wunderle^1,2

1: TU Chemnitz, Germany; 2: Fraunhofer ENAS, Germany

Verification of the Mold Material Model Through Simulation Studies At The Product Level

Akshay Vivek Panchwagh¹, Przemyslaw Jakub Gromala², Sven Rzepka³

1: Robert Bosch GmbH, Germany; 2: Robert Bosch Kft., Hungary; 3: Fraunhofer ENAS, Germany

Impact of Thermal Gap Filler vs. Thermal Gap Pad Materials on the Solder Joint Lifetime of eWLB Packages in Topside Cooling Setups

Martin Niessner, Peter Lutz, Walter Hartner, Harald Preu, Juliane Junesch, Holger Mai

Infineon Technologies AG, Germany

Effect of PFAS Removal on the Underfill and TIM Interface Properties and Performance

Pradeep Lall, Padmanava Choudhury, Aathi Pandurangan

Auburn University, United States of America

AI Surrogate Model for PBGA Solder Fatigue Assessment Using Progressive Transfer Learning with Multi-fidelity Data

Cadmus Yuan, Jian-Cheng Hong, Pin-Sian Li

Feng Chia University, Taiwan

The Prediction of Solder Joint Geometries through the Characterization of the Micro-wetting Behavior on Component Metallizations – Experiments and Simulations

Cham Thi Trinh, Erik Wiss, Jilin He, Steffen Wiese

Universität des Saarlandes, Germany

Thermo-elastic-viscoplastic Damage Model for Sn-Ag-Cu Solder

Torsten Hauck¹, Aleksandr Morozov¹, Wolfgang H. Müller¹, Golam Rakib Mazumder², Jeffrey C. Suhling²

1: TU Berlin, Germany; 2: Auburn University, USA

Numerical analysis of solder-joint stress during the process of encapsulating an entire PCBA

Harald Ziegelwanger¹, Mario Gschwandl², Thomas Hollinger³, Venu Prakash Kasinikota³, Peter Fuchs³, Margit Lang³

1: Elastic-Simulations GmbH, Germany; 2: Ottronic Regeltechnik Gesellschaft m.b.H., Germany; 3: Polymer Competence Center Leoben GmbH, Germany

An Advanced Mission Profile-based Lifetime Assessment in Power Electronics Assembly Using Physics-informed Surrogate Modeling

Abantika Bose, Dawei Zhao, Jürgen Leib, Maximilian Hofmann

Fraunhofer IISB, Germany

Compact Thermal RC Model of a Multi Die Power Stage with In-Package Sensing for Remaining Useful Life Prediction

Ole J. Bergmann¹, Henk van Zeijl¹, Willem van Driel¹, Guoqi Zhang¹, René H. Poelma^1,2

1: Delft University of Technology, The Netherlands; 2: Nexperia BV, The Netherlands

Using Fragility Surfaces for Remaining Useful Lifetime Estimations

Roland Niemeier¹, Günther Hasna¹, Alexander Kabakchiev², Dharshan Barkur², Przemyslaw Jakub Gromala³

1: Ansys Germany GmbH, Germany; 2: Robert Bosch GmbH, Germany; 3: Bosch Hungary Kft, Hungary

Efficient Reliability Assessment of Solder Joints in Automotive Applications Using HYPER-SUB

Mike Feuchter¹, Hanna Baumgartl¹, Martin Hanke¹, Bernhard Wunderle³, Sven Rzepka²

1: CADFEM Germany GmbH, Germany; 2: Fraunhofer Institute for Electronic Nano Systems ENAS; 3: Technische Universität Chemnitz

Predicting Redistribution Layer (RDL) Interfacial Strength and Delamination in Fan-out Wafer Level Packaging

Rohit Gandhi¹, Nikhitha Poornabodha¹, Pallavi Jithendrriyan¹, Pranav Srinivasan², Aniket Bharamgonda², Christopher Bailey¹, Abhijit Dasgupta²

1: Arizona State University - Tempe, USA; 2: University of Maryland, USA

Application of Bayesian Optimization to Wire Reliability Prediction in LED Packaging

Muyuan Li, Lavinia Israel, Lukas Geisler

ams-OSRAM International GmbH, Germany

Reliability Assessment of Advanced Fan-Out Packages Under Drop Impact Conditions

Meng-Kai Shih¹, Bo-Rui Ding², Chung-Chih Lin²

1: National Sun Yat-sen University, Taiwan; 2: National Formosa University, Taiwan

Influence of Low Temperature Swings on Solder Joint Reliability

Muhammad Musadiq¹, Romuald Roucou², Willem Van Driel¹, Rene Rongen², Guoqi Zhang¹

1: Delft University of Technology (TU Delft), Netherlands, The; 2: NXP Semiconductors

Machine Learning for Microstructure Characterisation of Intermetallic Layers in BGA Solder Joints

Muhammad Umair Najeem^1,2, Razia Sulthana Abdul Kareem¹, Aidan Robinson², Patricia Ferrie², Stewart McCracken², Stoyan Stoyanov¹

1: University of Greenwich, United Kingdom; 2: Materials Consultancy Services Limited, Midlothian Innovation Centre, Scotland

Efficient Augmented Kalman Filter Parameter Tuning for Thermal Virtual Sensing in Electronic Systems

Matteo Depaola^1,2,3, Daniel De Gregoriis², Robin Bornoff², Bart Vandevelde¹, David Moens^3,4

1: imec; 2: Siemens Digital Industries Software; 3: KU Leuven; 4: Flanders Make

Effect of Electroplating-induced Copper Thickness Variations on the Thermomechanical Reliability of Plated Through Holes

Marco Sperti¹, Nicolas Lammens¹, Chinmay Nawghane², Bart Vandevelde², Mathias Verbeke^3,4

1: Siemens Industry Software nv, Belgium; 2: imec, Belgium; 3: KU Leuven, Belgium; 4: Flanders Make@KU Leuven, Belgium

Physics-informed Neural Network for Multi-scale Thermal Transport in AlGaN/GaN HEMT Heterostructures

Shehryar Imtiaz¹, Francesco Stranieri¹, Lisa Mitterhuber-Gress², Marco Mauri¹, Stefano Mariani³

1: Technoprobe, Cernusco Lombardone, Italy; 2: Materials Center Leoben Forschung GmbH (MCL), Austria; 3: Department of Civil and Environmental Engineering, Politecnico di Milano, Italy

Surrogate-Integrated, Simulation-Driven Digital Twin for Thermoset Molding Processes

Venu Prakash Kasinikota¹, Alexander Steiner¹, Wolfgang Muehleisen², Markus Grinschgl³, Peter Fuchs¹, Margit Christa Lang¹

1: Polymer Competence Center Leoben GmbH (PCCL), Germany; 2: Silicon Austria Labs GmbH (SAL), Austria; 3: GIPRO GmbH, Austria

Software-agnostic Thermal-mechanical Model Exchange via FMUs for Microelectronics Reliability Simulation

Michiel van Soestbergen

NXP Semiconductors, Netherlands, The

A Minimal-Interface Reduced-Order Modeling Approach for Including Convection Effects in Thermomechanical Field Simulation

Max Keller², Tamara Bechtold¹

1: CADFEM Germany GmbH, Germany; 2: Jade University, Germany

Modelling Approach to Assess Localized Strain Effects in Copper Plated Through Holes for Highly Reliable PCBs

Janine Conrad¹, Martin Schneider-Ramelow², Olaf Wittler¹

1: Fraunhofer IZM, Germany; 2: TU Berlin, Germany

Optimizing Multilevel Microvia Structures for Thermo-mechanical Reliability in High-speed HDI PCBs

Chinmay Nawghane¹, Maarten Cauwe¹, Marnix Van De Slyeke², Stan Heltzel³

1: imec, Belgium; 2: ACB, Belgium; 3: ESA-ESTEC, The Netherlands

PCB embedding: A Case Study on MOSFETs and more

René Poelma¹, Ole Bergman², Jue Chen³, Nikhil Gupta², Rami Younis², Willem van Driel², Guo Qi Zhang²

1: Nexperia B.V., The Netherlands; 2: Delft Universtiy of Technology, The Netherlands; 3: Schweizer Electronic AG, Germany

A Viscoelastic Effective Model and Characterization Method for Woven Composites and a Homogenization Approach for Applications in Complex PCB Simulations

Aleksei Sokolov¹, Marius van Dijk², Anne Groth², Olaf Wittler², Martin Schneider-Ramelow¹

1: Technische Universität Berlin, Germany; 2: Fraunhofer Institute for Reliability and Microintegration (IZM), Germany

Artificial Intelligence (AI)-Enabled Reliability Prediction and Prognostics for Electronic Packages: A Perspective on Data, Models, and Applications

Xuejun Fan¹, Cadmus Yuan², Xinyu Liu¹

1: Lamar University, United States of America; 2: Feng Chia University, Taichung, Taiwan

From Chip to AI Factory: A Five-Year Roadmap for Silicon Suppliers and Hyperscalers

Gamal Refai-Ahmed¹, Mohammed Shaheen², CW Chen³

1: AMD, USA; 2: Humain, Saudia Arabia; 3: Supermicor, Taiwan