Influence of Low Temperature Swings on Solder Joint Reliability

Muhammad Musadiq¹, Romuald Roucou², Willem Van Driel¹, Rene Rongen², Guoqi Zhang¹

1: Delft University of Technology (TU Delft), Netherlands, The; 2: NXP Semiconductors

Machine Learning for Microstructure Characterisation of Intermetallic Layers in BGA Solder Joints

Muhammad Umair Najeem^1,2, Razia Sulthana Abdul Kareem¹, Aidan Robinson², Patricia Ferrie², Stewart McCracken², Stoyan Stoyanov¹

1: University of Greenwich, United Kingdom; 2: Materials Consultancy Services Limited, Midlothian Innovation Centre, Scotland

Efficient Augmented Kalman Filter Parameter Tuning for Thermal Virtual Sensing in Electronic Systems

Matteo Depaola^1,2,3, Daniel De Gregoriis², Robin Bornoff², Bart Vandevelde¹, David Moens^3,4

1: imec; 2: Siemens Digital Industries Software; 3: KU Leuven; 4: Flanders Make

Effect of Electroplating-induced Copper Thickness Variations on the Thermomechanical Reliability of Plated Through Holes

Marco Sperti¹, Nicolas Lammens¹, Chinmay Nawghane², Bart Vandevelde², Mathias Verbeke^3,4

1: Siemens Industry Software nv, Belgium; 2: imec, Belgium; 3: KU Leuven, Belgium; 4: Flanders Make@KU Leuven, Belgium

Physics-informed Neural Network for Multi-scale Thermal Transport in AlGaN/GaN HEMT Heterostructures

Shehryar Imtiaz¹, Francesco Stranieri¹, Lisa Mitterhuber-Gress², Marco Mauri¹, Stefano Mariani³

1: Technoprobe, Cernusco Lombardone, Italy; 2: Materials Center Leoben Forschung GmbH (MCL), Austria; 3: Department of Civil and Environmental Engineering, Politecnico di Milano, Italy

Hybrid Zener–NTC Dynamic Circuit for Active Hot-spot Mitigation in Photovoltaic Modules

Gerardo Saggese, Antonio Pio Catalano, Zain ul Abdin Qureshi, Monica De Riso, Pierluigi Guerriero, Santolo Daliento

University of Napoli Federico II, Italy

Influence of Heat Source Size and Location on the Comparative Performance of Vapor Chambers and Copper Heat Spreaders

Wee Jian Ng, Jeff Punch, Vanessa Egan

University of Limerick, Ireland

Advanced 3D Modeling of Reactive Multilayer Systems for Chip- and Wafer-Level Bonding Applications

Sounak Nandi, Klaus Vogel, Christian Hofmann, Silvia Braun

Fraunhofer Institute for Electronic Nano Systems, Germany

Research on Design Optimization of Temperature and Current Sharing Uniformity of SiC HybridPACK Drive Power Modules Under MultiPhysics Coupling

Yueqian Wu¹, Hanshi Wang², Yong Wang³, Chunjian Tan², Huaiyu Ye^2,4, Wei Zhang¹, Guoqi Zhang⁴

1: Southern University of Science and Technology, People's Republic of China; 2: Southern University of Science and Technology, China; 3: AccoPower, China; 4: Delft University of Technology, The Netherlands

Surrogate-Integrated, Simulation-Driven Digital Twin for Thermoset Molding Processes

Venu Prakash Kasinikota¹, Alexander Steiner¹, Wolfgang Muehleisen², Markus Grinschgl³, Peter Fuchs¹, Margit Christa Lang¹

1: Polymer Competence Center Leoben GmbH (PCCL), Germany; 2: Silicon Austria Labs GmbH (SAL), Austria; 3: GIPRO GmbH, Austria

Software-agnostic Thermal-mechanical Model Exchange via FMUs for Microelectronics Reliability Simulation

Michiel van Soestbergen

NXP Semiconductors, Netherlands, The

A Minimal-Interface Reduced-Order Modeling Approach for Including Convection Effects in Thermomechanical Field Simulation

Max Keller², Tamara Bechtold¹

1: CADFEM Germany GmbH, Germany; 2: Jade University, Germany

Subcritical Crack Propagation in Solder Resist Materials During Fatigue Bulge Testing in Experiment and Simulation

Brinda George¹, Ingolf Rau¹, Georg M. Reuther¹, Martin R. Niessner¹, Uwe Zschenderlein², Bernhard Wunderle²

1: Infineon Technologies AG Munich, Germany; 2: TU Chemnitz, Germany

Elastic-plastic Temperature and Porosity dependent Material Model for Sinter Silver with Minimal Measurement Effort by using RVE

Tobias Daniel Horn^1,2, Jan Albrecht^1,2, Sven Rzepka^1,2

1: Fraunhofer ENAS, Micro Materials Center; 2: Technical University of Chemnitz, Center for Micro and Nanotechnologies

Moisture Transport under Power Cycling in Silicone-gel Encapsulated Power Modules

Zoubir Khatir, Mounira Bouarroudj, Ali Ibrahim

SATIE, Gustave Eiffel University, France

Modelling Approach to Assess Localized Strain Effects in Copper Plated Through Holes for Highly Reliable PCBs

Janine Conrad¹, Martin Schneider-Ramelow², Olaf Wittler¹

1: Fraunhofer IZM, Germany; 2: TU Berlin, Germany

Optimizing Multilevel Microvia Structures for Thermo-mechanical Reliability in High-speed HDI PCBs

Chinmay Nawghane¹, Maarten Cauwe¹, Marnix Van De Slyeke², Stan Heltzel³

1: imec, Belgium; 2: ACB, Belgium; 3: ESA-ESTEC, The Netherlands

PCB embedding: A Case Study on MOSFETs and more

René Poelma¹, Ole Bergman², Jue Chen³, Nikhil Gupta², Rami Younis², Willem van Driel², Guo Qi Zhang²

1: Nexperia B.V., The Netherlands; 2: Delft Universtiy of Technology, The Netherlands; 3: Schweizer Electronic AG, Germany

A Viscoelastic Effective Model and Characterization Method for Woven Composites and a Homogenization Approach for Applications in Complex PCB Simulations

Aleksei Sokolov¹, Marius van Dijk², Anne Groth², Olaf Wittler², Martin Schneider-Ramelow¹

1: Technische Universität Berlin, Germany; 2: Fraunhofer Institute for Reliability and Microintegration (IZM), Germany

Investigating the Switching Loss-Reliability Trade-Off in TFP-MOSFET Voltage Regulators through Calibrated SPICE Simulations

Giorgio Eliseo^1,2, Ciro Scognamillo¹, Antonio Pio Catalano¹, Vincenzo d'Alessandro¹, Francesco De Paola², Jaume Roig Guitart³, Petr Betak³, James Victory³, Dean Probst⁴

1: University of Naples "Federico II", Italy; 2: onsemi, Analog and Mixed-Signal Group, Milan, Italy; 3: onsemi, Central Engineering, Oudenaarde, Belgium; Roznov pod Radhostem, Czech Republic; Sunnyvale, CA, USA; 4: onsemi, Power Solution Group, Hopewell Junction, NY

Thermal and electrical simulations of Rad-hard Si VDMOS Transistors

EUSEBIO RODRIGO¹, MIQUEL VELLVEHI¹, XAVIER JORDA¹, LLORENÇ LATORRE², JOSÉ CAMPS², JOSÉ REBOLLO¹

1: CNM CSIC Spain; 2: Power electronics Llíria, Spain

A Fast Multidomain System-level Simulation Model for GaN Transistor Package Optimization

Damiano Caponi, Giovanna Grosso, Abinash Pradhan, Ali Roshanghias

Silicon Austria Labs GmbH, Austria

Electromigration Simulation of C4 Solder Bumps with Cu and Ni Under-bump Metallization

Facheng Zhao¹, Liping Zhu², YongTaek Lee³, JaeMyeong Kim³

1: STATS ChipPAC, Singapore; 2: STATS ChipPAC, USA; 3: STATS ChipPAC, Korea

Artificial Intelligence (AI)-Enabled Reliability Prediction and Prognostics for Electronic Packages: A Perspective on Data, Models, and Applications

Xuejun Fan¹, Cadmus Yuan², Xinyu Liu¹

1: Lamar University, United States of America; 2: Feng Chia University, Taichung, Taiwan

From Chip to AI Factory: A Five-Year Roadmap for Silicon Suppliers and Hyperscalers

Gamal Refai-Ahmed¹, Mohammed Shaheen², CW Chen³

1: AMD, USA; 2: Humain, Saudia Arabia; 3: Supermicor, Taiwan