Applying the Global-local Approach with the Equivalent Structure for Reliability Assessment of the Multilevel Area Array Interconnects

Cadmus Yuan, Si-Han Lin, Jian-Cheng Hong

Feng Chia University, Taiwan

Deep Learning-driven Undamaged-to-damaged Response Translation for Proactive Structural Health Monitoring of Semiconductor Probe Cards

Mehdi Bejani^1,2, Marco Mauri², Stefano Mariani¹

1: Politecnico di Milano, Italy; 2: Technoprobe, Italy

Development of Piezoelectric Patterns by Direct 3D Writing Applied to Atomic Layer Deposition

Francesco Pio Merafina, Anna Maria Coclite

University of Bari, Italy

Comparative Evaluation Methodology for Full Order and Superelement-containing Finite Element Models for Predicting Solder Joint Fatigue

Chengzhe Lyu, Harshitha Sriramulu, Karsten Meier, Karlheinz Bock, Juliana Panchenko

Technische Universität Dresden, Germany

Effect of Underfill Cracking and Interfacial Delamination on Reliability of Advanced Electronic Packages

Pranav Srinivasan¹, Aniket Bharamgonda¹, Abhijit Dasgupta¹, Rohit Gandhi², Christopher Bailey², George Dogiamis³

1: University of Maryland, United States of America; 2: Arizona State University, United States of America; 3: Deca Technologies, United States of America

Detecting Single Event Transients on a 28-nm SRAM-based FPGA under Neutron Radiation Exposure

Eike Hendrik Trumann¹, Gia Bao Thieu¹, Kirsten Weide-Zaage², Dorian von Wolff³, Andre Bausen³, Alexander Müller³, Guillermo Payá-Vayá¹

1: TU Braunschweig, Germany; 2: Leibniz Universität Hannover, Germany; 3: Bundeswehr Research Institute for Protective Technologies and CBRN Protection (WIS), Germany

On Moisture Absorption in Non-hermetic Packages, Finite Element Model Validation through Real-time Characterization

Samuele Zalaffi, Carlo Passagrilli, Marco Rovitto

STMicroelectronics, Italy

Criticality Assessment Methodology of Microvias in Printed Circuit Boards

Vikram G Kamble^1,2,3, Julia Zuendel¹, Thomas Krivec¹, Thomas Antretter², Peter Fillip Fuchs³

1: AT&S Austria Technologie & Systemtechnik, Austria; 2: Montanuniversität Leoben, Austria; 3: Polymer Competence Center Leoben GmbH, Austria

Asymmetric Warpage: Determination of a Curvature Scale for Warpage Predictions

Vincenzo Vinciguerra, Giuseppe Luigi Malgioglio, Marco Renna

STMicroelectronics, Italy

Electromagnetic Finite Element Modeling of PCB-Embedded Toroidal Inductors Featuring Iron-powder Magnetic Cores

Mohamed Alkurdi^1,2,3, Jesus Acero⁴, Christian Martin⁵, Mounira Bouarroudj^3,6

1: Université Paris-Saclay, France; 2: Centre national de la recherche scientifique (CNRS), France; 3: Satie Lab, France; 4: Universidad de Zaragoza, Spain; 5: Universite Claude Bernard Lyon 1 Ampére, France; 6: Université Gustave Eiffe, France

Integrated Multi-physics Optimisation of MOSFET Power Modules for Reduced Parasitic Inductance and Enhanced Thermal Reliability

Thibault Jacobs

Noesis Solutions NV, Belgium

Additive Manufacturing of Copper and Ceramic for Electronics Cooling and Packaging

Saeed Akbari, Erik Adolfsson, Cristina Rusu, Michael Salter

RISE Research Institutes of Sweden, Sweden

Experimental and Numerical Investigations of Mechanical Failure for a Direct Bonded Copper in Power Modules under Assembly Processes

H.-Y. Chan, Kuo-Chi Liao

National Taiwan University, Taiwan

Fabrication and FEM Analysis of Flip-chip Bonded Si Chip with Au Stud Bumps on Si Interposer

Seonho Seok¹, Michele Casselle², David Bouville¹, Etinne Herth¹, Jaehyun Kim¹

1: C2N-UPSACLAY, France; 2: 2Karlsruhe Institute of Technology (KIT), Germany

Surrogate Model Development for Transient Thermal Response of Power Devices via Enhanced Integration Neural Network Functionality

Yoshyuki Yamauchi, Yoshiharu Iwata, Hidefumi Wakamatsu

The University of Osaka, Japan

Improving Simulation Efficiency of Chiplet Package Solder Bump Reliability Analysis Using Equivalent Beam Model

Chia-En Chang, Qinghua Su, Kuo-Ning Chiang

National Tsing Hua University, Taiwan

Design Analysis of Wire Bonding Reliability for Low Profile Quad Flat Package Based on Numerical Methods

Chih-Yen Su, Nai-Jen Hsuan

Realtek Semiconductor Corp.

Parametric Assessment of Cu Pillar Microbump Interconnects Co-design for Thermomechanical Reliability

Pranav Srinivasan, Joseph Hutchinson, Abhijit Dasgupta

University of Maryland, United States of America

Transformer-enhanced Metamodels for Optimizing Material, Geometric, and Process Temperature Features in Warpage Control of Package-on-package Assemblies

Fredy John Porathur^1,2, Fabian Huber¹, Peter Fuchs³, Dieter P. Gruber^2,3

1: ams OSRAM AG, Austria; 2: Montanuniversität Leoben, Austria; 3: Polymer Competence Centre Leoben (PCCL) GmbH, Austria

Optimized Design of a Liquid Precursor Flow-control Sensor System for Semiconductor Deposition Equipment via Heat-transfer Simulation

Jae-Seong Jeong¹, Yu-Hwan Kim²

1: Korea Electronics Technology Institute (KETI), Korea, Republic of (South Korea); 2: YHENS, Korea, Republic of (South Korea)

The Metal-Insulator Transition of VO2: A Fresh Look at a Prototypical System

Volker Eyert

Materials Design SARL, France

Efficient Space Charge Current Injection in Silicon Implanted Fe-doped Beta-Ga2O3 Crystals Resulting in Extremely Low Thermal Breakdown Field

Pierre Gallarday¹, Aniol Vellvehí¹, Verena Leitgeb², Miquel Vellvehí¹, José Rebollo¹, Josep Montserrat¹, Barbara Kosednar-Legenstein², Lisa Mitterhuber², Elke Kraker², Anton Köck², Amador Pérez-Tomás¹

1: Institute of Microelectronics of Barcelona (IMB-CNM-CSIC), Spain; 2: Materials Center Leoben (MCL), Austria

Physics-of-Failure Based Reliability Investigations of Copper Sintered Die Attaches for Wide Band Gap Power Electronics

Jens Heilmann¹, Philipp Wittwer², Jannis Schuh³, Corinna Grosse-Kockert⁴, Adrian Stelzer², Dirk Busse³, Mohamad Abo Ras⁴, Bernhard Wunderle^1,5

1: Technische Universität Chemnitz, Germany; 2: Nano-Join GmbH, Berlin, Germany; 3: budatec GmbH,12487 Berlin, Germany; 4: berliner Nanotest und Design GmbH, Germany; 5: Fraunhofer ENAS, Chemnitz, Germany

Transformer based SHM of Semiconductor Probe Cards: Unifying Optimal Sensor Placement and Missing Data Imputation for Reliable Online Monitoring

Mehdi Bejani^1,2, Marco Mauri², Stefano Mariani¹

1: Politecnico di Milano, Italy; 2: Technoprobe, Italy

Comparison between Linear and Nonlinear Modelling of Viscoelastic Material Behaviour on the Example of Polymer Encapsulation for Advanced Electronic Virtual Design

Robert Schwerz, Mike Röllig

Fraunhofer IKTS, Germany

Design and Optimization of MEMS Variable-Area Capacitive Pressure Sensors for Improved Sensitivity and Linearity in Fingertip Tactile Sensing

Rhiyan Mae Ladlad, Jarod Soriano, Walton Matthew Kuo, Ralph Maru Grande, Rafael Pangilinan, Maria Theresa De Leon

University of the Philippines, Philippines

Extending the Advanced Mixed-Mode Bending Method toward Subcritical Interfacial Fracture Characterization under Cyclic Loading

Marcus Schulz^1,2, Daniel May², Mohamad Abo Ras¹, Bernhard Wunderle²

1: Berliner Nanotest und Design GmbH, Germany; 2: TU Chemnitz, Germany

Noise-preserving Circuit Synthesis from Vector-fitted Macromodels

Ferdinand Schiller^1,2, Christian Görner Tenorio^1,2, Christian Bretthauer¹, Gabriele Schrag²

1: Infineon Technologies AG, Germany; 2: Technical University of Munich, Germany

Rapid and Accurate Estimation of Acoustic Coupling in MUT Devices Using finite Element Modeling

Samer Houri, Rachid Haouari, Bart Weekers, Veronique Rochus

imec, Belgium

FEM-based Design Guidelines for the Thermal Management of PCBs with Paralleled GaN HEMT Devices

Antonio Pio Catalano¹, Ciro Scognamillo¹, Vincenzo d'Alessandro¹, Paweł Górecki^1,2

1: University of Naples Federico II, Italy; 2: Gdynia Maritime University, Poland

Thermal Analysis of Chiplet Packaging Using an Equivalent Material Modeling Approach

Wei-Fong Wang, Yu-Ting Su, Qinghua Su, Kuo-Ning Chiang

National Tsing Hua University, Taiwan

Liquid-assisted Contactless Adhesive Bonding: Experimental validation and 2D Multiphysics Simulation

Ahmed Abdelwahab¹, Zohreh Farmani², Hans Kuipers³, Marcel Tichem², Jiajie Fan¹, G. Q. Zhang¹

1: Delft University of Technology (TU Delft), Netherlands, ECTM; 2: Delft University of Technology (TU Delft), Netherlands, PME; 3: ITEC Equipment

CNN-based Prediction of Thermo-mechanical Properties of PCB and Interposer Conductive Layers with WGAN-augmented Data

Qinghua Su, Kuo-Ning Chiang

National Tsing Hua University, Taiwan

Raman Spectroscopy for Rapid Assessment of Topography-dependent Oxidation in Copper Foils

Verena Leitgeb¹, Barbara Kosednar-Legenstein¹, Elke Kraker¹, Julien Magnien¹, Maike Sagerer², Julia Zündel²

1: Materials Center Leoben Forschung GmbH, Austria; 2: AT&S Austrian Technologie & Systemtechnik Aktiengesellschaft

Modelling Framework to Capture Differences in Anisotropy Between Primary and Secondary Creep Deformation in Solder Interconnects During Rapid Temperature Excursions

Aniket Bharamgonda¹, Pranav Srinivasan¹, Abhijit Dasgupta¹, Shran Kishor², Abdullah Fahim², Jeroen Zaal²

1: University of Maryland, USA; 2: NXP Semiconductors, USA

Modeling Electrode and Microchannel Geometry for Detection of Cadmium (Cd), Lead (Pb), and Copper (Cu) in Drinking Water through a Capillary-driven Microfluidic Electrochemical Sensor

Victore Anand Abao, Hannah Isabel Basbas, Jericho Kent Co, Ralph Maru Grande, Rafael Pangilinan, Maria Theresa De Leon

University of the Philippines Diliman, Philippines

Reverse Engineering of QFN Epoxy Mold Compound Properties using Digital Image Correlation

Simon Kuttler¹, Marius van Dijk¹, Olaf Wittler¹, Martin Schneider-Ramelow²

1: Fraunhofer IZM, Germany; 2: Technische Universität Berlin, Germany

Thermal Cycling Lifetime of BGA Microcontroller Package and Influence of Assembly on Aluminum Baseplates

Iulia-Eliza Tinca, Florian Pielmeier, Martin Niessner, Paola Altieri-Weimar, Sophia Stautner, Mario Soric

Infineon Technologies AG, Germany

A Multi-Agent System for Automated Lifetime Prediction of Power Devices

Jialong Liang¹, Jiajie Fan^1,2, Willem van Driel¹, Guoqi Zhang¹

1: Delft University of Technology, The Netherlands; 2: Fudan University, China

Quantitative, Statistically Robust Characterization of Solder Joint Geometry and Voiding in Commercial BGA Assemblies

Jana Faes¹, Matthieu Boone², Jaianth Vijayakumar³, Nicolas Lammens⁴, Wim Van Paepegem^1,5

1: Department of Materials, Textiles and Chemical Engineering (MaTCh), Ghent University; 2: Centre for X-ray Tomography, Ghent University; 3: European Synchrotron Radiation Facility, 71 Avenue des Martyrs, 38000, Grenoble, France; 4: Siemens Industry Software NV; 5: FlandersMake@UGent-MIRO

A SAW-based Platform of AlN Layer on Si for Accelerated Stress Testing of Micro and Nano Structures

Arash Mohammadi¹, Chris Stöckel², Sven Voigt², David Kriebel¹, George Boldeiu³, Dan Vasilache³, Alexandru Muller³, Jan Mehner¹, Bernhard Wunderle¹

1: University of Chemnitz, Germany; 2: Fraunhofer Institute for Electronic Nano Systems ENAS, Germany; 3: National Institute for Research and Development in Microtechnologies (IMT), Romania

Design, Structural Characterization, and Superconducting Behavior of Niobium Thin-Film Microstructures for Ion-Trap Quantum Computers: Toward J–B–T Critical Surface Mapping for Cryogenic 3D SiP Integration

Awais Qadir^1,2, Uwe Zschenderlein¹, Nathanael Jöhrmann^1,2, Peter Meszmer^1,2, Carlos Rincon-Ruiz^1,2, Vogel Klaus³, Christian Hofmann³, Sounak Nandi³, Maham Ayaz^1,2, Marcel Melzer³, Sven Zimmermann³, Bernhard Wunderle^1,2,3,4

1: Chemnitz University of Technology, Germany; 2: TU Chemnitz, Germany; 3: Fraunhofer Institute for Electronic Nano Systems – ENAS, Germany; 4: Centre for Microtechnologies (ZfM) Chemnitz, Germany

Failure Analysis of Electronic Packaging using Eddy Current Thermography

Yanan Wu^1,2, Daniel May², Mohamad Abo Ras¹, Bernhard Wunderle^2,3

1: Berliner Nanotest and Design GmbH, Germany; 2: Chemnitz University of Technology, Germany; 3: Fraunhofer ENAS, Germany

Development of a Method for Parylene-Based Interface Toughness Characterization under Fatigue Loads for Electronic Packaging Applications

Carlos Rincon-Ruiz¹, Martin Kuehn², Uwe Zschenderlein¹, Imants Cirulis², Franz Selbmann², Patrick Tuerk¹, Frank Roscher², Bernhard Wunderle^1,2

1: TU Chemnitz, Germany; 2: Fraunhofer ENAS, Germany

Verification of the Mold Material Model Through Simulation Studies At The Product Level

Akshay Vivek Panchwagh¹, Przemyslaw Jakub Gromala², Sven Rzepka³

1: Robert Bosch GmbH, Germany; 2: Robert Bosch Kft., Hungary; 3: Fraunhofer ENAS, Germany

Impact of Thermal Gap Filler vs. Thermal Gap Pad Materials on the Solder Joint Lifetime of eWLB Packages in Topside Cooling Setups

Martin Niessner, Peter Lutz, Walter Hartner, Harald Preu, Juliane Junesch, Holger Mai

Infineon Technologies AG, Germany

Effect of PFAS Removal on the Underfill and TIM Interface Properties and Performance

Pradeep Lall, Padmanava Choudhury, Aathi Pandurangan

Auburn University, United States of America

A Simple and Thermo-mechanically Robust Multiaxial Force Sensing Scheme Based on Polymer-MEMS and AI-based Signal Post-processing for Smart Skin Technologies

Bernhard Wunderle^1,2,3,4, Peter Meszmer^1,4, Daniel May¹, Uwe Zschenderlein¹

1: TU Chemnitz, Germany; 2: Fraunhofer ENAS, Germany; 3: Centre for micro- and nanotechnologies (ZfM) at TU Chemnitz, Germany; 4: Centre for Materials, Architectures and Integration of Nanomembranes (MAIN), Germany

Modeling of nonlinear ferroelectric microactuator with Fourier Neural Operator

Binh Nguyen, Piotr Czarnecki, Guilherme Brondani Torri, Véronique Rochus

imec, Belgium

AVA-Based Surrogate Modeling of Localized Strain in Microvia

Qiulin Yu^1,2,3, Thomas Krivec¹, Jan Albrecht⁴, Tobias Horn⁴, Karl Fendt¹, Dieter P. Gruber^2,3

1: Austria Technologie & Systemtechnik AG; 2: Montanuniversitaet Leoben; 3: Polymer Competence Center Leoben GmbH; 4: Fraunhofer Institute for Electronic Nano Systems (ENAS)

A Multi-agent Digital Twin Framework for Health Monitoring of SiC MOSFETs in Power Converters

Alireza Mehrabi, Zihan Zhang, Filip Simjanoski, Rene H. Poelma, Willem D. van Driel, GuoQi Zhang

Delft University of Technology, Netherlands, The

AI Surrogate Model for PBGA Solder Fatigue Assessment Using Progressive Transfer Learning with Multi-fidelity Data

Cadmus Yuan, Jian-Cheng Hong, Pin-Sian Li

Feng Chia University, Taiwan

The Prediction of Solder Joint Geometries through the Characterization of the Micro-wetting Behavior on Component Metallizations – Experiments and Simulations

Cham Thi Trinh, Erik Wiss, Jilin He, Steffen Wiese

Universität des Saarlandes, Germany

Thermo-elastic-viscoplastic Damage Model for Sn-Ag-Cu Solder

Torsten Hauck¹, Aleksandr Morozov¹, Wolfgang H. Müller¹, Golam Rakib Mazumder², Jeffrey C. Suhling²

1: TU Berlin, Germany; 2: Auburn University, USA

Numerical analysis of solder-joint stress during the process of encapsulating an entire PCBA

Harald Ziegelwanger¹, Mario Gschwandl², Thomas Hollinger³, Venu Prakash Kasinikota³, Peter Fuchs³, Margit Lang³

1: Elastic-Simulations GmbH, Germany; 2: Ottronic Regeltechnik Gesellschaft m.b.H., Germany; 3: Polymer Competence Center Leoben GmbH, Germany

Modified Infrared Thermal Characterization Methodology coupled with Modelling for GaN RF Power Amplifier Transistors in Compact SMD Packages

Amir Mirza Gheytaghi, Fan Li, Albert van Zuijlen

Ampleon B.V.

Evaluation of the Young’s Modulus of Silicon Carbide from Specific Heat Measurements

Vincenzo Vinciguerra, Giuseppe Luigi Malgioglio, Marco Renna

STMicroelectronics, Italy

A New Packaging and Flow Boiling Cooling Concept for HPC Applications Enabling High Thermal and Thermo-mechanical Performance on Organic Substrates

Ralph Schacht¹, Mathias Koch², Tobias Gruen³, Joerg Arnold⁴, Ben Majed¹, Karl-Friedrich Becker², Mohamad Abo Ras³, Bernhard Wunderle⁴

1: BTU Cottbus, Germany; 2: Fraunhofer IZM , Germany; 3: Berliner Nanotest and Design GmbH, Germany; 4: TU Chemnitz, Germany

Measurement of SiC Chip CTE using Digital Image Correlation

Dong-Hyeon Kim, Sung-Min Park, Sung-Uk Zhang

Dong-Eui University, South Korea

An Advanced Mission Profile-based Lifetime Assessment in Power Electronics Assembly Using Physics-informed Surrogate Modeling

Abantika Bose, Dawei Zhao, Jürgen Leib, Maximilian Hofmann

Fraunhofer IISB, Germany

Compact Thermal RC Model of a Multi Die Power Stage with In-Package Sensing for Remaining Useful Life Prediction

Ole J. Bergmann¹, Henk van Zeijl¹, Willem van Driel¹, Guoqi Zhang¹, René H. Poelma^1,2

1: Delft University of Technology, The Netherlands; 2: Nexperia BV, The Netherlands

Using Fragility Surfaces for Remaining Useful Lifetime Estimations

Roland Niemeier¹, Günther Hasna¹, Alexander Kabakchiev², Dharshan Barkur², Przemyslaw Jakub Gromala³

1: Ansys Germany GmbH, Germany; 2: Robert Bosch GmbH, Germany; 3: Bosch Hungary Kft, Hungary

Efficient Reliability Assessment of Solder Joints in Automotive Applications Using HYPER-SUB

Mike Feuchter¹, Hanna Baumgartl¹, Martin Hanke¹, Bernhard Wunderle³, Sven Rzepka²

1: CADFEM Germany GmbH, Germany; 2: Fraunhofer Institute for Electronic Nano Systems ENAS; 3: Technische Universität Chemnitz

The Oxidation Effects of Copper Layer on AMB Substrate in Power Modules: A Multiscale Simulation Study

Ping Sun^1,2, Xiao Hu^1,2, Jiajie Fan¹, Emiel de Bruin², Willem van Driel¹, Guoqi Zhang¹

1: Delft University of Technology, The Netherlands; 2: Boschman Technologies B.V.,The Netherlands

Study on Finite Element Analysis Modeling of Crack Propagation in Hybrid Bonding Structures Based on the Cohesive Zone Method

Yudong Yang^1,2, Xuanyu Ding², Ze Zhang¹, Haoyang Sun³, Fengze Hou¹, Rui Ma¹, Yu Zhang¹, Hongchao Zhang¹, Chi Zhang^2,4, Qiushi Kang¹, Fei Ding¹, Haibo Yang¹, Renxi Jin¹, Feng Ji³, Qidong Wang¹, Wei Wang^2,4,5, Liqiang Cao¹

1: Chinese Academy of Sciences, China; 2: Peking University. China; 3: Beijing Institute of Remote Sensing Equipment, China; 4: National Key Lab of Micro/Nano Fabrication Technology, China; 5: Beijing Advanced Innovation Center for Integrated Circuits, China

Constitutive Model Identification for Aluminium Wires and Potting Resin used in IGBT Power Modules

Clément Chedozeau^1,2, Merouane Ouhab², Natasha Vermaak³, François Hild¹

1: Université Paris-Saclay, France; 2: Mitsubishi Electric R&D Centre Europe, France; 3: Lehigh University, USA

A Defect-Informed Phase-Field Model for Gate Oxide Breakdown in SiC MOS Structures

Jinglin Li, Aditya Shekhar, Yaqian Zhang, Willem. D vanDriel, Guoqi Zhang

TU Delft, The Netherlands

Predicting Redistribution Layer (RDL) Interfacial Strength and Delamination in Fan-out Wafer Level Packaging

Rohit Gandhi¹, Nikhitha Poornabodha¹, Pallavi Jithendrriyan¹, Pranav Srinivasan², Aniket Bharamgonda², Christopher Bailey¹, Abhijit Dasgupta²

1: Arizona State University - Tempe, USA; 2: University of Maryland, USA

Application of Bayesian Optimization to Wire Reliability Prediction in LED Packaging

Muyuan Li, Lavinia Israel, Lukas Geisler

ams-OSRAM International GmbH, Germany

Reliability Assessment of Advanced Fan-Out Packages Under Drop Impact Conditions

Meng-Kai Shih¹, Bo-Rui Ding², Chung-Chih Lin²

1: National Sun Yat-sen University, Taiwan; 2: National Formosa University, Taiwan

Numerical Characterization of Acoustic Fields within Cylindrical Air-coupled Sono-photonic Waveguides

Sonja Wismath¹, Sören Soennecken¹, Hanna Malang², Jan Helge Dörsam¹, Yannick Schrödel^2,3,4, Christoph Haugwitz¹, Elena Wiemer¹, Nils Demuth¹, Stephan Schaumann¹, Christoph M. Heyl^2,3,4, Mario Kupnik¹

1: Technische Universität Darmstadt, Germany; 2: Deutsches Elektronen-Synchrotron DESY, Germany; 3: Helmholtz Institute Jena, Germany; 4: GSI Helmholtzzentrum für Schwerionenforschung GmbH, Germany

Piezoelectric Contour Mode Resonators for Fast & Power-efficient On-chip Acousto-optic Modulation

Ferdinand Schiller^1,2, Sofia Cano Castro^3,4, Christian Görner Tenorio^1,2, Christian Bretthauer¹, Gabriele Schrag²

1: Infineon Technologies AG, Germany; 2: Technical University of Munich, Germany; 3: Infineon Technologies Austria AG, Austria; 4: ETH Zurich, Switzerland

In Situ Evaluation of an Antifouling Vibrating System for Marine Sensors

Fabrice Casset¹, Gallien Delattre¹, Sebastian Dinescu², Raphaelle Barry-Martinet², Kada Boukerma³, Catherine Dreanno³, Christine Bressy², Hugues Brisset², Jean-francois Briand², Mikael Colin¹

1: CEA-Leti, France; 2: MAPIEM, University of Toulon, France; 3: IFREMER, France