Material Property Prediction of Bi-doped SnAgCu Solders under High Strain Rates of Mechanical Shock and Vibration

Pradeep Lall, Vishal Mehta, Jeff Suhling, David Locker

Auburn University, United States of America

Thermomechanical and Microstructural Mechanisms Governing Copper Degradation under High Strain Rate Thermo-mechanical Fatigue

Alexander Huber^1,2, Manuel Petersmann², Thomas Antretter¹

1: Montanuniversität Leoben, Austria; 2: Kompetenzzentrum Automobil- und Industrieelektronik GmbH, Austria

Thermal Shock Simulations of a PCB with Embedded Components and Microvia Based Interconnection: Meso-scale Modeling of the Woven Composite

Mickaël LEICHT^1,2, Baptiste ARATI², Gautier GIRARD¹, Alexandre MARIE³, Aymeric LAGADEC⁴, Gilles SEGOND², Bernardo COUGO², Olivier PERROTIN⁵, Jean-Pierre FRADIN³, Fabio COCCETTI², Sébastien MERCIER¹

1: Université de Lorraine, France.; 2: IRT Saint Exupéry, France.; 3: Icam School of Engineering, France.; 4: ELVIA Electronics, France.; 5: Alter Technology France,France.

Secondary Effects Causing Early Solder Fatigue Failure of QFN Components Subjected to Test- and Field Cycling

Rainer Dudek¹, Peter Fruehauf², Matthias Prinz¹, Lisa Kreher¹, Susana Richter-Trummer¹, Lutz Scheiter³, Jan Albrecht¹, Sven Rzepka¹

1: Fraunhofer ENAS, Chemnitz, Germany; 2: Siemens AG, Technology, Berlin, Germany; 3: CWM GmbH, Chemnitz, Germany

High-performance and Scalable DG-SEM Modeling of Large PMUT Arrays for Biomedical Imaging

Michelangelo Gabriele Garroni¹, Omer Mohamed Osman Abdalla², Edoardo Moretti², Alberto Corigliano², Attilio Frangi², Domenico Giusti³, Alessandro Stuart Savoia⁴, Paola Antonietti¹, Nicola Parolini¹, Ilario Mazzieri¹

1: MOX, Dipartimento di Matematica, Politecnico di Milano, Italy.; 2: Department of Civil and Environmental Engineering, Politecnico di Milano, Italy.; 3: STMicroelectronics Agrate, Italy.; 4: Università degli Studi Roma Tre, Italy.

Finite Element Modeling and Experimental Validation of Dual-mode Ultrasonic Haptics on OLED Screens

Theotime Goubault¹, Fabrice Casset¹, Ayoub Ben Dhiab², Gwenael Le Rhun¹, Munique Kazar Mendes¹, David Alincant¹, Delphine Rolland¹, Daniel Mermin¹, Rémi Franiatte¹, Mikael Colin¹

1: CEA LETI, France; 2: CEA LIST, France

Analytical System-level Model for Optimization of pMUT Based Acoustic Power Delivery for Implants

Oguz Kaan Erden^1,2, Bogdan Vysotskyi¹, Chris Van Hoof^1,2, Xavier Rottenberg¹

1: Imec, Leuven, Belgium; 2: KU Leuven, Belgium

Simulating pMUT Array Characteristics for Sonomyographic Hand Gesture Recognition

Chinmay Pendse^1,3, Antonios Lykourinas², Milind Pandit³, Chris Van Hoof^1,3, Xavier Rottenberg³, Veronique Rochus³

1: KU Leuven, Belgium; 2: University of Patras, Greece; 3: imec, Belgium

Holistic Warpage Evaluation Methodology Across Assembly Flow with Focus on Final Package Integrity in advanced packages like 2.3D-R & 2.3D-BT

Mohan Prashanth Javaregowda¹, Js Paek², Han-wen Lin², Hans-Gerd Jetten¹, Thomas Huber¹

1: Intel Corporation, Germany; 2: Intel Corporation,Taiwan

Thermal-mechanical Coupling Simulation of Chiplet 2.5D Packaging Based on Chiplet Distribution and Full Copper Interconnection

Shizhen Li¹, ChenShan Gao¹, Xu Liu², Huaiyu Ye^1,2, Guoqi Zhang²

1: Southern University of Science and Technology. China; 2: Delft University of Technology, The Netherlands

Thermo-Mechanical Warpage Prediction and Validation of Large Chiplet Packages

Klara Volckaert, Riet Labie, Kurt Herremans, Kris Vanstreels, Mario Gonzalez, Bart Vandevelde

Imec, Belgium

Numerical Simulation of a Neuron-Electrode Interface in Python and Ansys

Patrick Kohaus¹, Arwed Schütz¹, Dennis Hohlfeld², Tamara Bechtold^1,2

1: Jade University of Applied Sciences, Germany; 2: University of Rostock, Germany

3D Parametric Simulations of Mass Transport and Mechanical Properties of a Microfluidic Barrier-on-Chip Device

Sjoerd D.M de Jong, Pratik V. Tawade, Massimo Mastrangeli, Willem D. van Driel

Delft University of Technology, The Netherlands

Multiphysics Topology Optimization for MEMS

Yongbo Deng, Jan G. Korvink

Institute of Microstructure Technology (IMT), Karlsruhe Institute of Technology (KIT), Germany

Layout-oriented Design of MEMS Acceleration Sensor and Evaluation of Packaging Effects

Alexey Shaporin¹, Annett Krusch², Sebastian Weidlich², Petra Kuenzel¹, Christian Behl¹, Roman Forke¹, Karla Hiller², Susann Hahn², Danny Reuter²

1: FhI ENAS, Germany; 2: TU Chemnitz, Germany

Design Optimization of a Multi-resonant Folded Beam Piezoelectric Energy Harvester Using an Efficient Two-phase Topology Optimization

Siyang Hu^1,2, Dennis Hohlfeld¹, Tamara Bechtold^2,1

1: University of Rostock, Germany; 2: Jade University of Applied Sciences, Germany

Physics-based State-space Model for Self-sensing in Piezoelectric MEMS Microphones

Nikita Ovsiannikov¹, Til Friebe¹, Christian Bretthauer², Gabriele Schrag¹

1: Technical University of Munich, Germany; 2: Infineon Technologies AG, Germany

Lab-on-Chip Acoustic Detection Platform: Design, Fabrication and Performance Evaluation

Makrem BEN ABDELKADER^1,2,3, Hatem DAHMANI¹, Reda AITAYAD¹, Samuel DUPONT¹, Chérif DRIDI², Julien CARLIER¹

1: Univ. Polytechnique Hauts-de-France, France; 2: NANOMISENE Laboratory, Tunisia; 3: University of Sousse, Tunisia

An ANN-based Digital Twin for PCB Temperature Monitoring: Development and Validation

Jakub Korta, Krzysztof Hołoń, Grzegorz Wyszyński

Aptiv Services Poland

A Neural Network-Based Performance Assessment Approach for Heat-Dissipating Microchannels in Packages

Bo Sun, Zhenhao Tang, Kunzhao Li, Chunbing Guo

Guangdong University of Technology, China

Physics-inspired AI Models Trained on Abstract Synthetic Systems for Thermal Propagation

Helios Sanchis Alepuz, Monika Stipsitz

Silicon Austria Labs, Austria

Electro-thermal Co-simulation of SiC MOSFET Double-pulse Tests Using a Peak-power-threshold (PPT) Method for Junction-temperature Estimation

Filip Simjanoski, Nils Lurie, Mladen Gagic, Aditya Shekhar, Kouchi Zhang, Willem van Driel

TU Delft, The Netherlands