Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Daily Overview |
| 9:00am - 12:00pm |
PDC 1 Location: Hazel »Current and Future Challenges and Solutions in AI & HPC System and Thermal Management« Course Instructor: Dr. Gamal Refai-Ahmed, AMD, USA |
PDC 2 Location: Pine »Advanced Packaging for Chiplets and Heterogeneous Integration« Course Instructor: John H Lau, Unimicron Technology Corporation, USA |
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| 12:00pm - 2:00pm |
Lunch Room: ZAZEN Club & Lounge |
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| 2:00pm - 5:00pm |
PDC 3 Location: Hazel »Warpage Modelling and Validation in Fan-out Wafer/Panel Level Packaging and Assembly Processes« Course Instructors: Olaf Wittler & Saskia Huber, Fraunhofer IZM, Germany |
PDC 4 Location: Pine »Advanced Packaging for MEMS and Sensors« Course Instructor: Horst Theuss, Infineon Technologies AG, Germany |
PDC 5 Location: Alder+Poplar »Practical Model Order Reduction and Linear Superelements in Ansys Mechanical for Multiphysics Applications« Course Instructors: Mike Feuchter & Max Keller, CADFEM, Germany |