Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Session Overview |
| Date: Monday, 07/Apr/2025 | ||
| 8:45am - 8:55am |
Opening: Opening by Michiel v Soestbergen (NXP) |
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| 8:55am - 10:25am |
IK: Industrial Keynotes »Forward-Looking Roadmap: Enabling Heterogeneous Integration in the Next Decade« Gamal Refai-Ahmed, Ph.D., PEng, FIEEE, LFASME, FEIC AMD, US »Multi-Physics Simulations: Accelerating Microelectronics Packaging for Artificial Intelligence Applications« Mudasir Ahmad Google, US |
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| 10:25am - 10:50am |
CB1: Coffee Break |
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| 10:50am - 12:20pm |
S1: S1: Technical Keynotes »Failure Analysis Beyond Moore’s Law: Challenges and a Roadmap Forward« Lesly Endrinal Google, US »Connected Outdoor Lighting: from Big Data to Reliability Predictions« Piet Watte & Ger van Hees Signyfy, the Netherlands Presentation of the EuroSimE Achievement Award Laudation by Gabriele Schrag and Véronique Rochus, Chairs of the Multi-physics Track |
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| 12:20pm - 1:20pm |
L1: Lunch |
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| 1:20pm - 2:40pm |
S2: Polymer Characterisation Mechanical Parameter Identification for Soft Potting Materials used in Frame-based Power Modules 1: Infineon Technologies AG, Germany; 2: Fraunhofer Institute for Manufacturing Technology and Advanced Materials IFAM, Germany 1:40pm - 2:00pm Interface Fracture Characterization and Prediction of Competing Risk-of-Failure in FCBGAs under Sustained Humidity and Temperature Exposure Auburn University, United States of America 2:00pm - 2:20pm Reverse Engineering of Thermomechanical Properties for Materials in Microelectronic Packaging 1: Fraunhofer IZM, Germany; 2: Technical University Berlin, Germany 2:20pm - 2:40pm Modelling of Nonlinear, Viscoelastic Material Behaviour for Highly Deformed Polymers towards Accurate Virtual Design in Advanced Electronic Development Fraunhofer IKTS, Germany |
S3: Thermal Modelling and Experimental Characterisation Towards Health Monitoring of SiC MOSFETs by Precise Junction Temperature Profiling 1: TU Delft, Netherlands; 2: Nexperia, Netherlands; 3: Signify, Netherlands 1:40pm - 2:00pm Inductor Health Monitoring in PMIC under Adaptive Phase Shifting Operation for Minimization of Power and Thermal Loss Solution Development / Samsung semiconductor, Korea, Republic of (South Korea) 2:00pm - 2:20pm The Use of Graphene as a Thermal Interface Material in Electronics Packaging of Gallium Nitride High Electron Mobility Transistors 1: Rise Research Institutes of Sweden, Sweden; 2: Chalmers University of Technology 2:20pm - 2:40pm Realization of Self-sintering by using Micro-heater Arrays with Inputting Current Pulse 1: Department of Microelectronics, Delft University of Technology, Delft, The Netherlands; 2: Chip Integration Technology Center, Nijmegen, The Netherlands |
| 2:40pm - 2:50pm |
Break |
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| 2:50pm - 3:50pm |
S4: Solder Interconnect Fatigue Analyses of Materials Behaviour and Solder Fatigue Test and Prediction Results for Long-Term Thermal Cycling 1: Fraunhofer ENAS, Micro Materials Center, Chemnitz, Germany; 2: Siemens AG, Foundational Technologies, Berlin, Germany; 3: Siemens AG, Digital Industries, Amberg, Germany 3:10pm - 3:30pm Microstructurally Induced Evolution of Inelastic Work Density in SAC Solder Joints During Thermal Cycling 1: University of Maryland, United States of America; 2: NXP Semiconductors 3:30pm - 3:50pm Damage Life-Prediction Model for Doped Lead-Free SnAgCu Solder Electronic Assemblies Under High Strain Rate Vibration after Prolonged Storage Auburn University, United States of America |
S5: Reduced Order Modeling for Multi-Physics Physics-Based Compact Modeling of an Ultrasonic Modulation MEMS Speaker Concept 1: Infineon Technologies AG, Neubiberg, Germany; 2: Professorship of Microsensors and Actuators, Technical University of Munich, Germany 3:10pm - 3:30pm Reduced Shell Model for the Simulation of Surface-Acoustic Waves in Piezoelectric Micromachined Ultrasound Transducer Arrays 1: Technical University Munich, Germany; 2: Fraunhofer Institute for Electronic Microsystems and Solid State Technologies, Munich 3:30pm - 3:50pm Efficient Modelling and Simulation of Large PMUT Arrays for Biomedical Applications 1: Department of Civil and Environmental Engineering, Politecnico di Milano, 20133 Milan, Italy; 2: MOX, Dipartimento di Matematica, Politecnico di Milano, Piazza Leonardo da Vinci, 20133 Milano, Italy.; 3: STMicroelectronics Agrate, Via Camillo Olivetti 2, Agrate Brianza, 20864, Italy.; 4: Dipartimento di Ingegneria Industriale, Elettronica e Meccanica, Università degli Studi Roma Tre, 00146 Roma, Italy |
| 3:50pm - 4:15pm |
CB2: Coffee Break |
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| 4:15pm - 5:35pm |
S6: Warpage Simulation and Experiments Warpage Prediction of mmWave Antenna-in-Package Modules During Solder Reflow 1: NXP Semiconductors, the Netherlands; 2: 3DiS Technologies S.A.S , France; 3: Ericsson AB, Sweden 4:35pm - 4:55pm Temperature-dependent Material Characterization of Back-end-of-line Copper with Nanoindentation for FEM-based Wafer Warpage Prediction. 1: GlobalFoundries Dresden Module One LLC & Co. KG, Germany; 2: Technische Universität Dresden, Institute of Electronic Packaging Technology, Germany 4:55pm - 5:15pm Finite Element Analysis of the Asymmetric Warpage Induced by the Oxidation Process in Trench Insulated Gate Bipolar Transistor (Trench IGBT) 12” Si Patterned Wafers 1: Quality, Manufacturing and Technology (QMT),Catania, Italy; 2: Chimica, Materiali e Ingegneria Chimica (CMIC), Milano, Italy; 3: Quality, Manufacturing and Technology (QMT),Agrate Brianza, Italy; 4: Analog, Power & Discrete, MEMS and Sensors Product Group (APMS), STMicroelectronics Tours, France 5:15pm - 5:35pm Simulation Informed Method to Compare Experimental and Numerical Results in Plastic Packages STMicroelectronics, Italy |
S7: Reliablity of Power Electronics Physics-of-Failure based Lifetime Prediction for Power Electronics under Mission Profile Load Conditions 1: Fraunhofer ENAS, Technologie-Campu 3, 09126 Chemnitz, Germany; 2: Technische Universität Chemnitz, Reichenhainer Straße 70, 09126 Chemnitz, Germany; 3: Mercedes-Benz AG, Hanns Klemm Str. 45, Boeblingen, Germany 4:35pm - 4:55pm Sensitivity Analysis of Simulation-based Lifetime Extrapolation in the Low Temperature Swing Regime for Power Modules Stressed in Power Cycling Tests Infineon Technologies AG, Germany 4:55pm - 5:15pm Application of a Drucker-Prager Approach for Reliability Modelling of Inorganic Encapsulation Materials used for Power Electronic Applications Fraunhofer Institute for Microstructure of Materials and Systems (IMWS), Germany 5:15pm - 5:35pm Enhancing Wire Simulation Accuracy through X-ray Imaging and Deformation Analysis 1: ams-OSRAM International GmbH, Germany; 2: ams-OSRAM International GmbH, Malaysia |
| 6:15pm - 7:00pm |
Boat Transfer to Conference Dinner |
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| 7:00pm - 10:00pm |
Conference Dinner at Leeuwenbergh |
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| Date: Tuesday, 08/Apr/2025 | ||
| 8:30am - 10:30am |
PS: Interactive Poster Session Integration of Moldflow, Abaqus and Python to Analyze Process- related Residual Stresses in Medical PCB Encapsulations Polymer Competence Center Leoben GmbH, Austria Examination and simulation of a high-cycle fatigue tester for accelerated stress testing with simplified cantilever specimens for fracture-mechanical interface characterization 1: TU Chemnitz, Germany; 2: Fraunhofer ENAS Thermomechanical Reliability of Bond Wires in Power Modules Subjected to Power Cycling STMicroelectronics, France Thermal Cyclic Fatigue Reliability of Printed Hybrid Electronics (PHE) 1: University of Maryland, College Park, MD, USA; 2: Laboratory for Physical Sciences, College Park, MD, USA Finite Element Analysis of Warpage Hysteresis Loop Evolution and Bifurcation in Thinned 4H-SiC Cu_ECD Metalized Wafers Quality, Manufacturing and Technology (QMT) – Power & Discrete Technologies R&D Department Digital Twin-Assisted Optimal Sensor Placement for Real-Time Monitoring of Probe Cards in EWS Applications 1: Politecnico di Milano, Italy; 2: Technoprobe, Italy Residual Stresses Extraction from Initial Deformation of Multi-layered Micro-cantilever imec, Belgium Modelling of crack propagation in semiconductor package materials by Digital Image Correlation & Finite Element Methods 1: Infineon Technologies AG, Am Campeon 1-15, 85579 Neubiberg, Germany; 2: Technical University of Chemnitz, Faculty of Electrical Engineering and IT, Reichenhainer Str. 70, 09126 Chemnitz, Germany Towards a Statistically Validated Metrology Procedure for Assessing Position Accuracy of Edge-Emitting Lasers to Photonic Integrated Circuits 1: ams OSRAM Group, Austria; 2: Graz University of Technology / Institute of Electrical Measurement and Sensor Systems Numerical Optimization of the Interfacial Crack Tip Position in Delaminated Bi-Material Beams Evaluated with the Advanced Mixed-Mode Bending Fracture Test 1: Berliner Nanotest und Design GmbH, Germany; 2: Dept. Materials & Reliability of Microsystems, Chemnitz University of Technology, Germany Advancing Vertical GaN Technology: A Comparative Study of GaN Layers on Foreign and Native Substrates 1: Materials Center Leoben Forschung GmbH, Austria; 2: Ferdinand-Braun-Institut gGmbH, Berlin, Germany Determination of Biaxial Bending Strength of Thin Silicon Die in the Ring-on-Ring Test Chang Gung University, Taiwan Study on the Applicability of Multi-Point Constraints for 3D WLP Finite Element Model National Tsing Hua University, Taiwan Modeling and Optimizing Wafer Warpage in FOPoP Using FEA and RSM National Sun Yat-sen University, Taiwan Numerical Analysis of the Effect of Coplanarity of Cu Bumps on Flip-Chip Bonding for Chip-on-Flex C2N-UPSACLAY, France Integrating Cluster Analysis and Artificial Neural Networks to Predict Warpage in Fan-Out Panel-Level Packaging 1: National Tsing Hua University, Taiwan; 2: Feng Chia University, Taiwan Acoustic Waveguide-Based Thermal Management for Hotspots in Mobile Device Camera Sensors Indian Institute of Information Technology Design and Manufacturing, India Verification of Material Models of an Epoxy Mold Compound used in Power Module 1: Robert Bosch GmbH; 2: Fraunhofer ENAS; 3: Technische Universität Chemnitz A Study on the Board-level Thermomechanical Reliability of Flip-Chip Chip Scale Package (FCCSP) 1: Smart Manufacturing Thrust of the Hong Kong University of Science and Technology (Guangzhou), China; 2: College of Future Technology of the Hong Kong University of Science and Technology (Guangzhou), China; 3: Guangzhou HKUST Fok Ying Tung Research Institute, China; 4: Guangzhou OED Technologies Inc., China Finite Element Analysis of the Mechanical Influence of a Frictionless Contact in a Simulated Ball-on-Ring System STMicroelectronics (Italy), Quality, Manufacturing and Technology (QMT) – Power & Discrete Technologies R&D Department Production of Nano-particles of Steel, Silver, Tin, Copper And NiCu alloy for Pb-free Die-attach materials in Power Electronics and Aerospace Applications DICIS Universidad de Guanajuato, Mexico Rheological Modeling and Experimental Validation of Receiving layer for Micro-LED Laser Mass Transfer 1: School of Material Science and Chemical Engineering, Harbin University of Science and Technology; 2: Heraeus Electronics Technology, Heraeus Materials Technology Shanghai Microvia Homogenised Behavior for the Mechanical Modelling of PCB with Embedded Components 1: Université de Lorraine – CNRS – Arts et Métiers ParisTech, Metz, France.; 2: Université Paris Est Créteil, Paris-Saclay Univ., Gif-Sur-Yvette, France 3D Fine Electrothermal Modelling of IGBT Power Device for Reliability Applications Mitsubishi Electric R&D Centre Europe, France Modeling of 6T-SRAM Transistor Failure and Faults Caused by Injected Noise in Neural Networks 1: GDUT, China, People's Republic of; 2: Xiaomi Corporation Analytical Calculation of Core Loss and Magnetic Flux Density in E-Cores 1: HELLA GmbH & Co. KGaA, Germany; 2: Chair of Energy Conversion, TU Dortmund, University, Dortmund, Germany Investigating Mechanical Characterization and Failure Analysis of 3D-Printed Multilayer Composite Beams by Experimental Testing and FE Modeling UAE University, United Arab Emirates Bond-wire Layout Optimization in Power-modules Through Simulation of Electro-thermo-mechanical Migration Flux under Power Cycling Hitachi Energy Ltd, Switzerland Magnetic Field Calculation with Generative AI 1: Chair of Energy Conversion, TU Dortmund, University, Dortmund, Germany; 2: Research Institute for Automotive Electronics (E-LAB), HELLA GmbH & Co. KGaA, Lippstadt, Germany Thermal Effects in Surface Acoustic Wave Devices Induced by Damping 1: IMT Bucharest, Romania; 2: Chemnitz University of Technology, Germany; 3: Fraunhofer ENAS, Chemnitz, Germany Optimizing Semantic Search in Industrial Knowledge Retrieval: A Novel SHAP-Based Attention Mask Modification Approach 1: Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU), Germany; 2: Siemens AG, Amberg, Germany; 3: Hochschule für Technik und Wirtschaft Berlin, Germany Power Loss and Efficiency Characterization of SiC-based Onboard Charger for Vehicle-to-Grid Application 1: Department of Aerospace and Systems Engineering, Feng Chia University, Taiwan; 2: Ph. D Program of Mechanical and Aeronautical Engineering, Feng Chia University, Taiwan; 3: Electronic and Optoelectronic System Research Laboratories, Industrial Technology Research Institute, Hsinchu, Taiwan Modeling of FE Parasitic inductance in BCD Power Switches 1: Technical University of Cluj-Napoca, Romania; 2: Infineon Technologies Romania Usage of Reactive Joining Methods on LTCC Substrates: Experiments and Simulation 1: Universität des Saarlandes, Germany; 2: Technische Universität Ilmenau, Germany Research on Rapid Thermal Design Tool for Chiplet Packaging 1: Institute of Microelectronics of the Chinese Academy of Sciences, China, People's Republic of; 2: Key Laboratory of Fabrication Technologies for Integrated Circuits, Chinese Academy of Sciences Thermal Analysis and Electromigration Behaviour in BGA Packages: Investigating the Impact of Electric Current and Resultant Joule Heating on Temperature Distribution 1: Imec, Leuven, Belgium; 2: Marvell, Burlington, VT, USA Die Attach Failure Modes Analysis and Thermal Warpage Simulation of MicroSD Card COB Packaging 1: Guangxi Normal University, China, People's Republic of; 2: Guangxi Kelin Semiconductor Co., Ltd Heat Sink Effects in Power Module Design: Multiphysics Simulation with Multiple Heat Sources 1: TU Delft, Netherlands; 2: Interuniversity Microelectronics Centre (IMEC), Belgium; 3: Polymer Competence Center Leoben Physics Informed Neural Network (PINN) to Predict Probe Card Key Performance Indicators and Physics of Degradation in Microelectronics 1: Politecnico di Milano, Italy; 2: Technoprobe, Cernusco Lombardone, Italy Modeling and Simulation of Directed Graph-based DEVS System 1: Shaanxi Deyuan Fugu Energy Co., Ltd. Sandaogou Coal Mine, Shannxi 719407, China; 2: Guoneng Digital Intelligence Technology Development Co., Ltd., Beijing 100144, China; 3: School of Cyber Science and Technology, Beihang University, Beijing 100191, China Fingerprints - Active Monitoring of Degradation and Remaining Useful Life in the Field RISE, Sweden Design of Single-Port Surface Acoustic Wave (SAW) Resonator on GaN Wafer as Stress Tester System for Micro and Nano Structures 1: TU Chemnitz (TU Chemnitz, 09107 Chemnitz), Germany; 2: National Institute for Research and Development in Microtechnologies (IMT), Bucharest, Romania; 3: Thales Research & Technology France, 1, avenue Augustin Fresnel, Campus de Polytechnique, F-91767 Palaiseau cedex, FRANCE; 4: Fraunhofer ENAS, Chemnitz, Germany Fatigue Delamination Study of Parylene Interface for a Substrate Material Application 1: University of Technology Chemnitz, Professorship Materials and Reliability of Microsystems; 2: Fraunhofer Institute for Electronic Nano Systems Substrate-Embedded SiC MOSFET Die Attach: A Molecular Dynamics Study on Physical Properties of Sintered Cu 1: State Key Laboratory of Fabrication Technologies for Integrated Circuits; 2: Institute of Microelectronics of the Chinese Academy of Sciences |
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| 10:30am - 10:55am |
CB3: Coffee Break |
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| 10:55am - 12:15pm |
S8: Solder Joint Reliability Enhanced Analytical Fatigue Model for SAC305 Solder Joints Subjected to Temperature Cycles Considering Geometrical Parameters Hooke Electronics, France 11:15am - 11:35am Elastic-plastic-creep Model with Damage for SAC Solder Alloys 1: Technical University of Berlin, Germany; 2: NXP Semiconductors, Munich, Germany; 3: Polytechnic University of Milan, Italy 11:35am - 11:55am Impact of Topside Cooling on the Solder Joint Lifetime of eWLB Packages 1: Infineon Technologies AG, Neubiberg, Germany; 2: Infineon Technologies AG, Regensburg, Germany; 3: MicroConsult Engineering GmbH, Germany 11:55am - 12:15pm Modelling the Impact of SAC305 Crystal Orientation on Thermo-Mechanical Damage of Solder Interconnects University of Greenwich , Park Row, Greenwich, London SE10 9LS, UK |
S9: Material and Process Models of Multi-Physics Systems A New Holistic Approach for Prosthesis Polymeric Aortic Valve Design 1: İstanbul Teknik Üniversitesi, Türkiye; 2: Beykent Üniversitesi, Türkiye 11:15am - 11:35am Numerical Analysis of Electrohydrodynamic Continuous Jet Printing for High-Precision Patterning of Wearable Sensor Elements 1: Heilbronn University of Applied Sciences, Germany; 2: Technical University of Munich, Germany; 3: Technical University of Applied Sciences Augsburg, Germany 11:35am - 11:55am Electromigration Simulation of Copper-Pillar Bump in 3D Integration EEMCS Faculty, Delft University of Technology, Delft, the Netherlands 11:55am - 12:15pm Numerical Simulation Aided Materials and Mirco-Structure Design for Pyramidal Tactile Sensors Institute of High Performance Computing, A*STAR, Singapore |
| 12:15pm - 1:15pm |
Lunch: Lunch |
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| 1:15pm - 2:35pm |
S10: Machine Learning & Reliability Design Optimization Study by AI Surrogate PBGA Reliability Model with Transfer Learning Technique Feng Chia University, Taiwan 1:35pm - 1:55pm Applying Ensemble Learning with Multiple Machine Learning Algorithms to Predict the Reliability of Wafer-Level Packaging National Tsing Hua University, Taiwan 1:55pm - 2:15pm New Examples of Fragility Surfaces Ansys Germany GmbH, Germany 2:15pm - 2:35pm Challenges and Future Directions in Federated Learning for RUL Estimation in Power Electronics: Insights from Recent Research RISE Research Institutes of Sweden, Sweden |
S11: Heterogeneous and Multi-Physics Systems Optimized Design and Analysis of Bonding Wire in Power Modules through Electric-Thermal-Structural and Electromagnetic Simulations Dong-eui University, Korea, Republic of (South Korea) 1:35pm - 1:55pm Numerical Design Study of a Multistable Electromagnetic Microactuator 1: Jade University of Applied Sciences, Germany; 2: Department of Microsystems Engineering, University of Freiburg, Freiburg, Germany 1:55pm - 2:15pm Optomechanical Inertial Sensors based on Ring Resonators: Design Approaches and Technology 1: FhG ENAS, Germany; 2: TU Chemnitz, Germany 2:15pm - 2:35pm Analysis of the Magnetic Fields Only Currents (MFCO) COMSOL interface for the simulation of parasitic inductances in chip-embedding power boards IMB-CNM(CSIC) |
| 2:35pm - 2:45pm |
Break |
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| 2:45pm - 4:05pm |
S12: Mechanical Stress Characterisation Concepts for Efficient Coupling of Thermal and Electrical Domains for Monitoring the Thermomechanical Degradation Behavior of Electronic Systems 1: Fraunhofer Institute for Reliability and Microintegration IZM, Germany; 2: Research Center of Microperipheric Technologies, Technische Universität Berlin 3:05pm - 3:25pm Modelling microstructure sensitive degradation of electroplated copper during short circuit power pulsing 1: Kompetenzzentrum für Automobil- und Industrieelektronik, Europastraße 8, A-9500 Villach, Austria; 2: Institute of Mechanics, Montanuniveristät Leoben, Franz-Josef-Straße 18, A-8700 Leoben, Austria 3:25pm - 3:45pm A Methodology for Identifying Capillary Underfill (CUF) Optimized Material Properties Henkel, United States of America 3:45pm - 4:05pm First-principles Calculating the Stress Response of E2(TO) Raman Phonon Deformation Potential in 4H-SiC under Mechanical Loadings 1: Shanghai Engineering Technology Research Center for SiC Power Device, Academy for Engineering & Technology, Fudan University, Shanghai, China; 2: College of Chemistry and Materials, Fudan University, Shanghai, China; 3: Research Institute of Fudan University in Ningbo, Ningbo, China; 4: Department of Mechanical Engineering, Lamar University, Beaumont, TX, USA; 5: EEMCS Faculty, Delft University of Technology, Delft, the Netherlands |
S13: Thermal Behavioral Modelling Reliability Studies of SiC MOSFET Modules After a Partial Breakdown Incident KTH/ELECTRIC POWER AND ENERGY SYSTEMS, Sweden 3:05pm - 3:25pm Balancing Accuracy and Data Reduction Using Record of Additional Data in Sequential Approximate Optimization Osaka University, Japan 3:25pm - 3:45pm Investigation of Methods for Expanding the Application of Integration Neural Network and Their Appropriate Structures Osaka University, Japan 3:45pm - 4:05pm Optimal Operating Voltage for Aluminum Capacitor with Different Electrolyte in SSDs Samsung Electronics, Korea, Republic of (South Korea) |
| 4:05pm - 4:30pm |
CB4: Coffee Break |
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| 4:30pm - 5:50pm |
S14: PCB and Substrate Reliability Determination of the Thermo-oxidative Ageing Depth and its Influence on Mechanical Properties in (Highly) Filled Polymers 1: Fraunhofer Institute for Reliability and Microintegration IZM, Germany; 2: Technische Universität Berlin, Germany 4:50pm - 5:10pm Reduced-Order Modelling for Efficient Chip-Package-Board Design 1: Jade University of Applied Sciences, Wilhelmshaven, Germany; 2: Cadfem GmbH, Munich, Germany; 3: Fraunhofer IZM, Berlin, Germany 5:10pm - 5:30pm Methodology for PTH Reliability in Printed Circuit Boards 1: imec, Belgium; 2: Siemens Industry Software nv, Strategy & Innovation, Leuven, Belgium; 3: Department of Computer Science, KU Leuven, Belgium; 4: Flanders Make@KU Leuven, Belgium 5:30pm - 5:50pm Single Microvia Analysis at Different Locations in the Printed Circuit Board to Understand its Placement Effect 1: Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, Austria; 2: Polymer Competence Center Leoben GmbH, Leoben, Austria; 3: Montanuniversität Leoben, Institute of Mechanics, Leoben, Austria |
S15: Sinter Materials for Power Electronics Length-scale Dependence of Viscoplastic Properties of Silver Sinter Revealed by Indentation Testing and Modeling University of Maryland, United States of America 4:50pm - 5:10pm Process Development of TLPS Joint and Their Mechanical, Thermal and Power Cycling Reliability Dynex Semiconductor Ltd, United Kingdom 5:10pm - 5:30pm Finite Element Analysis and Experimental Investigation of Die-attach Fillet Influence on the Reliability of Epoxy-Based Pressure-Less Sintered Silver Joints 1: Academy for Engineering & Technology, Fudan University, Shanghai 200433, China; 2: Heraeus Materials Technology Shanghai Ltd., Shanghai 201108, China; 3: Electronic Components, Technology, and Materials, Delft University of Technology, Delft 2628 CD, The Netherlands 5:30pm - 5:50pm Simulating the Co-Evolution of Porous Microstructures and Grain Growth in Sintered Ag Die Attach Layers 1: Delft University of Technology, Department of Microelectronics The Netherlands; 2: Ampleon B.V.; 3: Nexperia |
| 5:50pm - 6:20pm |
SpS: Sponsor & Exhibitor Session |
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| 6:30pm - 8:30pm |
Welcome Reception |
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| Date: Wednesday, 09/Apr/2025 | ||
| 8:30am - 9:50am |
S16: Mixed IEEE EPS Session »Co-Packaged Optics - Heterogeneous Integration of Photonic IC and Electronic IC« John H Lau Unimicron Technology Corporation, USA »Chips Act USA: Simulation and Reliability Challenges Being Addressed« Chris Bailey Arizona State University, USA »HIR Reliability Chapter – Status and Next Steps« Abhijit Dasgupta University of Maryland, USA »HIR Modeling and Simulation Chapter – Status and Next Steps« Xuejun Fan Lamar University, USA |
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| 9:50am - 10:15am |
CB5: Coffee Break |
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| 10:15am - 11:15am |
S17: IPCEI to Strengthen EU Microelectronics |
S18: Multi-Physics Modeling of High-frequency Devices Modeling and Simulation of CMUT and PMUT Ultrasound Transducers and Package Using a Multiphysics Approach 1: Infineon Technologies AG; 2: Infineon Technologies Dresden GmbH; 3: Quanscient Oy, Finland 10:35am - 10:55am Design of High isolation, Low Actuation Voltage Micro Cantilever RF-MEMS Switch for Enhanced Performance in mm-Wave Applications 1: School of Electrical Engineering, Iran University of Science and Technology, Iran; 2: Faculty of Engineering and Natural Sciences, Sabanci University, Türkiye; 3: Department of Electrical and Computer Engineering, University of Washington, USA 10:55am - 11:15am FEM-Assisted Analytical Investigation of Stress Gradient Effects on Focalization in AlN-Based PMUT Devices CEA, France |
| 11:15am - 11:25am |
Break |
Break |
| 11:25am - 12:25pm |
S19: Fracture Mechanics & Interface Strength Simulation-Driven Insights into Nanoindentation-Based Adhesion Strength Measurement of Wafer-to-Wafer Bonds 1: Department of Materials Engineering, KU Leuven, 3001 Leuven, Belgium; 2: IMEC, Kapeldreef 75, 3001 Leuven, Belgium 11:45am - 12:05pm Mechanical Strength Assessment of Ruthenium Nano-interconnects with Airgaps Using Wedge Indentation imec, Belgium 12:05pm - 12:25pm Numerical Analysis of Buckled Dielectric Thin Film Packaging Based on Surface Wrinkling Between Thin Film Cap and Polymer Ring C2N-UPSACLAY, France |
S20: Simulation and Characterization of MEMS Development of an Innovating Antifouling Vibrating System for Marine Sensors 1: Univ. Grenoble Alpes, CEA, Leti, France; 2: Laboratory MAPIEM, University of Toulon, France; 3: IFREMER Centre Bretagne, France 11:45am - 12:05pm Fabrication and Electromechanical Characterization of Piezoelectric Patches for OLED-Based Haptic Interfaces 1: Univ. Grenoble Alpes, CEA, Leti, F-38000 Grenoble, France; 2: Universite Paris-Saclay, CEA, List, F-91120, Palaiseau, France 12:05pm - 12:25pm Multiphysics Modeling of a Novel MEMS Accelerometer Design Based on Electromagnetic Induction 1: Faculty of Engineering and Natural Sciences, Sabanci University, Türkiye; 2: ICTEAM Institute, Université catholique de Louvain, Belgium; 3: Department of Electrical and Computer Engineering, University of Washington, USA; 4: Sabanci University (SUNUM) Nanotechnology Research and Application Center, Türkiye |
| 12:25pm - 1:25pm |
Lunch |
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| 1:25pm - 2:45pm |
S21: Solder Fatigue Simulations and Predictions Development and Evaluation of Global-Local Finite Element Models for Solder Joint Reliability under Combined Vibration and Thermal Loads Institute of Electronic Packaging Technology, Technische Universität Dresden, Dresden, Germany 1:45pm - 2:05pm Impact of IP Block Placement on Solder Joint Reliability in IC Packages 1: Delft University of Technology (TU Delft), Netherlands, The; 2: NXP Semiconductors, Netherlands 2:05pm - 2:25pm Mechanical Stresses induced by thermal Gradients during Reflow Soldering in Repair and Resuse of Multilayer Ceramic Capacitors (MLCC): Experiments and Simulation Universität des Saarlandes, Germany 2:25pm - 2:45pm Nonlinear Superelement for the Reliability Assessment of Visco-Plastic Solderballs 1: CADFEM Germany GmbH, Germany; 2: Fraunhofer Institute for Electronic Nano Systems ENAS |
S22: Advanced Modeling Techniques for Multi-Physics Systems Meshless Simulation with the Material Point Method: A Micropump for Nerve Injury Treatment 1: Department of Microelectronics, Delft University of Technology, Delft, Netherlands; 2: Signify, Eindhoven, Netherlands 1:45pm - 2:05pm TCAD Simulation of Radiation Effects on 180 nm Logic Inverters 1: Technische Universität Braunschweig, Braunschweig, Germany; 2: Leibniz Universität Hannover, Hannover, Germany; 3: Bundeswehr Research Institute for Protective Technologies and CBRN Protection (WIS), Munster, Germany 2:05pm - 2:25pm Multi-Scale Electrothermal Co-Simulation of GaN HEMTs at the Device and Packaging Levels 1: Smart Manufacturing Thrust of the Hong Kong University of Science and Technology (Guangzhou), China; 2: Microelectronics Thrust of the Hong Kong University of Science and Technology (Guangzhou), China; 3: College of Future Technology of the Hong Kong University of Science and Technology (Guangzhou), China 2:25pm - 2:45pm Modeling and Characterization of Concentric Coplanar Transformers on Printed Circuit Boards 1: Faculty of Engineering and Natural Sciences, Sabanci University, Türkiye; 2: ICTEAM Institute, Université catholique de Louvain, Belgium; 3: Department of Electrical and Computer Engineering, University of Washington, USA |
| 2:45pm - 2:55pm |
Closing: Awards and Closing |
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