Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Session Overview |
| Date: Sunday, 06/Apr/2025 | ||
| 9:00am - 12:00pm |
PDC 1 Location: Vecht 1 »Design-on-Simulation for Advanced Packaging: Warpage Management, Reliability and Life Prediction« Course Instructors: Dr. Xuejun Fan (Lamar University, USA) & Kuo-Ning Chiang (National Tsing Hua University, Taiwan) |
PDC 2 Location: Eem »Reliability Assessment of Glass Substrates and Interposers for Advanced Packaging« Course Instructor: Prof. Seungbae Park (State Univ of New York at Binghamton, USA) |
| 9:00am - 5:00pm |
PDC 3 Location: Singel »Efficient Thermo-Mehanical Simulations Using Compact Models (Hands-on course)« Course Instructors: Prof. Dr.-Ing. Tamara Bechtold (Jade University of Applied Sciences, DE) & Soenke Maeter (CADFEM GmbH, DE) |
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| 2:00pm - 5:00pm |
PDC 4 Location: Eem »Nano/Micro Metal Particle Sintering: Materials, Process, Characterization, and Reliability in Automotive and Power Electronics« Course Instructors: Dr. Jiajie Fan (Fudan University, China) & Dr. Xuejun Fan (Lamar University, USA) |
PDC 5 Location: Vecht 1 »Reliability and Failure of Micro-electronics Packaging Materials« Course Instructor: Dr. Amar Mavinkurve (NXP Semiconductors, The Netherlands) |
| Date: Monday, 07/Apr/2025 | ||
| 8:45am - 8:55am |
Opening: Opening by Michiel v Soestbergen (NXP) |
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| 8:55am - 10:25am |
IK: Industrial Keynotes Location: Vecht 1 + Vecht 3 Chair: Michiel van Soestbergen Chair: Willem Van Driel »Forward-Looking Roadmap: Enabling Heterogeneous Integration in the Next Decade« Gamal Refai-Ahmed, Ph.D., PEng, FIEEE, LFASME, FEIC AMD, US »Multi-Physics Simulations: Accelerating Microelectronics Packaging for Artificial Intelligence Applications« Mudasir Ahmad Google, US »SiC-MOSFET Multiobjective Optimization« Christos Pateropoulos Ansys, GR »Innovations in Early Detection and Resolution of Temperature-driven Reliability and Performance Issues« Bert Knops Hexagon, NL |
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| 10:25am - 10:50am |
CB1: Coffee Break |
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| 10:50am - 12:20pm |
S1: S1: Technical Keynotes Location: Vecht 1 + Vecht 3 Chair: Bart Vandevelde Chair: Véronique Rochus »Failure Analysis Beyond Moore’s Law: Challenges and a Roadmap Forward« Lesly Endrinal Google, US »Reliability Analysis of Connected Lighting Systems from Cloud Data« Piet Watte & Ger van Hees Signyfy, the Netherlands Presentation of the EuroSimE Achievement Award Laudation by Gabriele Schrag and Véronique Rochus, Chairs of the Multi-physics Track |
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| 12:20pm - 1:20pm |
L1: Lunch |
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| 1:20pm - 2:40pm |
S2: Polymer Characterisation Location: Vecht 1 + Vecht 3 Chair: Alberto Corigliano Chair: Marco Sperti |
S3: Thermal Modelling and Experimental Characterisation Location: Eem + Lek Chair: Olaf Wittler Chair: Ming-Yi Tsai |
| 2:40pm - 2:50pm |
Break |
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| 2:50pm - 3:50pm |
S4: Solder Interconnect Fatigue Location: Vecht 1 + Vecht 3 Chair: Steffen Wiese Chair: Meiying Su |
S5: Reduced Order Modeling for Multi-Physics Location: Eem + Lek Chair: Mike Feuchter Chair: Roland Niemeier |
| 3:50pm - 4:15pm |
CB2: Coffee Break |
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| 4:15pm - 5:35pm |
S6: Warpage Simulation and Experiments Location: Vecht 1 + Vecht 3 Chair: Vincenzo Vinciguerra Chair: Alexander Reichel |
S7: Reliablity of Power Electronics Location: Eem + Lek Chair: Fengze Hou Chair: Robert Schwerz |
| 6:15pm - 7:00pm |
Boat Transfer to Conference Dinner |
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| 7:00pm - 10:00pm |
Conference Dinner at Leeuwenbergh |
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| Date: Tuesday, 08/Apr/2025 | ||
| 8:30am - 10:30am |
PS: Interactive Poster Session Location: Foyer Chair: Sven Rzepka |
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| 10:30am - 10:55am |
CB3: Coffee Break |
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| 10:55am - 12:15pm |
S8: Solder Joint Reliability Location: Vecht 1 + Vecht 3 Chair: Rainer Dudek Chair: Abhijit Dasgupta |
S9: Material and Process Models of Multi-Physics Systems Location: Eem + Lek Chair: Romain Liechti Chair: Thomas Krivec |
| 12:15pm - 1:15pm |
Lunch: Lunch |
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| 1:15pm - 2:35pm |
S10: Machine Learning & Reliability Location: Vecht 1 + Vecht 3 Chair: Muhammad Musadiq Chair: Mike Röllig |
S11: Heterogeneous and Multi-Physics Systems Location: Eem + Lek Chair: Gabriele Schrag Chair: Leo Svenningsson |
| 2:35pm - 2:45pm |
Break |
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| 2:45pm - 4:05pm |
S12: Mechanical Stress Characterisation Location: Vecht 1 + Vecht 3 Chair: Marcus Schulz Chair: Jeffrey C. Suhling |
S13: Thermal Behavioral Modelling Location: Eem + Lek Chair: Cadmus Yuan Chair: Fabrice Casset |
| 4:05pm - 4:30pm |
CB4: Coffee Break |
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| 4:30pm - 5:50pm |
S14: PCB and Substrate Reliability Location: Vecht 1 + Vecht 3 Chair: Pan Liu Chair: Daniel Losbichler |
S15: Sinter Materials for Power Electronics Location: Eem + Lek Chair: Muyuan Li Chair: Tobias Daniel Horn |
| 5:50pm - 6:20pm |
SpS: Sponsor & Exhibitor Session Location: Vecht 1 + Vecht 3 Chair: Martin Niessner Presentations from: Quanscient, CADFEM, Henkel, STMicroelectronics, Infineon, TU Delft |
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| 6:30pm - 8:30pm |
Reception at the Venue |
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| Date: Wednesday, 09/Apr/2025 | ||
| 8:30am - 9:50am |
Special Session: Mixed IEEE EPS Session Location: Vecht 1 + Vecht 3 Chair: Przemyslaw Gromala »Co-Packaged Optics - Heterogeneous Integration of Photonic IC and Electronic IC« John H Lau Unimicron Technology Corporation, USA »Chips Act USA: Simulation and Reliability Challenges Being Addressed« Chris Bailey Arizona State University, USA »HIR Reliability Chapter – Status and Next Steps« Abhijit Dasgupta University of Maryland, USA »HIR Modeling and Simulation Chapter – Status and Next Steps« Xuejun Fan Lamar University, USA |
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| 9:50am - 10:15am |
CB5: Coffee Break |
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| 10:15am - 11:15am |
S16: IPCEI to Strengthen EU Microelectronics Location: Vecht 1 + Vecht 3 Chair: Vincenzo Vinciguerra Chair: Michiel van Soestbergen »Virtual Design of Experiment Methodology for Package Design Robustness« Roseann Duca STMicroelectronics, MT »Virtual Material Qualification for Substrate Materials« Thomas KrivecAT&S AG, AT »Innovative Semiconductors for Cutting-edge Functions and Systems« Przemyslaw Gromala Robert Bosch GmbH, DE »A Journey into the Warpage Containment of Semiconductor Wafers through FEA Simulations« Vincenzo Vinciguerra STMicroelectronics, IT »Digital Twin Methodology Applied to Power Cycling« Martin NiessnerInfineon Technologies AG, DE |
S17: Multi-Physics Modeling of High-frequency Devices Location: Eem + Lek Chair: Sjoerd Douwe Medard de Jong Chair: Sung-Uk Zhang |
| 11:15am - 11:25am |
Break |
Break |
| 11:25am - 12:25pm |
S18: Fracture Mechanics & Interface Strength Location: Vecht 1 + Vecht 3 Chair: Julia Zündel Chair: Marius Dijk, van |
S19: Simulation and Characterization of MEMS Location: Eem + Lek Chair: Aleksandr Morozov Chair: Tamara Bechtold |
| 12:25pm - 1:25pm |
Lunch |
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| 1:25pm - 2:45pm |
S20: Solder Fatigue Simulations and Predictions Location: Vecht 1 + Vecht 3 Chair: Pradeep Lall Chair: Karsten Meier |
S21: Advanced Modeling Techniques for Multi-Physics Systems Location: Eem + Lek Chair: David Walther Chair: Xiao Hu |
| 2:45pm - 2:55pm |
Closing: Awards and Closing Location: Vecht 1 + Vecht 3 Chair: Willem Van Driel Chair: Michiel van Soestbergen |
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