A list of all persons who contribute to the sessions of this conference. Please select a letter below to list all persons with the corresponding last name. Select the presentation in the right-hand column to access session and presentation details.
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| Author(s) | Organization(s) | Session |
| Abdalla, Omer Mohamed Osman | Department of Civil and Environmental Engineering, Politecnico di Milano, 20133 Milan, Italy | Reduced Order Modeling for Multi-Physics Presenter |
| Abdul Kareem, Razia Sultana | University of Greenwich , Park Row, Greenwich, London SE10 9LS, UK | Solder Joint Reliability |
| Abo Ras, Mohamad | Berliner Nanotest und Design GmbH, Germany | Interactive Poster Session |
| Adolfsson, Erik | Rise Research Institutes of Sweden, Sweden | Thermal Modelling and Experimental Characterisation |
| Ahmed, Waleed | UAE University, United Arab Emirates | Interactive Poster Session Presenter |
| Akbari, Saeed | Rise Research Institutes of Sweden, Sweden | Thermal Modelling and Experimental Characterisation Presenter |
| Al-Hosseni, Ausam | Infineon Technologies AG, Neubiberg, Germany | Solder Fatigue Simulations and Predictions |
| Albrecht, Jan | Fraunhofer ENAS, Technologie-Campu 3, 09126 Chemnitz, Germany; Technische Universität Chemnitz, Reichenhainer Straße 70, 09126 Chemnitz, Germany; Fraunhofer ENAS, Micro Materials Center, Chemnitz, Germany | Reliablity of Power Electronics Solder Interconnect Fatigue |
| Alhefeiti, Hour | UAE University, United Arab Emirates | Interactive Poster Session |
| Amirpour, Sepideh | Chalmers University of Technology | Thermal Modelling and Experimental Characterisation |
| Andersson, Dag | RISE, Sweden; Rise Research Institutes of Sweden, Sweden | Interactive Poster Session Thermal Modelling and Experimental Characterisation |
| Angélique, Rascle | CEA, France | Multi-Physics Modeling of High-frequency Devices |
| Antonietti, Paola | MOX, Dipartimento di Matematica, Politecnico di Milano, Piazza Leonardo da Vinci, 20133 Milano, Italy. | Reduced Order Modeling for Multi-Physics |
| Antretter, Thomas | Montanuniversität Leoben, Institute of Mechanics, Leoben, Austria | PCB and Substrate Reliability |
| Ao, Shuai | Shaanxi Deyuan Fugu Energy Co., Ltd. Sandaogou Coal Mine, Shannxi 719407, China | Interactive Poster Session |
| Appello, Davide | Technoprobe, Italy; Technoprobe, Cernusco Lombardone, Italy | Interactive Poster Session Interactive Poster Session |
| Aprea, E. | Department of Microelectronics, Delft University of Technology, Delft, Netherlands | Advanced Modeling Techniques for Multi-Physics Systems |
| Arafat, M. M. | Dynex Semiconductor Ltd, United Kingdom | Sinter Materials for Power Electronics Presenter |
| Ardeleanu, Stefan | Technical University of Cluj-Napoca, Romania | Interactive Poster Session Presenter |
| Arnold, Jörg | TU Chemnitz, Germany | Interactive Poster Session |
| Aude, Lefevre | CEA, France | Multi-Physics Modeling of High-frequency Devices |