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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Session Overview

Session

S4: Solder Interconnect Fatigue

Time:

Monday, 07/Apr/2025:

2:50pm - 3:50pm

Session Chair: Steffen Wiese
Session Chair: Meiying Su

Location: Vecht 1 + Vecht 3

Presentations

2:50pm - 3:10pm

Analyses of Materials Behaviour and Solder Fatigue Test and Prediction Results for Long-Term Thermal Cycling

Rainer Dudek¹, Susana Richter-Trummer¹, Kerstin Kreyßig¹, Matthias Prinz¹, Jan Albrecht¹, Sven Rzepka.¹, Peter Fruehauf², Andreas Weigert³

¹Fraunhofer ENAS, Micro Materials Center, Chemnitz, Germany; ²Siemens AG, Foundational Technologies, Berlin, Germany; ³Siemens AG, Digital Industries, Amberg, Germany

3:10pm - 3:30pm

Microstructurally Induced Evolution of Inelastic Work Density in SAC Solder Joints During Thermal Cycling

Aniket Bharamgonda¹, Abhijit Dasgupta¹, Yaxiong Chen²

¹University of Maryland, United States of America; ²NXP Semiconductors

3:30pm - 3:50pm

Damage Life-Prediction Model for Doped Lead-Free SnAgCu Solder Electronic Assemblies Under High Strain Rate Vibration after Prolonged Storage

Pradeep Lall, Vishal Mehta

Auburn University, United States of America