Conference Agenda

Meshless Simulation with the Material Point Method: A Micropump for Nerve Injury Treatment

S.D.M. de Jong¹, E. Aprea¹, C.M. Boutry¹, W.D. van Driel^1,2

¹Department of Microelectronics, Delft University of Technology, Delft, Netherlands; ²Signify, Eindhoven, Netherlands

TCAD Simulation of Radiation Effects on 180 nm Logic Inverters

Eike Trumann¹, Amen Allah Bahri², Gia Bao Thieu¹, Kirsten Weide-Zaage², Dorian von Wolff³, Andre Bausen³, Alexander Müller³, Guillermo Payá-Vayá¹

¹Technische Universität Braunschweig, Braunschweig, Germany; ²Leibniz Universität Hannover, Hannover, Germany; ³Bundeswehr Research Institute for Protective Technologies and CBRN Protection (WIS), Munster, Germany

Multi-Scale Electrothermal Co-Simulation of GaN HEMTs at the Device and Packaging Levels

Yi Zhang¹, Ziyue Zhang², Yuchao Wu², Zhiying Chen², Dong Lu³, Ke Xue³, Renjie Wang²

¹Smart Manufacturing Thrust of the Hong Kong University of Science and Technology (Guangzhou), China; ²Microelectronics Thrust of the Hong Kong University of Science and Technology (Guangzhou), China; ³College of Future Technology of the Hong Kong University of Science and Technology (Guangzhou), China

Modeling and Characterization of Concentric Coplanar Transformers on Printed Circuit Boards

Ozberk Ozturk¹, Najeh Zeidi², Fares Tounsi², Denis Flandre², Murat Kaya Yapici^1,3

¹Faculty of Engineering and Natural Sciences, Sabanci University, Türkiye; ²ICTEAM Institute, Université catholique de Louvain, Belgium; ³Department of Electrical and Computer Engineering, University of Washington, USA