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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Session Overview

Session

S20: Solder Fatigue Simulations and Predictions

Time:

Wednesday, 09/Apr/2025:

1:25pm - 2:45pm

Session Chair: Pradeep Lall
Session Chair: Karsten Meier

Location: Vecht 1 + Vecht 3

Presentations

1:25pm - 1:45pm

Development and Evaluation of Global-Local Finite Element Models for Solder Joint Reliability under Combined Vibration and Thermal Loads

Chengzhe Lyu, Karsten Meier, Karlheinz Bock

Institute of Electronic Packaging Technology, Technische Universität Dresden, Dresden, Germany

1:45pm - 2:05pm

Impact of IP Block Placement on Solder Joint Reliability in IC Packages

Muhammad Musadiq¹, Willem Van Driel¹, Romuald Roucou², Rene Rongen², GuoQi Zhang¹

¹Delft University of Technology (TU Delft), Netherlands, The; ²NXP Semiconductors, Netherlands

2:05pm - 2:25pm

Mechanical Stresses induced by thermal Gradients during Reflow Soldering in Repair and Resuse of Multilayer Ceramic Capacitors (MLCC): Experiments and Simulation

Steffen Wiese, Erik Wiss, Klauß Matthias, David Barth

Universität des Saarlandes, Germany

2:25pm - 2:45pm

Impact of Topside Cooling on the Solder Joint Lifetime of eWLB Packages

Martin Niessner¹, Walter Hartner², Franz-Peter Kalz², Peter Lutz², Gerhard Haubner², Bingbing Zhang¹, Ausam Al-Hosseni¹, Holger Mai³, Herbert Guettler³

¹Infineon Technologies AG, Neubiberg, Germany; ²Infineon Technologies AG, Regensburg, Germany; ³MicroConsult Engineering GmbH, Germany