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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Session Overview

Session

S7: Reliablity of Power Electronics

Time:

Monday, 07/Apr/2025:

4:15pm - 5:35pm

Session Chair: Fengze Hou
Session Chair: Robert Schwerz

Location: Eem + Lek

Presentations

4:15pm - 4:35pm

Physics-of-Failure based Lifetime Prediction for Power Electronics under Mission Profile Load Conditions

Jan Albrecht^1,2, Tobias Horn¹, Sven Rzepka^1,2, Leonhard Hertenstein³

¹Fraunhofer ENAS, Technologie-Campu 3, 09126 Chemnitz, Germany; ²Technische Universität Chemnitz, Reichenhainer Straße 70, 09126 Chemnitz, Germany; ³Mercedes-Benz AG, Hanns Klemm Str. 45, Boeblingen, Germany

4:35pm - 4:55pm

Sensitivity Analysis of Simulation-based Lifetime Extrapolation in the Low Temperature Swing Regime for Power Modules Stressed in Power Cycling Tests

Nils Zöllner, Sebastian Letz, David Übelacker, Oliver Schilling

Infineon Technologies AG, Germany

4:55pm - 5:15pm

Application of a Drucker-Prager Approach for Reliability Modelling of Inorganic Encapsulation Materials used for Power Electronic Applications

Falk Naumann, Marco Rudolph, Marcel Mittag, Michael Bernasch, Tino Stephan, Sandy Klengel

Fraunhofer Institute for Microstructure of Materials and Systems (IMWS), Germany

5:15pm - 5:35pm

Enhancing Wire Simulation Accuracy through X-ray Imaging and Deformation Analysis

Muyuan Li¹, Guan Liang Lee², Wing Yew Wong², Jason Koh², Ee Lian Jack Lee², Harald Laux¹

¹ams-OSRAM International GmbH, Germany; ²ams-OSRAM International GmbH, Malaysia