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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Session Overview

Session

S14: PCB and Substrate Reliability

Time:

Tuesday, 08/Apr/2025:

4:30pm - 5:50pm

Session Chair: Pan Liu
Session Chair: Daniel Losbichler

Location: Vecht 1 + Vecht 3

Presentations

4:30pm - 4:50pm

Determination of the Thermo-oxidative Ageing Depth and its Influence on Mechanical Properties in (Highly) Filled Polymers

Marius Dijk. van¹, Simon Kuttler¹, Marvin Jügel¹, Olaf Wittler¹, Martin Schneider-Ramelow²

¹Fraunhofer Institute for Reliability and Microintegration IZM, Germany; ²Technische Universität Berlin, Germany

4:50pm - 5:10pm

Reduced-Order Modelling for Efficient Chip-Package-Board Design

Chengdong Yuan¹, Sönke Maeter², Simon Kuttler³, Olaf Wittler³, Tamara Bechtold¹

¹Jade University of Applied Sciences, Wilhelmshaven, Germany; ²Cadfem GmbH, Munich, Germany; ³Fraunhofer IZM, Berlin, Germany

5:10pm - 5:30pm

Methodology for PTH Reliability in Printed Circuit Boards

Marco Sperti¹, Chinmay Nawghane¹, Bart Vandevelde¹, Nicolas Lammens², Mathias Verbeke^3,4

¹imec, Belgium; ²Siemens Industry Software nv, Strategy & Innovation, Leuven, Belgium; ³Department of Computer Science, KU Leuven, Belgium; ⁴Flanders Make@KU Leuven, Belgium

5:30pm - 5:50pm

Single Microvia Analysis at Different Locations in the Printed Circuit Board to Understand its Placement Effect

Vikram Gourishankar Kamble^1,3, Julia Zuendel¹, Markus Weninger¹, Thomas Krivec¹, Thomas Antretter³, Peter Fillip Fuchs²

¹Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, Austria; ²Polymer Competence Center Leoben GmbH, Leoben, Austria; ³Montanuniversität Leoben, Institute of Mechanics, Leoben, Austria