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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Session Overview

Session

S8: Solder Joint Reliability

Time:

Tuesday, 08/Apr/2025:

10:55am - 12:15pm

Session Chair: Rainer Dudek
Session Chair: Abhijit Dasgupta

Location: Vecht 1 + Vecht 3

Presentations

10:55am - 11:15am

Enhanced Analytical Fatigue Model for SAC305 Solder Joints Subjected to Temperature Cycles Considering Geometrical Parameters

Jean-Baptiste Libot, Philippe Milesi

Hooke Electronics, France

11:15am - 11:35am

Elastic-plastic-creep Model with Damage for SAC Solder Alloys

Torsten Hauck¹, Aleksandr Morozov¹, Yaxiong Chen², Luca Renzi³, Wolfgang H. Müller¹

¹Technical University of Berlin, Germany; ²NXP Semiconductors, Munich, Germany; ³Polytechnic University of Milan, Italy

11:35am - 11:55am

Nonlinear Superelement for the Reliability Assessment of Visco-Plastic Solderballs

Mike Feuchter¹, Hanna Baumgartl¹, Martin Hanke¹, Sven Rzepka²

¹CADFEM Germany GmbH, Germany; ²Fraunhofer Institute for Electronic Nano Systems ENAS

11:55am - 12:15pm

Modelling the Impact of SAC305 Crystal Orientation on Thermo-Mechanical Damage of Solder Interconnects

Muhammad Umair Najeem, Razia Sultana Abdul Kareem, Stoyan Stoyanov

University of Greenwich , Park Row, Greenwich, London SE10 9LS, UK