Conference Agenda

Integration of Moldflow, Abaqus and Python to Analyze Process- related Residual Stresses in Medical PCB Encapsulations

Thomas Hollinger, Venu Prakash Kasinikota, Peter Fuchs, Margit Lang

Polymer Competence Center Leoben GmbH, Austria

Examination and simulation of a high-cycle fatigue tester for accelerated stress testing with simplified cantilever specimens for fracture-mechanical interface characterization

David Walther¹, Arash Mohammadi¹, Jörg Arnold¹, Bernhard Wunderle^1,2

¹TU Chemnitz, Germany; ²Fraunhofer ENAS

Thermomechanical Reliability of Bond Wires in Power Modules Subjected to Power Cycling

Mohamed Boutaleb, Fabrice Roqueta, Fabrice Moreau, Yann Brenet, Laurent Barreau

STMicroelectronics, France

Thermal Cyclic Fatigue Reliability of Printed Hybrid Electronics (PHE)

Prabhat Janamanchi¹, Swarup Subudhi¹, Abhijit Dasgupta¹, Edwin Quinn²

¹University of Maryland, College Park, MD, USA; ²Laboratory for Physical Sciences, College Park, MD, USA

Finite Element Analysis of Warpage Hysteresis Loop Evolution and Bifurcation in Thinned 4H-SiC Cu_ECD Metalized Wafers

Vincenzo Vinciguerra, Giuseppe Luigi Malgioglio, Marco Renna

Quality, Manufacturing and Technology (QMT) – Power & Discrete Technologies R&D Department

Digital Twin-Assisted Optimal Sensor Placement for Real-Time Monitoring of Probe Cards in EWS Applications

Mehdi Bejani^1,2, Davide Appello², Marco Mauri², Elia Missaglia², Stefano Mariani¹

¹Politecnico di Milano, Italy; ²Technoprobe, Italy

Residual Stresses Extraction from Initial Deformation of Multi-layered Micro-cantilever

Binh Nguyen, Maja Zunic, Pieter Gijsenbergh, Guilherme Torri, Veronique Rochus

imec, Belgium

Modelling of crack propagation in semiconductor package materials by Digital Image Correlation & Finite Element Methods

Brinda George¹, Georg Michael Reuther¹, Ingolf Rau¹, Bernhard Wunderle²

¹Infineon Technologies AG, Am Campeon 1-15, 85579 Neubiberg, Germany; ²Technical University of Chemnitz, Faculty of Electrical Engineering and IT, Reichenhainer Str. 70, 09126 Chemnitz, Germany

Numerical Optimization of the Interfacial Crack Tip Position in Delaminated Bi-Material Beams Evaluated with the Advanced Mixed-Mode Bending Fracture Test

Marcus Schulz^1,2, Mohamad Abo Ras¹, Bernhard Wunderle²

¹Berliner Nanotest und Design GmbH, Germany; ²Dept. Materials & Reliability of Microsystems, Chemnitz University of Technology, Germany

Advancing Vertical GaN Technology: A Comparative Study of GaN Layers on Foreign and Native Substrates

Verena Leitgeb¹, Barbara Kosednar-Legenstein¹, Frank Brunner², Eldad Bahat-Treidel², Lisa Mitterhuber¹, Elke Kraker¹

¹Materials Center Leoben Forschung GmbH, Austria; ²Ferdinand-Braun-Institut gGmbH, Berlin, Germany

Determination of Biaxial Bending Strength of Thin Silicon Die in the Ring-on-Ring Test

Ming-Yi Tsai

Chang Gung University, Taiwan

Study on the Applicability of Multi-Point Constraints for 3D WLP Finite Element Model

Min-Yi Chan, Kuo-Ning Chiang

National Tsing Hua University, Taiwan

Numerical Analysis of the Effect of Coplanarity of Cu Bumps on Flip-Chip Bonding for Chip-on-Flex

Seonho Seok

C2N-UPSACLAY, France

Integrating Cluster Analysis and Artificial Neural Networks to Predict Warpage in Fan-Out Panel-Level Packaging

Ming Ching Huang¹, Hsien-Chie Cheng², Kuo-Ning Chiang¹

¹National Tsing Hua University, Taiwan; ²Feng Chia University, Taiwan

Verification of Material Models of an Epoxy Mold Compound used in Power Module

Akshay Vivek Panchwagh¹, Przemyslaw Jakub Gromala¹, Sven Rzepka², Bernhard Wunderle³

¹Robert Bosch GmbH; ²Fraunhofer ENAS; ³Technische Universität Chemnitz

A Study on the Board-level Thermomechanical Reliability of Flip-Chip Chip Scale Package (FCCSP)

Yi Zhang¹, Ke Xue², Dong Lu², Kai Chen³, Wenzhe Zhao³, Xi Zeng⁴, Richeng Liu³, Dashun Liu³

¹Smart Manufacturing Thrust of the Hong Kong University of Science and Technology (Guangzhou), China; ²College of Future Technology of the Hong Kong University of Science and Technology (Guangzhou), China; ³Guangzhou HKUST Fok Ying Tung Research Institute, China; ⁴Guangzhou OED Technologies Inc., China

Finite Element Analysis of the Mechanical Influence of a Frictionless Contact in a Simulated Ball-on-Ring System

Vincenzo Vinciguerra, Giuseppe Luigi Malgioglio, Antonio Landi, Marco Renna

STMicroelectronics (Italy), Quality, Manufacturing and Technology (QMT) – Power & Discrete Technologies R&D Department

Rheological Modeling and Experimental Validation of Receiving layer for Micro-LED Laser Mass Transfer

Zehou Li^1,2, Liangzheng Ji², Xin Wang², Jun Wang¹, Jing Zhang², Fenglian Sun¹, Yang Liu¹

¹School of Material Science and Chemical Engineering, Harbin University of Science and Technology; ²Heraeus Electronics Technology, Heraeus Materials Technology Shanghai

Microvia Homogenised Behavior for the Mechanical Modelling of PCB with Embedded Components

Flora Dailland¹, Gautier Girard¹, Mounira Bouarroudj², Marion Martiny¹, Sébastien Mercier¹

¹Université de Lorraine – CNRS – Arts et Métiers ParisTech, Metz, France.; ²Université Paris Est Créteil, Paris-Saclay Univ., Gif-Sur-Yvette, France

3D Fine Electrothermal Modelling of IGBT Power Device for Reliability Applications

Augustin Empeyrou, Merouane Ouhab, Nicolas Degrenne

Mitsubishi Electric R&D Centre Europe, France

Modeling of 6T-SRAM Transistor Failure and Faults Caused by Injected Noise in Neural Networks

li zhiyuan¹, sun bo¹, xie xiaoyan¹, sun yue²

¹GDUT, China, People's Republic of; ²Xiaomi Corporation

Analytical Calculation of Core Loss and Magnetic Flux Density in E-Cores

Kevin Talits^1,2, Claas Tebruegge¹, Martin Pfost²

¹HELLA GmbH & Co. KGaA, Germany; ²Chair of Energy Conversion, TU Dortmund, University, Dortmund, Germany

Investigating Mechanical Characterization and Failure Analysis of 3D-Printed Multilayer Composite Beams by Experimental Testing and FE Modeling

Waleed Ahmed, Hour Alhefeiti, Amged Elhassan, Khalifa Harib

UAE University, United Arab Emirates

Bond-wire Layout Optimization in Power-modules Through Simulation of Electro-thermo-mechanical Migration Flux under Power Cycling

Georg Siroky, Slavo Kicin, Lluis Santolaria, Milad Maleki

Hitachi Energy Ltd, Switzerland

Magnetic Field Calculation with Generative AI

Kevin Talits¹, Jan Shames², Claas Tebruegge², Martin Pfost¹

¹Chair of Energy Conversion, TU Dortmund, University, Dortmund, Germany; ²Research Institute for Automotive Electronics (E-LAB), HELLA GmbH & Co. KGaA, Lippstadt, Germany

Thermal Effects in Surface Acoustic Wave Devices Induced by Damping

George Boldeiu¹, Alexandra Nicoloiu¹, Arash Mohammadi², Claudia Nastase¹, Monica Nedelcu¹, Ioana Zdru¹, Dan Vasilache¹, Adrian Dinescu¹, Bernhard Wunderle^2,3, Alexandru Muller¹

¹IMT Bucharest, Romania; ²Chemnitz University of Technology, Germany; ³Fraunhofer ENAS, Chemnitz, Germany

Optimizing Semantic Search in Industrial Knowledge Retrieval: A Novel SHAP-Based Attention Mask Modification Approach

Felix Mahr¹, Gerhard Freese³, Sven Meier¹, Christina Kratsch³, Christoph Raum², Nils Thielen¹, Jörg Franke¹, Florian Risch¹

¹Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU), Germany; ²Siemens AG, Amberg, Germany; ³Hochschule für Technik und Wirtschaft Berlin, Germany

Modeling of FE Parasitic inductance in BCD Power Switches

Stefan Ardeleanu¹, Ioan Marius Purcar¹, Cristian Boianceanu²

¹Technical University of Cluj-Napoca, Romania; ²Infineon Technologies Romania

Usage of Reactive Joining Methods on LTCC Substrates: Experiments and Simulation

Erik Wiss¹, Nesrine Jaziri², Jens Müller², Steffen Wiese¹

¹Universität des Saarlandes, Germany; ²Technische Universität Ilmenau, Germany

Research on Rapid Thermal Design Tool for Chiplet Packaging

Jie Zhang^1,2, Chuan Chen^1,2, Rong Fu^1,2, Meiying Su^1,2, Fengze Hou^1,2

¹Institute of Microelectronics of the Chinese Academy of Sciences, China, People's Republic of; ²Key Laboratory of Fabrication Technologies for Integrated Circuits, Chinese Academy of Sciences

Thermal Analysis and Electromigration Behaviour in BGA Packages: Investigating the Impact of Electric Current and Resultant Joule Heating on Temperature Distribution

Chinmay Nawghane¹, Riet Labie¹, Wolfgang Sauter², Eric Tremble², Richard Graf²

¹Imec, Leuven, Belgium; ²Marvell, Burlington, VT, USA

Die Attach Failure Modes Analysis and Thermal Warpage Simulation of MicroSD Card COB Packaging

Weiyi Zhang¹, Guangjun Lu¹, Rushen Wei²

¹Guangxi Normal University, China, People's Republic of; ²Guangxi Kelin Semiconductor Co., Ltd

Heat Sink Effects in Power Module Design: Multiphysics Simulation with Multiple Heat Sources

Zihan Zhang¹, Qiulin Yu³, Bart Vandevelde², Willem D. van Driel¹, René Poelma¹

¹TU Delft, Netherlands; ²Interuniversity Microelectronics Centre (IMEC), Belgium; ³Polymer Competence Center Leoben

Physics Informed Neural Network (PINN) to Predict Probe Card Key Performance Indicators and Physics of Degradation in Microelectronics

Shehryar Imtiaz¹, Davide Appello², Marco Mauri², Elia Missaglia², Stefano Mariani¹

¹Politecnico di Milano, Italy; ²Technoprobe, Cernusco Lombardone, Italy

Modeling and Simulation of Directed Graph-based DEVS System

Shuai Ao¹, Wei Hu¹, Shengjie Wang², Bo Li¹, Chenglong Yin¹, Xiaowei Liu¹, Junfan Zhang³, Xiao Song³

¹Shaanxi Deyuan Fugu Energy Co., Ltd. Sandaogou Coal Mine, Shannxi 719407, China; ²Guoneng Digital Intelligence Technology Development Co., Ltd., Beijing 100144, China; ³School of Cyber Science and Technology, Beihang University, Beijing 100191, China

Fingerprints - Active Monitoring of Degradation and Remaining Useful Life in the Field

Mattias P. Eng, Klas Brinkfeldt, Leo Svenningsson, Andreas Lövberg, Dag Andersson

RISE, Sweden

Design of Single-Port Surface Acoustic Wave (SAW) Resonator on GaN Wafer as Stress Tester System for Micro and Nano Structures

Arash Mohammadi¹, George Boldeiu², Dan Vasilache², Afshin Ziaei³, Bernhard Wunderle^1,4

¹TU Chemnitz (TU Chemnitz, 09107 Chemnitz), Germany; ²National Institute for Research and Development in Microtechnologies (IMT), Bucharest, Romania; ³Thales Research & Technology France, 1, avenue Augustin Fresnel, Campus de Polytechnique, F-91767 Palaiseau cedex, FRANCE; ⁴Fraunhofer ENAS, Chemnitz, Germany

Fatigue Delamination Study of Parylene as Electronic Packaging Material

Carlos Rincon-Ruiz¹, Uwe Zschenderlein¹, Martin Kuehn², Franz Selbmann², Bernhard Wunderle¹

¹University of Technology Chemnitz, Professorship Materials and Reliability of Microsystems; ²Fraunhofer Institute for Electronic Nano Systems

Substrate-Embedded SiC MOSFET Die Attach: A Molecular Dynamics Study on Physical Properties of Sintered Cu

Zhanxing Sun^1,2, Fengze Hou^1,2, Meiying Su^1,2, Xiangan You^1,2, Chuan Chen^1,2, Rong Fu^1,2, Jianyu Feng^1,2, Qidong Wang^1,2

¹State Key Laboratory of Fabrication Technologies for Integrated Circuits; ²Institute of Microelectronics of the Chinese Academy of Sciences

Optimizing Electronics for Reliability and Efficiency

Bertrand Monnier

Noesis Solutions, Belgium