26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Session

S15: Sinter Materials for Power Electronics

Time:

Tuesday, 08/Apr/2025:

4:30pm - 5:50pm

Session Chair: Muyuan Li
Session Chair: Tobias Daniel Horn

Location: Eem + Lek

Presentations

4:30pm - 4:50pm

Length-scale Dependence of Viscoplastic Properties of Silver Sinter Revealed by Indentation Testing and Modeling

David Leslie, Abhijit Dasgupta

University of Maryland, United States of America

4:50pm - 5:10pm

Process Development of TLPS Joint and Their Mechanical, Thermal and Power Cycling Reliability

M. M. Arafat, Xiang Li, Thomas Grant, Muhammad Morshed

Dynex Semiconductor Ltd, United Kingdom

5:10pm - 5:30pm

Finite Element Analysis and Experimental Investigation of Die-attach Fillet Influence on the Reliability of Epoxy-Based Pressure-Less Sintered Silver Joints

Xinyue Wang¹, Haixue Chen¹, Zhoudong Yang¹, Jing Zhang², Guoqi Zhang³, Pan Liu¹

¹Academy for Engineering & Technology, Fudan University, Shanghai 200433, China; ²Heraeus Materials Technology Shanghai Ltd., Shanghai 201108, China; ³Electronic Components, Technology, and Materials, Delft University of Technology, Delft 2628 CD, The Netherlands

5:30pm - 5:50pm

Simulating the Co-Evolution of Porous Microstructures and Grain Growth in Sintered Ag Die Attach Layers

Xiao Hu^1,2, Jianlin Huang², René Poelma³, Hans van Rijckevorsel², Willem D. van Driel¹, Guoqi Zhang¹

¹Delft University of Technology, Department of Microelectronics The Netherlands; ²Ampleon B.V.; ³Nexperia

Conference Agenda